AMD XC6SLX75-L1FGG484I

Overview

XC6SLX75-L1FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 Mb of block RAM, 220 DSP48E1 slices, and operates at -1 speed grade with industrial temperature range (–40°C to +100°C). It is packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial motor control and embedded vision systems requiring deterministic latency and low power.

For engineers reviewing the XC6SLX75-L1FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS support, SelectIO™ DC and AC characteristics, and compatibility with Xilinx ISE Design Suite v14.7 for synthesis and place-and-route.

Technical Context

The XC6SLX75-L1FGG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates clock management tiles containing DCMs (Digital Clock Managers) and PLLs for internal clock synthesis and jitter reduction.

I/O banks support multiple standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling such as LVDS and TMDS, with programmable drive strength, slew rate, and on-chip termination. Configuration is performed via SPI, BPI, or JTAG interfaces using external PROM or processor-controlled loading.

Key Specifications

Pinout & Package

Package: 484-pin Fine-Pitch Ball Grid Array (FBGA), 23×23 mm, 1.0 mm ball pitch, RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based control and interface applications.

Compared with XC6SLX75-2FGG484C, the XC6SLX75-L1FGG484I trades 12% timing margin for guaranteed operation at 100°C; versus XC7A75T-2CSG324I, it retains ISE toolchain compatibility and lower static power but lacks transceivers and advanced memory interfaces.

Availability

XC6SLX75-L1FGG484I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision processing, and programmable logic controller (PLC) applications requiring stable component supply and long-term lifecycle support.

Supply support for XC6SLX75-L1FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families.

The Spartan-6 family, including XC6SLX75-L1FGG484I, was designed for cost-sensitive, high-volume applications demanding low power, small footprint, and reliable I/O interfacing in industrial and automotive subsystems.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX75-L1FGG484I?

The XC6SLX75-L1FGG484I supports I/O voltages from 1.2 V to 3.3 V per bank, with VCCO independently configured per I/O bank. LVDS and TMDS differential standards operate at 2.5 V VCCO, while LVCMOS33 and LVTTL require 3.3 V. Each bank's VCCO must match the selected I/O standard's required voltage level to ensure signal integrity and compliance.

Does XC6SLX75-L1FGG484I support JTAG boundary-scan testing?

Yes, XC6SLX75-L1FGG484I fully supports IEEE 1149.1 JTAG boundary-scan with TAP controller, instruction register, and boundary-scan cell architecture. The TDI, TDO, TCK, TMS, and TRTS pins are dedicated for this function, enabling board-level interconnect testing and in-system programming without requiring additional test fixtures.

Can XC6SLX75-L1FGG484I be configured using an external microcontroller?

Yes, XC6SLX75-L1FGG484I supports processor-controlled configuration via its Slave SelectMAP or Slave Serial modes. An external microcontroller can write the configuration bitstream to the FPGA through parallel or serial GPIOs, enabling dynamic reconfiguration and field updates without external PROM devices.

What is the configuration memory size required for XC6SLX75-L1FGG484I?

The uncompressed configuration bitstream for XC6SLX75-L1FGG484I is approximately 8.2 MB. When compressed using Xilinx BitGen tools, typical size reduces to ~2.1 MB. External SPI flash must provide at least 16 Mbit capacity for single-image storage, or 32 Mbit for multi-boot applications with fallback support.

Is XC6SLX75-L1FGG484I pin-compatible with other Spartan-6 devices in the FG484 package?

No, XC6SLX75-L1FGG484I is not fully pin-compatible with other Spartan-6 devices in the FG484 package. While mechanical footprint and ball map are identical, I/O bank assignments, VCCO/VREF placements, and dedicated pin functions (e.g., clock inputs, configuration pins) differ between density grades and speed grades, requiring PCB redesign for substitution.