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AMD XC6SLX75-N3CSG484C
- Part No.:
- XC6SLX75-N3CSG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, CSPBGA
- Datasheet:
-
XC6SLX75-N3CSG484C.pdf
- Description:
- IC FPGA 328 I/O 484CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,218
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Product details
Overview
XC6SLX75-N3CSG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.2 Mb of block RAM, and 220 I/O pins in a 484-pin CSBGA package. It supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards and targets cost-sensitive embedded control and industrial interface applications.
For engineers reviewing the XC6SLX75-N3CSG484C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, embedded memory capacity, and commercial-grade temperature range operation.
Technical Context
The XC6SLX75-N3CSG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated DSP48A1 slices for arithmetic operations and clock management via DCM and PLL blocks. It supports multi-gigabit transceivers only in higher-density LX150/LX160 variants-not in this LX75 device.
Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled loading. The device includes internal configuration monitoring and CRC error detection but lacks built-in security features like bitstream encryption found in later 7-series FPGAs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 3.2 Mb - supports FIFOs, buffers, and small lookup tables without external memory |
| I/O Pins | 220 - usable user-defined bidirectional signal interfaces with programmable drive strength |
| Package | 484-pin CSBGA (19×19 mm, 1.0 mm pitch) - surface-mount, thermally enhanced, RoHS-compliant |
| Operating Temp | 0°C to +85°C - commercial grade, suitable for non-automotive indoor industrial environments |
| Supply Voltages | VCCINT = 1.2 V, VCCAUX = 3.3 V, VCCO = 1.2–3.3 V - enables mixed-voltage I/O bank operation |
Pinout & Package
XC6SLX75-N3CSG484C is housed in a 484-pin Fine-Pitch Chip Scale Ball Grid Array (CSBGA) package with 19×19 ball array, 1.0 mm pitch, and thermal pad exposed on underside for PCB heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | Core logic supply (1.2 V); must be locally decoupled with low-ESR capacitors |
| A2 | VCCAUX | Auxiliary supply (3.3 V) for configuration circuitry and select I/O banks |
| P1 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reload |
| R2 | INIT_B | Open-drain status output indicating configuration completion or error condition |
| T3 | CCLK | Configuration clock input for Master SPI mode; driven by FPGA or external source |
| Y1 | DONE | Open-drain output signaling successful configuration and enabling I/O release |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two DCMs and one PLL per device-enables precise clock synthesis, phase alignment, and frequency multiplication without external ICs |
| SelectIO Technology | Per-bank voltage support (1.2–3.3 V) and 18 I/O standards-allows direct interfacing to legacy and modern peripherals without level shifters |
| Embedded Memory | 3.2 Mb distributed across 228 block RAMs-supports dual-port access and true dual-port mode for data buffering and state storage |
| Configurable Logic | 74,880 6-LUT + FF pairs-provides scalable digital logic implementation for protocol engines, glue logic, and real-time control |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Modular programmable logic controller with fieldbus connectivity and analog/digital I/O expansion. IC Role / Device Role / Timing Role: FPGA acts as real-time deterministic logic engine managing sensor inputs, actuator outputs, and fieldbus protocol stacks (e.g., PROFIBUS, Modbus TCP). Use Value: 220 I/O pins enable direct connection to multiple isolated I/O channels; 3.2 Mb block RAM stores protocol state machines and buffer data streams. | Use Scenario: Conversion between parallel CMOS image sensor output and MIPI CSI-2 serial interface for embedded vision systems. IC Role / Device Role / Timing Role: Protocol translation and timing adaptation unit synchronizing pixel clocks, packing/unpacking data, and handling lane management. Use Value: Configurable SelectIO supports both 1.8 V sensor I/O and 1.2 V MIPI-compatible voltage levels; logic cells implement pixel reordering and packet framing. |
| Medical Diagnostic Equipment Control | Test & Measurement Signal Generator |
Use Scenario: Front-end control board in ultrasound or patient monitoring devices requiring deterministic timing and safety-critical response. IC Role / Device Role / Timing Role: Central sequencer coordinating ADC sampling, display refresh, button polling, and alarm generation with sub-microsecond latency guarantees. Use Value: DCM/PLL resources provide jitter-controlled clocks for ADC sampling and display timing; 74,880 logic cells accommodate redundant safety logic and UI state machines. | Use Scenario: Arbitrary waveform generator with programmable pattern memory, DAC interface, and trigger synchronization. IC Role / Device Role / Timing Role: Digital pattern sequencer generating precise timing waveforms, managing memory readout, and controlling DAC update rate. Use Value: Block RAM stores waveform samples; logic cells implement address counters and interpolation logic; I/O flexibility supports TTL/CMOS trigger inputs and DAC reference signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX75-3FGG484C | Same logic density and I/O count, but -3 speed grade (vs. -N3); higher static power and lower max clock frequency | Suitable for less timing-critical designs where cost is prioritized over performance margin | Select XC6SLX75-N3CSG484C when guaranteed setup/hold timing closure at 500 MHz system clock is required |
| XC6SLX9-2TQG144C | Fewer logic cells (5,720), smaller 144-pin TQFP package, no CSBGA thermal pad | Targeted at low-complexity control tasks with limited I/O and memory needs | Choose XC6SLX75-N3CSG484C when >70K logic cells, >200 I/O, or >3 Mb embedded RAM are mandatory |
Compared with XC6SLX75-3FGG484C and XC6SLX9-2TQG144C, the XC6SLX75-N3CSG484C delivers higher timing margin for complex synchronous logic, greater I/O routing flexibility in dense PCB layouts, and larger on-chip memory for buffering high-throughput data streams-making it optimal for mid-range industrial and medical edge controllers.
Availability
XC6SLX75-N3CSG484C is available at Aetrix Electronics and suitable for industrial PLC modules, medical diagnostic front-ends, video interface bridges, and test equipment requiring stable component supply and long-term manufacturability.
Supply support for XC6SLX75-N3CSG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-6 family-including XC6SLX75-N3CSG484C-was designed for cost-optimized, high-volume embedded applications demanding reliable logic density, flexible I/O, and low-power operation without advanced transceiver or processing subsystems.
FAQ
What is the maximum operating frequency supported by XC6SLX75-N3CSG484C?
The XC6SLX75-N3CSG484C is rated for a -3 speed grade, supporting a maximum system clock frequency of 500 MHz under typical conditions. This value is verified through static timing analysis using Xilinx ISE 14.7 tools and applies to internal logic paths meeting setup/hold constraints. Actual achievable frequency depends on design complexity, placement, and routing. The XC6SLX75-N3CSG484C does not include multi-gigabit transceivers, so serial link speeds are not applicable.
Does XC6SLX75-N3CSG484C support JTAG boundary-scan testing?
Yes, XC6SLX75-N3CSG484C fully supports IEEE 1149.1 JTAG boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The JTAG interface enables programming, debugging, and interconnect testing during PCB assembly and system validation. Configuration through JTAG is supported alongside Master SPI and Slave Serial modes. The XC6SLX75-N3CSG484C implements full TAP controller compliance and supports IDCODE, BYPASS, SAMPLE/PRELOAD, and EXTEST instructions.
Can XC6SLX75-N3CSG484C be used in automotive applications?
No, XC6SLX75-N3CSG484C is specified for commercial temperature range (0°C to +85°C) and is not qualified to AEC-Q100 or ISO/TS 16949 standards. It lacks automotive-grade screening, extended temperature support, and fault-tolerant configuration features required for automotive ECUs. For automotive use, designers should consider Xilinx Automotive Spartan-6 Q-grade variants (e.g., XC6SLX75-3FGG484I) or newer AMD Versal ACAP automotive derivatives. The XC6SLX75-N3CSG484C remains appropriate for industrial and medical equipment operating in controlled environments.
What configuration memory options are compatible with XC6SLX75-N3CSG484C?
XC6SLX75-N3CSG484C supports configuration from industry-standard SPI serial flash PROMs (e.g., Micron MT25QL, Spansion S25FL), parallel NOR flash, or host processor-controlled loading via Slave Parallel or Slave Serial modes. Xilinx recommends using 32-Mbit or larger SPI flash for full bitstream storage. The XC6SLX75-N3CSG484C does not integrate on-die configuration memory and requires external nonvolatile storage. Configuration bitstream compression reduces load time and flash footprint by up to 40%.
Is XC6SLX75-N3CSG484C pin-compatible with other Spartan-6 devices in the same package?
No, XC6SLX75-N3CSG484C is not pin-compatible with other Spartan-6 devices in the 484-pin CSBGA package, such as XC6SLX150 or XC6SLX100. While all share the same physical footprint and ball map, I/O bank assignments, voltage requirements, and dedicated function pin allocations differ significantly across densities. Migration between variants requires PCB redesign and I/O constraint updates. The XC6SLX75-N3CSG484C has unique pin assignments for its 220-user I/O count and specific DCM/PLL locations, confirmed in UG382 v1.5.
XC6SLX75-N3CSG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 328
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-CSPBGA (19x19)
XC6SLX75-N3CSG484C FAQ
1.How can I place an order for XC6SLX75-N3CSG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-N3CSG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-N3CSG484C reliable?
The price and inventory of XC6SLX75-N3CSG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-N3CSG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX75-N3CSG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-N3CSG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-N3CSG484C?
XC6SLX75-N3CSG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-N3CSG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-N3CSG484C?
For technical support, including XC6SLX75-N3CSG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-N3CSG484C requirements.
6.How does Aetrix verify that XC6SLX75-N3CSG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-N3CSG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-N3CSG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX75-N3CSG484C?
All XC6SLX75-N3CSG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-N3CSG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-N3CSG484C part is unused and in its original packaging.
Return procedure for XC6SLX75-N3CSG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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