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AMD XC6SLX75-N3FG484C

Part No.:
XC6SLX75-N3FG484C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC6SLX75-N3FG484C.pdf
Description:
IC FPGA 280 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,583

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Product details

Overview

XC6SLX75-N3FG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.2 Mb of block RAM, and 220 I/O pins in a 484-pin Fine-Pitch BGA package. It supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards and operates at -3 speed grade (1.2 V core, industrial temperature range).

For engineers reviewing the XC6SLX75-N3FG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded memory capacity, and industrial-grade thermal performance for reconfigurable digital control systems.

Technical Context

The XC6SLX75-N3FG484C implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It integrates dual-clock DDR memory controllers and supports PCI Express x1 Gen1 via RocketIO transceivers.

Configuration is performed via Master SPI, Slave SelectMAP, or JTAG; bitstream security includes AES encryption and HMAC authentication. The device uses 45 nm process technology and supports partial reconfiguration for dynamic function swapping.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells74,880 - total configurable logic resources for combinational and sequential logic implementation
Block RAM3.2 Mb - on-chip memory for FIFOs, buffers, and data tables without external memory dependency
I/O Pins220 - user-configurable bidirectional pins supporting multiple voltage standards and slew rates
Speed Grade-3 - guarantees timing closure up to 667 MHz for internal logic and 800 Mbps for differential I/O
Core Voltage1.2 V ±3% - fixed supply requirement for logic fabric and CLBs
Operating Temp-40°C to +100°C - qualified for industrial environments without derating
DSP Slices180 - hardware multipliers and accumulators for real-time filtering and math-intensive tasks

Pinout & Package

XC6SLX75-N3FG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FG484) package with 22 × 22 array, 1.0 mm pitch, and 23.0 mm × 23.0 mm body size. Thermal pad exposed on underside for enhanced heat dissipation.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank 0 power supply - sets output voltage level for associated pins (1.2–3.3 V)
P2IO_L1P_T0_0Differential pair positive input - supports LVDS, TMDS, and RSDS signaling
T1M0Mode pin - selects configuration mode (SPI/SelectMAP/JTAG) at power-up
V2CCLKConfiguration clock input - drives internal bitstream loading timing
R1INIT_BOpen-drain status output - signals configuration failure or completion
Y2GNDGround reference - required for signal integrity and thermal management

Key Features

FeatureDesign Value
Embedded DSP48A1 slicesHardware-accelerated arithmetic enables real-time FIR filtering and FFT computation without CPU overhead
Dual-data-rate (DDR) memory interfaceIntegrated controller supports 32-bit wide DDR2/DDR3 SDRAM at up to 400 MHz clock rate
AES-256 bitstream encryptionPrevents unauthorized cloning or reverse engineering of configured logic functionality
Partial reconfiguration supportAllows runtime swapping of functional modules while maintaining system operation
Multi-standard I/O banksEach of 12 I/O banks independently configurable for voltage, drive strength, and termination

Applications

Industrial Motor ControlVideo Processing Bridge

Use Scenario: Real-time closed-loop servo control with encoder feedback and PWM generation for multi-axis CNC machines.

IC Role / Device Role / Timing Role: FPGA fabric implements PID controllers, motion profiles, and safety interlocks with deterministic sub-microsecond latency.

Use Value: 74,880 logic cells enable concurrent execution of motion planning, fieldbus protocol stacks (e.g., EtherCAT), and diagnostics.

Use Scenario: Conversion between HDMI 1.4 and MIPI CSI-2 interfaces in machine vision cameras.

IC Role / Device Role / Timing Role: Reconfigurable serializer/deserializer handles pixel clock domain crossing and color space transformation.

Use Value: 220 I/O pins and LVDS-capable banks support simultaneous high-speed parallel video capture and serialized output.

Communications BasebandTest & Measurement Equipment

Use Scenario: Channelization and modulation/demodulation in LTE small-cell base stations.

IC Role / Device Role / Timing Role: DSP48A1 slices perform real-time FFTs and channel estimation; fabric manages packet buffering and MAC layer handshaking.

Use Value: 180 DSP slices deliver >1.2 GOPS at 200 MHz for physical-layer processing without external DSP.

Use Scenario: High-precision waveform generation and analysis in automated test equipment (ATE).

IC Role / Device Role / Timing Role: FPGA synchronizes DAC/ADC sampling, triggers, and pattern memory access with picosecond-level jitter control.

Use Value: Industrial temperature rating (-40°C to +100°C) ensures stable timing calibration across environmental stress testing cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX75-3FGG484ISame logic density and I/O count; -3 speed grade but industrial temp (–40°C to +100°C) and lead-free RoHS-compliant package (FGG)Identical use cases; differs only in package marking and environmental complianceSelect when RoHS compliance and Pb-free assembly are mandatory
XC6SLX150-3FGG676IHigher logic density (147,443 cells), larger 676-pin BGA, and increased block RAM (4.9 Mb)Suitable for more complex protocols (e.g., PCIe Gen2 endpoint) or multi-channel signal processing requiring >74K LUTsChoose when scalability beyond XC6SLX75-N3FG484C capacity is needed

Compared with XC6SLX75-N3FG484C, XC6SLX75-3FGG484I offers identical functionality in a RoHS-compliant variant, while XC6SLX150-3FGG676I provides headroom for expanded logic and memory-both require PCB redesign due to different packages and pinouts.

Availability

XC6SLX75-N3FG484C is available at Aetrix Electronics and suitable for industrial motor control, video bridge systems, communications baseband, and test & measurement equipment requiring stable component supply and long-term lifecycle support.

Supply support for XC6SLX75-N3FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.

The Spartan-6 family, including XC6SLX75-N3FG484C, was designed for cost-sensitive, high-volume applications requiring low-power reconfigurable logic, such as industrial automation, broadcast video, and wired communications infrastructure.

FAQ

What is the maximum operating frequency of the XC6SLX75-N3FG484C logic fabric?

The XC6SLX75-N3FG484C has a -3 speed grade, guaranteeing internal logic operation up to 667 MHz under industrial temperature conditions. This rating is verified through static timing analysis using Xilinx ISE or Vivado tools and applies to synchronous paths within the FPGA fabric, not I/O or transceiver blocks.

Does the XC6SLX75-N3FG484C support partial reconfiguration?

Yes, the XC6SLX75-N3FG484C supports partial reconfiguration through Xilinx ISE Design Suite. This allows dynamic replacement of specific logic modules while the rest of the design remains active-enabling features like protocol switching or firmware updates without system reset.

What configuration modes are supported by the XC6SLX75-N3FG484C?

The XC6SLX75-N3FG484C supports three primary configuration modes: Master SPI (internal oscillator drives serial flash), Slave SelectMAP (external processor loads bitstream via parallel bus), and JTAG (boundary-scan programming and debugging). Mode selection is controlled by M2:M0 pins at power-up.

Is the XC6SLX75-N3FG484C pin-compatible with other Spartan-6 devices?

No, the XC6SLX75-N3FG484C is not pin-compatible with other Spartan-6 devices-even those in the same FG484 package-due to differing I/O bank assignments, power pin placements, and configuration pin requirements. Each Spartan-6 variant requires its own PCB layout.

What I/O standards does the XC6SLX75-N3FG484C support?

The XC6SLX75-N3FG484C supports LVCMOS (1.2 V to 3.3 V), LVTTL, SSTL18_I/II, SSTL2_I/II, HSTL_I/III, and differential standards including LVDS, RSDS, and TMDS. Each of its 12 I/O banks can be independently powered and configured for voltage and termination.

XC6SLX75-N3FG484C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
280
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC6SLX75-N3FG484C FAQ

1.How can I place an order for XC6SLX75-N3FG484C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX75-N3FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX75-N3FG484C reliable?

The price and inventory of XC6SLX75-N3FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-N3FG484C is usually 5 days.

3.What payment methods are accepted for XC6SLX75-N3FG484C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-N3FG484C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX75-N3FG484C?

XC6SLX75-N3FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX75-N3FG484C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX75-N3FG484C?

For technical support, including XC6SLX75-N3FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-N3FG484C requirements.

6.How does Aetrix verify that XC6SLX75-N3FG484C is sourced from the original manufacturer or authorized distributors?

All XC6SLX75-N3FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-N3FG484C meets industry standards.

7.What is the process for return or replacement of XC6SLX75-N3FG484C?

All XC6SLX75-N3FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-N3FG484C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX75-N3FG484C part is unused and in its original packaging.

Return procedure for XC6SLX75-N3FG484C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX75-N3FG484C Tags

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