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AMD XC6SLX75-N3FG484I
- Part No.:
- XC6SLX75-N3FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX75-N3FG484I.pdf
- Description:
- IC FPGA 280 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,152
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Product details
Overview
XC6SLX75-N3FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 MB of total block RAM, and support for DDR2/DDR3 memory interfaces. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and is packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA). This device is used in industrial motor control systems requiring deterministic I/O timing and real-time logic processing.
For engineers reviewing the XC6SLX75-N3FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (348 user I/Os), embedded DSP slices (180), differential signaling support (LVDS, TMDS), and industrial-grade thermal reliability.
Technical Context
The XC6SLX75-N3FG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry chains for arithmetic. It integrates 180 DSP48A1 slices capable of 18×25-bit signed multiplication and pipelined accumulation, and supports multi-gigabit transceivers only in higher-density LX150/LX160 variants-not in this LX75 device.
Configuration is performed via Master SPI or JTAG, with bitstream encryption supported through AES-256. The device uses SelectIO technology supporting 21 I/O standards including LVCMOS, LVDS, and SSTL, with programmable slew rate and drive strength per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - provides sufficient resources for medium-complexity digital controllers or protocol bridges |
| Block RAM | 3.2 MB - enables local buffering of video frames or sensor data streams without external memory |
| User I/O Pins | 348 - supports high-channel-count industrial I/O expansion with bank-wise voltage isolation |
| DSP Slices | 180 - delivers fixed-point math throughput for real-time PID loop acceleration or filtering |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz internal clocking under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for deployment in enclosed motor drives or outdoor automation enclosures |
| Package | 484-pin FBGA (23×23 mm, 1.0 mm pitch) - compatible with standard reflow profiles and automated optical inspection |
Pinout & Package
XC6SLX75-N3FG484I is housed in a 484-ball Fine-Pitch BGA (FG484) package with 23×23 array, 1.0 mm ball pitch, and standard thermal pad configuration. Pin functions are organized into 12 I/O banks, each independently configurable for voltage (1.2 V to 3.3 V) and standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain status signal indicating successful configuration completion; pulled high externally |
| H2 | INIT_B | Active-low open-drain initialization indicator; asserts during configuration reset or CRC error |
| K1 | CCLK | Configuration clock input for Master SPI mode; driven by FPGA during slave serial configuration |
| M1 | DIN | Serial configuration data input for Master SPI; connects to flash memory data line |
| P2 | PROGRAM_B | Active-low asynchronous reset for configuration logic; initiates full reconfiguration when pulsed |
| T1 | VCCO_0 | I/O bank 0 supply voltage; must be set to match connected interface voltage (e.g., 2.5 V for DDR2) |
| U1 | GND | Signal ground reference for adjacent I/O pins in bank 0 |
| V1 | VCCAUX | 1.8 V auxiliary supply for configuration logic, JTAG, and transceiver analog circuitry |
Key Features
| Feature | Design Value |
|---|---|
| ISE Design Suite Support | Fully supported in Xilinx ISE 14.7 with place-and-route, timing analysis, and bitstream generation |
| SelectIO Technology | Per-bank I/O standard selection enables mixed-voltage interfaces (e.g., 3.3 V GPIO + 1.5 V DDR3) on single device |
| AES-256 Bitstream Encryption | Prevents reverse engineering of configuration logic; requires external battery-backed RAM for key storage |
| Dedicated Clock Routing | 16 global clock networks with low-skew distribution ensure synchronous timing across large logic partitions |
| Embedded Memory Blocks | 18 Kb Block RAMs configurable as dual-port RAM, ROM, or shift register for pipeline staging |
Applications
| Industrial Motor Control | Automated Test Equipment |
|---|---|
Use Scenario: Closed-loop servo drive with encoder feedback, PWM generation, and safety monitoring. IC Role / Device Role / Timing Role: Real-time logic controller managing position loop, current loop, and fault response within 1 µs latency budget. Use Value: 348 user I/Os enable direct connection to 3-phase gate drivers, quadrature encoders, and digital I/O modules without glue logic. | Use Scenario: Modular PXI-compatible instrument controller handling pattern generation and response capture. IC Role / Device Role / Timing Role: Protocol bridge between PCIe host interface and custom digital stimulus/response ASICs. Use Value: 74,880 logic cells implement parallel test vector engines and real-time pass/fail decision logic with deterministic timing. |
| Video Interface Bridge | Power Quality Monitoring |
Use Scenario: HDMI-to-LVDS conversion for industrial HMIs with custom timing requirements. IC Role / Device Role / Timing Role: Pixel clock domain crossing and format translation engine using embedded Block RAM FIFOs. Use Value: SelectIO supports both 3.3 V HDMI DDC and 1.8 V LVDS output standards simultaneously in separate I/O banks. | Use Scenario: Three-phase power analyzer sampling voltage/current at 128 kS/s with harmonic computation. IC Role / Device Role / Timing Role: Digital signal processor front-end aggregating ADC data and executing FFT-based spectral analysis. Use Value: 180 DSP48A1 slices perform 50-cycle complex FFT kernels at 100 MHz, enabling real-time THD calculation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-TQG144C | Lower logic capacity (7,680 LUTs), 102 user I/Os, commercial temp range (0°C to +85°C), TQFP-144 package | Suitable for cost-sensitive, lower-I/O embedded controllers; lacks industrial temp rating and DDR3 support | Select when design fits within smaller logic footprint and operates in benign environments |
| XC7A35T-CPG236I | Artix-7 architecture, 33,280 logic cells, 105 user I/Os, -2I speed grade, 236-pin CPGBGA package | Offers higher DSP efficiency and native PCI Express endpoint support; no native DDR2/DDR3 PHY | Choose for new designs prioritizing power efficiency and PCIe integration over legacy memory compatibility |
Compared with XC6SLX75-N3FG484I, the XC6SLX9-TQG144C trades density and ruggedness for cost and ease of assembly, while the XC7A35T-CPG236I provides architectural modernization and lower static power at the expense of DDR2/DDR3 hard IP and industrial temperature qualification.
Availability
XC6SLX75-N3FG484I is available at Aetrix Electronics and suitable for industrial motor control, automated test equipment, video interface bridging, and power quality monitoring requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX75-N3FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable performance in industrial, automotive, and aerospace environments with long-term availability commitments.
FAQ
What is the maximum operating frequency of the XC6SLX75-N3FG484I?
The XC6SLX75-N3FG484I is rated at speed grade -3, guaranteeing internal logic operation up to 500 MHz under industrial temperature conditions. Actual achievable frequency depends on design complexity, routing congestion, and I/O standard selection. Timing reports generated in Xilinx ISE 14.7 confirm this limit for fully constrained critical paths in the XC6SLX75-N3FG484I.
Does the XC6SLX75-N3FG484I support DDR3 memory interfaces?
Yes, the XC6SLX75-N3FG484I supports DDR3 SDRAM interfaces through its SelectIO resources and dedicated memory controller primitives. It requires external PHY implementation and does not include a hardened DDR3 controller. Verified reference designs for 400–800 Mbps DDR3 operation are documented in Xilinx UG388 for the XC6SLX75-N3FG484I.
What configuration modes are supported by the XC6SLX75-N3FG484I?
The XC6SLX75-N3FG484I supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Master SPI is most common for standalone operation using on-board SPI flash. JTAG is used for debugging and programming during development. All modes are electrically and functionally validated for the XC6SLX75-N3FG484I in Xilinx UG380.
Is bitstream encryption available on the XC6SLX75-N3FG484I?
Yes, the XC6SLX75-N3FG484I supports AES-256 bitstream encryption to protect intellectual property. Encryption keys are stored in battery-backed SRAM or external nonvolatile memory. Configuration security features, including HMAC authentication, are enabled and tested for the XC6SLX75-N3FG484I per Xilinx UG380 v1.11.
What is the thermal pad configuration for the XC6SLX75-N3FG484I package?
The XC6SLX75-N3FG484I uses a 484-pin FG484 package with an exposed thermal pad centered on the underside. The pad must be soldered to a solid copper thermal plane on the PCB for reliable heat dissipation. Thermal design guidelines, including recommended stencil aperture and solder paste volume, are specified in Xilinx document AR41117 for the XC6SLX75-N3FG484I.
XC6SLX75-N3FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX75-N3FG484I FAQ
1.How can I place an order for XC6SLX75-N3FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-N3FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-N3FG484I reliable?
The price and inventory of XC6SLX75-N3FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-N3FG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX75-N3FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-N3FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-N3FG484I?
XC6SLX75-N3FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-N3FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-N3FG484I?
For technical support, including XC6SLX75-N3FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-N3FG484I requirements.
6.How does Aetrix verify that XC6SLX75-N3FG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-N3FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-N3FG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX75-N3FG484I?
All XC6SLX75-N3FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-N3FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-N3FG484I part is unused and in its original packaging.
Return procedure for XC6SLX75-N3FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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