AMD XC6SLX75-N3FG676C

Overview

XC6SLX75-N3FG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48E1 slices, and 3.2 MB of total block RAM. It uses a 65 nm CMOS process, operates at -3 speed grade, and is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) with 1.2 V core voltage. It targets high-volume industrial control and embedded vision systems requiring deterministic low-latency processing.

For engineers reviewing the XC6SLX75-N3FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), differential signaling support (LVDS, TMDS), configuration interface options (SPI, SelectMAP), and thermal performance under sustained 1.2 V core operation.

Technical Context

The XC6SLX75-N3FG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports multi-standard I/O banks with programmable drive strength, slew rate, and on-chip termination (up to 50 Ω).

Configuration is performed via Master SPI, Slave SelectMAP, or JTAG; bitstream encryption and readback protection are supported. The device includes integrated clock management using DCMs (Digital Clock Managers) for frequency synthesis, phase shifting, and duty cycle correction across up to 16 global clock networks.

Key Specifications

Pinout & Package

XC6SLX75-N3FG676C is housed in a 676-ball Fine-Pitch BGA (FG676) package with 1.0 mm ball pitch, 27 × 27 array, and thermal pad. Package dimensions are 27 mm × 27 mm × 1.55 mm (height). Ball composition is Pb-free (RoHS-compliant) SAC305 solder.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic and interface bridging applications.

Compared with XC6SLX75-N3FG676C, the XC6SLX75-3FGG484I offers identical logic capability in a smaller package but sacrifices 152 I/Os and thermal margin, while the XCKU035-2FFVA676E delivers 2.9× more logic and native high-speed transceivers at higher cost, power, and design complexity.

Availability

XC6SLX75-N3FG676C is available at Aetrix Electronics and suitable for industrial control, medical imaging, and avionics applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for XC6SLX75-N3FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.

The Spartan-6 family, including XC6SLX75-N3FG676C, was designed for cost-sensitive, high-volume applications demanding low static power, reliable configuration security, and seamless integration with legacy interfaces.

FAQ

What is the maximum operating junction temperature for XC6SLX75-N3FG676C?

The XC6SLX75-N3FG676C has a maximum operating junction temperature of 100°C for the -3 speed grade. This rating applies under specified voltage and thermal conditions defined in DS162 (Spartan-6 FPGA Data Sheet). Thermal design must ensure adequate heatsinking or airflow to maintain junction temperature within this limit during sustained operation.

Does XC6SLX75-N3FG676C support JTAG boundary-scan testing?

Yes, XC6SLX75-N3FG676C fully supports IEEE 1149.1 JTAG boundary-scan testing. The TAP controller enables instruction register access, device identification (IDCODE), and boundary-scan register operations for PCB interconnect verification and in-system programming without requiring additional test fixtures.

Can XC6SLX75-N3FG676C configure itself from a serial NOR flash device?

Yes, XC6SLX75-N3FG676C supports Master SPI configuration mode and can autonomously load its bitstream from standard 3.3 V serial NOR flash devices such as Spansion S25FL series. The CCLK pin drives the flash clock, and the FPGA controls address and data transfer without external microcontroller intervention.

What is the purpose of the VCCAUX supply on XC6SLX75-N3FG676C?

The VCCAUX supply on XC6SLX75-N3FG676C provides 1.2 V to internal auxiliary circuits including configuration logic, DCMs, clock buffers, and I/O input receivers. It must be decoupled with low-ESR capacitors and remain stable during configuration and operation to prevent INIT_B assertion or clock instability.

Is XC6SLX75-N3FG676C compatible with Xilinx ISE Design Suite 14.7?

Yes, XC6SLX75-N3FG676C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, timing analysis, and bitstream generation. This version remains the final official tool release for Spartan-6 devices and is required for accurate speed-grade (-3) timing closure and configuration file generation.