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AMD XC6SLX75-N3FG676I
- Part No.:
- XC6SLX75-N3FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX75-N3FG676I.pdf
- Description:
- IC FPGA 408 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,515
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Product details
Overview
XC6SLX75-N3FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and -3 speed grade operating at industrial temperature range (-40°C to +100°C). It integrates 3,888 Kbits of block RAM, 220 DSP48A1 slices, and supports LVDS, SSTL, and HSTL I/O standards for high-speed interface design in industrial control systems.
For engineers reviewing the XC6SLX75-N3FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), package type (Fine-Pitch BGA, 676-pin FCBGA), transceiver compliance (Xilinx SelectIO™), and configuration mode support (Master SPI, Slave Parallel).
Technical Context
The XC6SLX75-N3FG676I implements a configurable logic fabric based on 6-input LUTs and distributed RAM, paired with dedicated clock management resources including DCMs and PLLs for jitter reduction and frequency synthesis. It supports multi-standard I/O banks with programmable drive strength, slew rate, and termination.
Configuration is performed via external SPI flash or JTAG, with dual-boot capability and CRC-based bitstream integrity checking. The device uses 40 nm CMOS process technology and supports partial reconfiguration for dynamic function swapping in real-time systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 480 - supports high-density interface routing across multiple voltage domains and signaling standards |
| Block RAM | 3,888 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 220 × DSP48A1 - provides fixed-point arithmetic acceleration for filtering, FFT, and motor control algorithms |
| Transceiver Speed | Up to 3.2 Gb/s - enables PCIe Gen1, Gigabit Ethernet, and Serial RapidIO physical layer implementation |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for deployment in harsh environments without derating |
Pinout & Package
XC6SLX75-N3FG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FCBGA) package with 27 × 27 mm body size, 1.0 mm ball pitch, and Pb-free RoHS-compliant construction. The package supports thermal dissipation up to 3.5 W typical power consumption.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration logic during Master SPI mode; must be driven externally in Slave modes |
| DIN | Serial Data Input | Receives bitstream during SPI configuration; tied high when unused in parallel mode |
| PROGRAM_B | Global Reset | Active-low asynchronous reset that clears configuration memory and initiates reload sequence |
| INIT_B | Configuration Status | Open-drain output indicating successful CRC check or configuration error condition |
| M0–M2 | Mode Select | Three-pin encoding selects configuration interface: SPI, BPI, Slave Parallel, or JTAG |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Memory Controller | Supports DDR2/DDR3 SDRAM interfaces up to 800 Mb/s with built-in calibration and timing closure assistance |
| PCIe Endpoint Logic | Hard IP block for x1 Gen1 endpoint operation compliant with PCI Express Base Specification v1.1 |
| Partial Reconfiguration | Enables dynamic module swapping without full device reset-critical for mission-critical fault-tolerant systems |
| I/O Standard Flexibility | Per-bank voltage assignment (1.2 V to 3.3 V) and mixed-standard support within single bank |
| Embedded Debug Interface | Integrated ChipScope™ Pro ILA core allows real-time signal capture and trigger-based waveform analysis |
Applications
| Industrial PLC Controller | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time motion control and I/O expansion in programmable logic controllers with deterministic cycle times. IC Role / Device Role / Timing Role: FPGA acts as central logic engine handling servo axis coordination, safety interlock monitoring, and fieldbus protocol bridging. Use Value: 74,880 logic cells and 220 DSP slices enable concurrent execution of motion profiles, PID loops, and EtherCAT master stack. | Use Scenario: High-bandwidth sensor data aggregation and preprocessing in ultrasound and MRI front-end modules. IC Role / Device Role / Timing Role: FPGA serves as time-critical data path manager between ADCs, DDR3 memory, and PCIe host interface. Use Value: 3.2 Gb/s transceivers and 3,888 Kbits block RAM allow real-time beamforming coefficient updates and raw data buffering. |
| Avionics Data Concentrator | Test & Measurement Equipment |
Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation with deterministic latency in airborne computing units. IC Role / Device Role / Timing Role: FPGA implements protocol-specific state machines, timestamping, and packetized data routing to flight management systems. Use Value: Industrial temperature rating (-40°C to +100°C) and configuration CRC ensure reliability in uncontrolled cabin environments. | Use Scenario: Modular signal generation and analysis in automated test equipment requiring synchronized multi-channel I/O. IC Role / Device Role / Timing Role: FPGA provides precise timing control, pattern generation, and real-time response to trigger events across analog/digital channels. Use Value: 480 user I/Os and per-bank voltage flexibility support simultaneous LVDS, HSTL, and SSTL signaling for mixed-signal stimulus/response testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX75-3FGG676I | Same logic resources and package, but commercial temperature grade (0°C to +85°C) and non-industrial qualification | Limited to controlled-environment applications such as lab equipment or office-based instrumentation | Select only if industrial temperature operation is not required and cost sensitivity outweighs environmental robustness |
| XCVU9P-L2FLGA2104E | Virtex UltraScale+ device with 1,182,240 logic cells, 24.3 Gb/s transceivers, and larger footprint (2104-pin FC-BGA) | Targets high-throughput compute acceleration, AI inference, and 100G Ethernet line cards-not drop-in compatible | Choose for next-generation designs requiring >10× logic density and advanced SerDes, accepting PCB redesign and toolchain migration |
Compared with XC6SLX75-N3FG676I, the XC6SLX75-3FGG676I offers identical functionality at lower cost but lacks industrial temperature support, while the XCVU9P-L2FLGA2104E delivers massive scalability at the expense of compatibility, power, and layout effort.
Availability
XC6SLX75-N3FG676I is available at Aetrix Electronics and suitable for industrial automation, avionics subsystems, and medical imaging equipment requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX75-N3FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families. AMD is a global leader in adaptive computing solutions.
The Spartan-6 family-including XC6SLX75-N3FG676I-was designed for cost-sensitive, high-volume applications demanding low-power logic integration, embedded processing, and multi-standard I/O connectivity in industrial and communications infrastructure.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX75-N3FG676I?
The XC6SLX75-N3FG676I supports I/O standards from 1.2 V to 3.3 V per bank, with independent VCCO assignment. Each I/O bank can be configured for LVCMOS, LVTTL, SSTL, HSTL, or differential standards like LVDS and TMDS, provided the corresponding VCCO and reference voltage (VREF) are properly supplied and decoupled per Xilinx UG381 guidelines.
Does XC6SLX75-N3FG676I support partial reconfiguration?
Yes, XC6SLX75-N3FG676I supports partial reconfiguration through Xilinx ISE Design Suite tools and associated bitstream manipulation flow. This capability allows runtime swapping of functional modules-such as protocol engines or filter coefficients-without resetting the entire device or disrupting active I/O paths.
What configuration modes are supported by XC6SLX75-N3FG676I?
XC6SLX75-N3FG676I supports four primary configuration modes: Master SPI (internal oscillator drives serial flash), Slave Parallel (external processor loads bitstream), Slave SelectMAP (high-speed parallel interface), and JTAG (boundary-scan programming and debug). Mode selection is controlled by M0–M2 pins at power-up.
Is XC6SLX75-N3FG676I RoHS compliant and lead-free?
Yes, XC6SLX75-N3FG676I is RoHS compliant and manufactured with lead-free (Pb-free) packaging. The FCBGA package uses matte tin surface finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements for standard SMT assembly processes.
What is the recommended configuration memory for XC6SLX75-N3FG676I in Master SPI mode?
In Master SPI mode, XC6SLX75-N3FG676I requires an external SPI flash memory with at least 16 Mbit capacity and support for dual/quad I/O commands. Xilinx recommends Micron MT25QL series or Spansion S25FL devices, which provide reliable boot performance and seamless integration with Xilinx iMPACT and Vivado tools.
XC6SLX75-N3FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 408
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX75-N3FG676I FAQ
1.How can I place an order for XC6SLX75-N3FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-N3FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-N3FG676I reliable?
The price and inventory of XC6SLX75-N3FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-N3FG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX75-N3FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-N3FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-N3FG676I?
XC6SLX75-N3FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-N3FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-N3FG676I?
For technical support, including XC6SLX75-N3FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-N3FG676I requirements.
6.How does Aetrix verify that XC6SLX75-N3FG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-N3FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-N3FG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX75-N3FG676I?
All XC6SLX75-N3FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-N3FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-N3FG676I part is unused and in its original packaging.
Return procedure for XC6SLX75-N3FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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