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AMD XC6SLX75-N3FGG484C
- Part No.:
- XC6SLX75-N3FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX75-N3FGG484C.pdf
- Description:
- IC FPGA 280 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,781
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Product details
Overview
XC6SLX75-N3FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 Mb of block RAM, and 220 I/O pins in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It supports DDR2/DDR3 memory interfaces and operates at -3 speed grade with commercial temperature range (0°C to 85°C), targeting cost-sensitive embedded control and industrial interface applications.
For engineers reviewing the XC6SLX75-N3FGG484C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, memory resources, speed grade timing closure, and FBGA484 thermal-mechanical compatibility with existing PCB layouts.
Technical Context
The XC6SLX75-N3FGG484C implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated DSP48A1 slices for arithmetic-intensive tasks. It integrates dual-clock domain management, internal PLLs for clock synthesis, and SelectIO technology supporting LVCMOS, LVDS, and SSTL standards across its 220 user-configurable I/Os.
Configuration is performed via Master SPI or JTAG, with support for fallback configuration and bitstream encryption using AES-256. The device targets low-power operation with static power as low as 25 mW and dynamic power scaling dependent on toggle rate and voltage rail settings (VCCINT = 1.2 V, VCCAUX = 3.3 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 3.2 Mb - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| I/O Pins | 220 - supports high-channel-count peripheral interfacing including parallel buses and multi-lane protocols |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in critical paths under commercial conditions |
| Package | FGG484 - 23×23 mm fine-pitch BGA with 1.0 mm ball pitch, requiring controlled-depth reflow and IPC Class 3 assembly |
| Operating Temp | 0°C to +85°C - validated for use in industrial enclosures and non-automotive embedded environments |
| Voltage Rails | VCCINT = 1.2 V, VCCAUX = 3.3 V - mandates separate low-noise regulation and sequencing during power-up |
Pinout & Package
XC6SLX75-N3FGG484C is housed in a 484-ball Fine-Pitch Ball Grid Array (FGG484) package with 220 user I/Os, 12 configuration pins, 8 power/ground balls per supply rail, and dedicated JTAG and clock input balls. Thermal pad is not present; thermal dissipation relies on PCB copper area and airflow.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain status signal indicating successful configuration completion; requires external pull-up |
| P17 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reload sequence |
| T15 | CCLK | Configuration clock input for Master SPI mode; also used as general-purpose clock input post-configuration |
| R14 | DIN | Serial data input for SPI configuration; multiplexed with user I/O after configuration |
| A12 | INIT_B | Open-drain initialization status; driven low during configuration errors or CRC failure |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 180 dedicated arithmetic units enabling 25×18-bit multiply-accumulate per slice at 500 MHz |
| SelectIO Standards | Support for LVCMOS18/25/33, LVDS, SSTL18/I, and differential signaling without external termination resistors |
| Embedded Memory | 3.2 Mb total block RAM plus 128 Kb distributed RAM for register-based storage and shift registers |
| PLL Resources | Four digital clock managers (DCMs) and two phase-locked loops (PLLs) for jitter reduction and frequency synthesis |
| Security | AES-256 bitstream encryption with HMAC authentication prevents unauthorized cloning and reverse engineering |
Applications
| Industrial PLC I/O Expansion | Video Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O, analog input scanning, and fieldbus protocol translation to legacy PLC backplanes. IC Role / Device Role / Timing Role: Configurable logic fabric implementing protocol state machines, timing-critical I/O sampling, and real-time data aggregation. Use Value: Enables single-chip replacement of multiple ASICs and CPLDs while maintaining deterministic <1 µs I/O response latency. | Use Scenario: Converting HDMI 1.4a video streams to MIPI DSI for embedded display modules in medical imaging devices. IC Role / Device Role / Timing Role: Pixel clock domain crossing, color space conversion pipeline, and serializer/deserializer logic. Use Value: Eliminates need for discrete level shifters and timing controllers by integrating SerDes with programmable video processing logic. |
| Motor Control Encoder Interface | Communications Protocol Gateway |
Use Scenario: Interfacing quadrature encoders and resolvers in servo drives with 100 ns position update resolution. IC Role / Device Role / Timing Role: High-speed counter logic with built-in debounce, index pulse detection, and ABZ decoding. Use Value: Achieves sub-microsecond edge capture accuracy using dedicated I/O delay chains and deterministic routing. | Use Scenario: Translating Modbus RTU over RS-485 to EtherNet/IP for factory floor HMIs and SCADA systems. IC Role / Device Role / Timing Role: Dual-protocol stack implementation with hardware-accelerated CRC generation and packet framing logic. Use Value: Reduces host MCU overhead by offloading serial-to-Ethernet packet translation and timing-critical frame synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-TQG144C | Fewer logic cells (7,680), smaller 144-pin TQFP package, no DDR3 support, lower I/O count (102) | Suitable for simpler control logic where board space and cost outweigh performance needs | Select when design fits within 10k LUTs and uses only basic I/O standards like LVCMOS |
| XC7S25-1CSGA225C | Artix-7 architecture, higher logic density (23,360 LUTs), integrated PCIe Gen2 block, 225-pin CSBGA package | Better suited for designs requiring hard IP blocks or higher bandwidth interfaces | Choose when migrating from Spartan-6 for future-proofing or adding PCI Express connectivity |
Compared with XC6SLX75-N3FGG484C, XC6SLX9-TQG144C trades scalability and memory bandwidth for compactness and lower BOM cost, while XC7S25-1CSGA225C offers architectural upgrades including hardened transceivers and improved power efficiency but requires PCB redesign due to different package and pinout.
Availability
XC6SLX75-N3FGG484C is available at Aetrix Electronics and suitable for industrial automation, embedded vision, and motor control applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX75-N3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, SoCs, and AI accelerators for data center, embedded, and adaptive compute markets.
The Spartan-6 family, including XC6SLX75-N3FGG484C, was designed for cost-optimized, high-volume embedded applications demanding predictable timing, low power, and flexible I/O integration without ASIC-level NRE costs.
FAQ
What is the maximum operating frequency supported by XC6SLX75-N3FGG484C?
The XC6SLX75-N3FGG484C is rated at speed grade -3, guaranteeing timing closure for system clocks up to 500 MHz in critical paths under commercial temperature and voltage conditions. Actual achievable frequency depends on design complexity, routing congestion, and I/O standard selection, but verified reference designs achieve 400–450 MHz sustained operation with proper constraints and placement.
Does XC6SLX75-N3FGG484C support DDR3 memory interfaces?
Yes, XC6SLX75-N3FGG484C supports DDR3 SDRAM interfaces through its SelectIO technology and dedicated memory controller primitives. It meets JEDEC DDR3 specifications up to 800 Mbps data rates when used with appropriate PCB layout practices, termination, and timing constraints defined in UG388 and DS162.
What configuration modes are supported by XC6SLX75-N3FGG484C?
XC6SLX75-N3FGG484C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Master SPI is most common for standalone operation using a serial flash PROM, while JTAG is used for debugging and in-system programming. Configuration mode is selected via MODE pins (M[2:0]) at power-up.
Is XC6SLX75-N3FGG484C pin-compatible with other Spartan-6 devices?
No, XC6SLX75-N3FGG484C is not pin-compatible with other Spartan-6 FPGAs. Its FGG484 package has a unique ball map optimized for the XC6SLX75 density and I/O count. Migration to XC6SLX150 or XC6SLX100 requires PCB redesign due to differing pin assignments, power ball locations, and thermal pad requirements.
What is the power consumption profile of XC6SLX75-N3FGG484C?
XC6SLX75-N3FGG484C exhibits static power of approximately 25 mW at 25°C and typical dynamic power ranging from 150 mW to 1.2 W depending on logic utilization, toggle rate, and active I/O count. Power estimation must use Xilinx XPE tool with accurate activity factors, as VCCINT and VCCAUX rails scale independently and require separate regulation.
XC6SLX75-N3FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX75-N3FGG484C FAQ
1.How can I place an order for XC6SLX75-N3FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-N3FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-N3FGG484C reliable?
The price and inventory of XC6SLX75-N3FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-N3FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX75-N3FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-N3FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-N3FGG484C?
XC6SLX75-N3FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-N3FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-N3FGG484C?
For technical support, including XC6SLX75-N3FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-N3FGG484C requirements.
6.How does Aetrix verify that XC6SLX75-N3FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-N3FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-N3FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX75-N3FGG484C?
All XC6SLX75-N3FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-N3FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-N3FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX75-N3FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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