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AMD XC6SLX75-N3FGG484I
- Part No.:
- XC6SLX75-N3FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX75-N3FGG484I.pdf
- Description:
- IC FPGA 280 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,200
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Product details
Overview
XC6SLX75-N3FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 Mb of total block RAM, and support for DDR2/DDR3 memory interfaces. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and is packaged in a 484-pin Fine-Pitch Flip-Chip BGA (FFG484). This device is used in industrial motor control systems requiring deterministic I/O timing and embedded vision preprocessing.
For engineers reviewing the XC6SLX75-N3FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS-capable banks, integrated DSP48A1 slices (180 units), and compatibility with Xilinx ISE Design Suite v14.7 for synthesis and place-and-route.
Technical Context
The XC6SLX75-N3FGG484I implements a configurable logic fabric based on 6-input LUTs and distributed RAM, with dedicated carry logic for arithmetic. It integrates 180 DSP48A1 slices supporting 18×25-bit signed multiplication and pipelined accumulation, and includes six CMT clock management tiles with DCM and PLL blocks for jitter reduction and frequency synthesis.
It supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS, BLVDS, and RSDS across 16 I/O banks. Configuration is performed via Master SPI, Slave Serial, or JTAG, with bitstream encryption available using AES-256 keys.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for state machines and datapaths |
| Block RAM | 3.2 Mb - enables local buffering, FIFOs, and small lookup tables without external memory |
| User I/O Pins | 348 - supports high-density peripheral interfacing with bank-wise voltage flexibility |
| DSP Slices | 180 × DSP48A1 - delivers 1.2 GMAC/s peak multiply-accumulate throughput for filtering and transforms |
| Speed Grade | -3 - guarantees timing closure up to 667 MHz for internal logic and 800 Mbps for DDR3 interfaces |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
| Configuration Mode | Master SPI / Slave Serial / JTAG - enables flexible, secure, and debug-friendly programming |
Pinout & Package
XC6SLX75-N3FGG484I is housed in a 484-pin Fine-Pitch Flip-Chip BGA (FFG484) package with 23×23 mm body size, 1.0 mm ball pitch, and Pb-free/NiPdAu finish. The package supports thermal dissipation up to 3.5 W under typical industrial operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Power | Supplies selectable I/O voltage (1.2–3.3 V) for Bank 0 signal integrity and level translation |
| CLKIN_1 | Primary Clock Input | Accepts single-ended or differential reference clock feeding CMT tile for system-wide timing control |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and device initialization completion |
| M0–M2 | Mode Selection | Three-pin strap defining configuration mode (SPI, BPI, JTAG) at power-up |
| GND | Ground Reference | Provides low-impedance return path for core, I/O, and analog circuitry; requires dedicated plane partitioning |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Memory Controller | Hardened DDR2/DDR3 controller supporting 16-bit/32-bit data widths and up to 800 Mbps data rates |
| PCI Express Endpoint | Gen1 x1 endpoint capability with integrated PHY and transaction layer for host communication |
| AES Bitstream Encryption | 256-bit AES key protection prevents unauthorized readback and cloning of configuration data |
| Low-Power Architecture | Multi-voltage I/O banks and dynamic power gating reduce active power by up to 40% vs. Spartan-3 |
| ISE Toolchain Support | Fully supported in Xilinx ISE Design Suite v14.7 with timing analysis, simulation, and hardware debugging |
Applications
| Industrial Motor Control | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) with current sensing, PWM generation, and encoder feedback processing. IC Role / Device Role / Timing Role: FPGA acts as deterministic real-time controller coordinating ADC sampling, PWM modulation, and position loop execution within ≤1 µs jitter. Use Value: 348 user I/Os enable direct connection to gate drivers, encoders, and analog front-ends; DSP48A1 slices accelerate Clarke/Park transforms. | Use Scenario: On-camera image enhancement before transmission to host processor, including Bayer demosaicing and noise reduction. IC Role / Device Role / Timing Role: FPGA performs pixel-level parallel processing with sub-frame latency using block RAM-based line buffers and pipeline stages. Use Value: 3.2 Mb block RAM provides sufficient line buffer depth for 1080p@60fps; LVDS I/O supports high-speed sensor interface. |
| Programmable Logic PLC | Communications Backplane Interface |
Use Scenario: Replacement for fixed-function ASICs in modular PLC modules handling discrete I/O, motion control, and safety logic. IC Role / Device Role / Timing Role: FPGA implements customizable ladder logic scan engine and cyclic I/O update with deterministic cycle times. Use Value: -3 speed grade ensures 500 ns logic propagation for safety-critical response; AES encryption secures firmware updates. | Use Scenario: Protocol bridging between legacy backplane standards (e.g., VME, CompactPCI) and modern serial interfaces (PCIe, SRIO). IC Role / Device Role / Timing Role: FPGA serves as protocol-aware bridge with packet parsing, address translation, and flow control arbitration. Use Value: Integrated PCIe Gen1 endpoint and 180 DSP slices enable real-time packet classification and header modification at line rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-TQG144C | Fewer logic cells (7,680), smaller 144-pin TQFP package, no DDR3 support, commercial temp range only | Suitable for cost-sensitive, lower-complexity control tasks with minimal I/O and memory bandwidth needs | Select when design fits within 10K logic cells and does not require industrial temperature or DDR3 interface |
| XC7A35T-CPG236I | Artix-7 architecture, higher logic density (33,280 LUTs), native PCIe Gen2, lower static power, but requires Vivado toolflow | Better suited for new designs needing higher performance per watt and future-proof toolchain support | Choose for new development targeting longer lifecycle, improved power efficiency, and PCIe Gen2 endpoints |
Compared with XC6SLX75-N3FGG484I, XC6SLX9-TQG144C offers lower cost and simpler layout but lacks industrial qualification and DDR3 capability, while XC7A35T-CPG236I provides architectural improvements and toolchain modernization at the expense of backward compatibility with ISE.
Availability
XC6SLX75-N3FGG484I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision preprocessing, and programmable logic PLC applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX75-N3FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable performance, low power, and seamless integration with legacy microprocessor and memory subsystems.
FAQ
What is the maximum supported DDR3 data rate for XC6SLX75-N3FGG484I?
The XC6SLX75-N3FGG484I supports DDR3 interfaces up to 800 Mbps per pin using its hardened memory controller. This is validated for 16-bit and 32-bit configurations with appropriate board layout and termination. The -3 speed grade ensures timing closure at this rate across the full industrial temperature range. XC6SLX75-N3FGG484I does not support DDR3L or LPDDR variants.
Does XC6SLX75-N3FGG484I support partial reconfiguration?
No, XC6SLX75-N3FGG484I does not support partial reconfiguration. The Spartan-6 architecture lacks the necessary configuration port isolation and frame-addressing logic required for dynamic module swapping. Full reconfiguration via JTAG or SPI is required to change functionality. XC6SLX75-N3FGG484I relies on static bitstream loading for all operational modes.
What configuration modes are supported by XC6SLX75-N3FGG484I?
XC6SLX75-N3FGG484I supports Master SPI, Slave Serial, and JTAG configuration modes. Mode selection is controlled by the M0–M2 pins at power-up. Master SPI allows autonomous boot from external flash; Slave Serial enables configuration by an external controller; JTAG is used for debugging and programming during development. XC6SLX75-N3FGG484I does not support BPI or NAND flash boot modes.
Is XC6SLX75-N3FGG484I pin-compatible with other Spartan-6 devices in the FGG484 package?
XC6SLX75-N3FGG484I shares the same FGG484 footprint with XC6SLX45, XC6SLX75, and XC6SLX100 in the -3 speed grade, but pin functions are not fully interchangeable due to differing I/O bank allocations and dedicated resource placement. Signal routing must be verified per device-specific pinout files. XC6SLX75-N3FGG484I requires unique constraints for DSP and clock resources.
What is the purpose of the DONE pin on XC6SLX75-N3FGG484I?
The DONE pin on XC6SLX75-N3FGG484I is an open-drain output that transitions high after successful configuration and initialization of all internal logic, I/Os, and clock networks. It signals readiness to accept user logic operation and is commonly used to enable downstream circuitry or trigger system reset release. XC6SLX75-N3FGG484I requires external pull-up for proper DONE assertion.
XC6SLX75-N3FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX75-N3FGG484I FAQ
1.How can I place an order for XC6SLX75-N3FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-N3FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-N3FGG484I reliable?
The price and inventory of XC6SLX75-N3FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-N3FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX75-N3FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-N3FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-N3FGG484I?
XC6SLX75-N3FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-N3FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-N3FGG484I?
For technical support, including XC6SLX75-N3FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-N3FGG484I requirements.
6.How does Aetrix verify that XC6SLX75-N3FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-N3FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-N3FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX75-N3FGG484I?
All XC6SLX75-N3FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-N3FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-N3FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX75-N3FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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