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AMD XC6SLX75-N3FGG676C
- Part No.:
- XC6SLX75-N3FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX75-N3FGG676C.pdf
- Description:
- IC FPGA 408 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,611
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Product details
Overview
XC6SLX75-N3FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48E1 slices, 3.2 MB of total block RAM, and operates at -3 speed grade with commercial temperature range (0°C to 85°C). It is used in industrial vision systems for real-time image preprocessing and interface bridging between CMOS sensors and processors.
For engineers reviewing the XC6SLX75-N3FGG676C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count (480 user I/Os), LVDS support, embedded memory depth, and compatibility with Xilinx ISE Design Suite v14.7.
Technical Context
The XC6SLX75-N3FGG676C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for high-speed I/Os including SelectIO™ technology supporting LVCMOS, LVDS, and SSTL standards. It integrates dual-clock DDR2/DDR3 memory controllers and supports JTAG boundary-scan testing per IEEE 1149.1.
Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled initialization. The device includes internal oscillator for configuration clock and supports partial reconfiguration in selected designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom digital functions |
| DSP Slices | 180 × DSP48E1 - enables fixed-point multiply-accumulate operations up to 25×18-bit per slice |
| Block RAM | 3,204 kbit (3.2 MB) - supports FIFOs, buffers, and lookup tables without external memory |
| User I/O Pins | 480 - provides parallel interface capability for sensor arrays, display drivers, or bus bridging |
| Speed Grade | -3 - guarantees timing closure up to 667 Mbps DDR3 data rate and 333 MHz system clock |
| Operating Temp | 0°C to +85°C - validated for use in fanless industrial enclosures and factory-floor equipment |
Pinout & Package
XC6SLX75-N3FGG676C is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 27×27 array, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Package dimensions are 27 mm × 27 mm × 1.55 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank power supply for Bank 0 (1.2V/1.5V/1.8V/2.5V/3.3V selectable) |
| K1 | IO_L1P_T0_0 | Dedicated single-ended or differential input/output in Bank 0, supports LVDS |
| P2 | M0 | Configuration mode select (Master SPI mode when pulled High) |
| T3 | CCLK | Configuration clock input/output - drives PROM read cycle during Master SPI config |
| V4 | PROGRAM_B | Active-Low asynchronous reset initiating full reconfiguration sequence |
| W5 | DONE | Open-drain status output indicating successful configuration completion |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Memory | 3.2 MB block RAM + 576 kbit distributed RAM - eliminates need for external SRAM in buffer-intensive control logic |
| SelectIO Technology | Supports 18 I/O standards including LVDS, SSTL, HSTL - enables direct interfacing to DDR3 SDRAM and image sensors |
| DSP48E1 Slice | 180 units with 25×18-bit multiplier, 48-bit accumulator - accelerates convolution and filtering in machine vision pipelines |
| Configuration Security | Bitstream encryption via AES-256 key stored in eFUSE - prevents IP theft in deployed edge devices |
| Partial Reconfiguration | Supported in specific design flows - allows dynamic function swapping without full system reset |
Applications
| Industrial Machine Vision | Automated Test Equipment |
|---|---|
Use Scenario: Real-time pixel-level correction and Bayer demosaicing on high-speed line-scan cameras. IC Role / Device Role / Timing Role: Configurable logic fabric performs parallel pixel processing; embedded RAM stores line buffers; DSP slices execute color space conversion. Use Value: Enables sub-millisecond latency preprocessing without offloading to host CPU or adding external ASICs. | Use Scenario: Multi-channel digital pattern generation and response analysis for semiconductor wafer probing. IC Role / Device Role / Timing Role: Generates synchronized stimulus vectors across 128+ pins; captures responses with precise timestamping using internal clock networks. Use Value: Achieves 200+ MHz vector rates with deterministic timing margins, reducing test time by 35% versus microcontroller-based solutions. |
| Communications Backplane Interface | Medical Imaging Data Aggregation |
Use Scenario: Protocol translation between proprietary sensor buses and PCIe Gen2 upstream link in modular instrumentation racks. IC Role / Device Role / Timing Role: Implements bridge logic with 8b/10b encoding/decoding; manages flow control and error detection across multiple serial lanes. Use Value: Supports 5 Gbps aggregate throughput while maintaining <1 μs packet jitter for time-critical diagnostics. | Use Scenario: Consolidating raw DICOM data streams from ultrasound transducer arrays before compression and storage. IC Role / Device Role / Timing Role: Acts as DMA controller and scatter-gather engine; interfaces with 4× DDR3 channels and 2× PCIe endpoints simultaneously. Use Value: Sustains 3.2 GB/s sustained bandwidth to feed real-time beamforming algorithms without frame drops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX75-3FGG484C | 484-pin FBGA, 328 user I/Os, reduced package size and I/O count | Suitable for space-constrained designs with lower peripheral interface requirements | Choose when board area is limited and fewer I/Os are needed; not pin-compatible with XC6SLX75-N3FGG676C |
| XC7A75T-2CSG324C | Artix-7 architecture, 75K logic cells, higher DSP density (210 slices), native PCIe Gen2 endpoint | Better suited for new designs requiring higher throughput, lower power, or integrated transceivers | Prefer for greenfield projects needing improved performance-per-watt; requires toolchain and PCB redesign |
Compared with XC6SLX75-3FGG484C and XC7A75T-2CSG324C, the XC6SLX75-N3FGG676C offers the highest I/O count and mature toolchain support in the Spartan-6 family, making it optimal for legacy industrial upgrades where pinout stability and ISE v14.7 compatibility are critical.
Availability
XC6SLX75-N3FGG676C is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and communications infrastructure requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX75-N3FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families for adaptive computing applications.
The Spartan-6 family, including XC6SLX75-N3FGG676C, was designed for cost-sensitive, high-volume applications demanding reliable logic density, low static power, and broad I/O flexibility in industrial and embedded systems.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6SLX75-N3FGG676C?
The XC6SLX75-N3FGG676C supports DDR3 SDRAM interfaces up to 800 Mbps data rate (400 MHz clock) using its dedicated memory controller blocks. This capability is verified in Xilinx UG388 and applies specifically to the -3 speed grade under commercial temperature conditions. The XC6SLX75-N3FGG676C achieves this with calibrated write leveling and read leveling sequences implemented in hardware.
Does XC6SLX75-N3FGG676C support JTAG boundary-scan testing?
Yes, XC6SLX75-N3FGG676C fully complies with IEEE 1149.1 (JTAG) standard for boundary-scan testing. It includes dedicated TDI, TDO, TMS, TCK, and TRST pins, and supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions. This functionality is documented in Xilinx DS162 and is enabled by default after configuration.
Can XC6SLX75-N3FGG676C be configured via SPI flash memory?
Yes, XC6SLX75-N3FGG676C supports Master SPI configuration mode using standard quad-SPI or standard SPI flash devices. In this mode, the FPGA drives the CCLK signal and reads the bitstream directly from the flash. Configuration is initiated automatically on power-up when M0/M1 pins are set to 10, as specified in Xilinx UG380 for the XC6SLX75-N3FGG676C.
What is the purpose of the DONE pin on XC6SLX75-N3FGG676C?
On XC6SLX75-N3FGG676C, the DONE pin is an open-drain output that transitions High-Z to High (pulled up externally) upon successful configuration completion. It signals that the internal configuration memory has been loaded and the device is ready to operate. Its behavior is defined in Xilinx DS162 and is used by system monitors to verify boot integrity.
Is XC6SLX75-N3FGG676C compatible with Xilinx ISE Design Suite v14.7?
Yes, XC6SLX75-N3FGG676C is fully supported in Xilinx ISE Design Suite v14.7, including synthesis, implementation, and bitstream generation. This version remains the final official tool release for Spartan-6 devices. The XC6SLX75-N3FGG676C device model, constraints, and simulation libraries are included in the ISE 14.7 installation package.
XC6SLX75-N3FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 408
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX75-N3FGG676C FAQ
1.How can I place an order for XC6SLX75-N3FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-N3FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-N3FGG676C reliable?
The price and inventory of XC6SLX75-N3FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-N3FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX75-N3FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-N3FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-N3FGG676C?
XC6SLX75-N3FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-N3FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-N3FGG676C?
For technical support, including XC6SLX75-N3FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-N3FGG676C requirements.
6.How does Aetrix verify that XC6SLX75-N3FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-N3FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-N3FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX75-N3FGG676C?
All XC6SLX75-N3FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-N3FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-N3FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX75-N3FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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