AMD XC6SLX75-N3FGG676I

Overview

XC6SLX75-N3FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and -3 speed grade operating at industrial temperature range (–40°C to +100°C). It integrates 18 Kbit block RAM, 24 DSP48A1 slices, and supports LVDS, SSTL, and HSTL I/O standards for high-speed interface design in industrial control systems.

For engineers reviewing the XC6SLX75-N3FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded memory depth, transceiver compliance with JESD204B, and thermal performance under sustained 100°C ambient operation.

Technical Context

The XC6SLX75-N3FGG676I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic and shift registers. It includes dual-port 18 Kbit block RAM with byte-write enable and parity support, and 24 DSP48A1 slices capable of 25×18 signed multiplication with pipelined accumulation.

Its SelectIO™ technology supports single-ended and differential standards including LVDS (1.8 V), SSTL-18, and HSTL Class I/II across 348 user I/O pins. The device uses a 2.5 V core supply with separate 1.2 V auxiliary and 1.8 V I/O banks, enabling mixed-voltage system integration.

Key Specifications

Pinout & Package

XC6SLX75-N3FGG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 27×27 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 3.8 W under typical industrial operating conditions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic and interface bridging applications.

Compared with XC6SLX75-N3FGG676I, the XC6SLX75-3FGG484I offers identical logic resources and speed grade in a smaller footprint but sacrifices 30 I/Os and thermal headroom, while the XC7A75T-2FGG484I delivers double transceiver speed and modern selectIO at the cost of core voltage change and toolchain migration.

Availability

XC6SLX75-N3FGG676I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, avionics data concentration, and smart grid protection relay applications requiring stable component supply across extended product lifecycles.

Supply support for XC6SLX75-N3FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops and markets adaptive computing platforms including FPGAs, ACAPs, and related software tools.

The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume industrial and automotive applications demanding predictable timing, low power, and long-term availability.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX75-N3FGG676I?

XC6SLX75-N3FGG676I supports I/O voltages from 1.2 V to 3.3 V across eight independent banks. Each bank can be configured for LVCMOS, LVTTL, SSTL, HSTL, or LVDS signaling, with VCCO settings determining compatible standards. Bank-specific voltage assignment must comply with Xilinx UG381 guidelines to avoid I/O damage or timing violations.

Does XC6SLX75-N3FGG676I include built-in configuration security features?

Yes, XC6SLX75-N3FGG676I includes on-chip AES-256 bitstream encryption and HMAC-based authentication using a 256-bit key stored in battery-backed SRAM. These features prevent unauthorized readback and ensure configuration integrity during power-up, meeting IEC 62443-3-3 requirements for industrial control systems.

Can XC6SLX75-N3FGG676I operate reliably at 100°C junction temperature?

XC6SLX75-N3FGG676I is rated for industrial temperature range (–40°C to +100°C case temperature), with thermal design requiring ≤3.8 W total power dissipation. At 100°C ambient with appropriate PCB copper pour and airflow, junction temperature remains within safe limits per Xilinx DS162 characterization data.

What clocking resources are available on XC6SLX75-N3FGG676I?

XC6SLX75-N3FGG676I integrates four Digital Clock Managers (DCMs) supporting input frequencies up to 500 MHz. Each DCM provides phase shifting, duty cycle correction, frequency synthesis, and spread-spectrum clocking. No PLLs are included-DCMs serve all internal clock generation and distribution needs.

Is partial reconfiguration supported on XC6SLX75-N3FGG676I?

Yes, XC6SLX75-N3FGG676I supports partial reconfiguration through Xilinx ISE Design Suite v14.7 and later. This allows dynamic swapping of logic modules-such as protocol engines or filter coefficients-without resetting the entire device, enabling adaptive behavior in industrial and medical applications.