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AMD XC6SLX75T-2CSG484C
- Part No.:
- XC6SLX75T-2CSG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, CSPBGA
- Datasheet:
-
XC6SLX75T-2CSG484C.pdf
- Description:
- IC FPGA 292 I/O 484CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,059
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Product details
Overview
XC6SLX75T-2CSG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 Gb/s transceiver capability, and embedded block RAM totaling 3,009 kbits. It operates at -2 speed grade with 1.2 V core voltage and supports LVDS, SSTL, and HSTL I/O standards. It is used in industrial vision systems requiring real-time image preprocessing and deterministic latency.
For engineers reviewing the XC6SLX75T-2CSG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (348 user I/Os), transceiver lane count (8 lanes), distributed RAM capacity (1,037 kbits), and thermal performance in CSG484 package under sustained 75°C ambient conditions.
Technical Context
The XC6SLX75T-2CSG484C implements a hierarchical FPGA architecture with six-input LUTs, dedicated carry logic, and integrated DSP48A1 slices supporting 18×18 multipliers and accumulator functions. It includes eight RocketIO GTP transceivers operating up to 3.2 Gb/s with built-in 8B/10B encoding and elastic buffers.
Configuration is supported via Master Serial SPI, Slave SelectMAP, or JTAG, with dual-boot capability using external configuration memory. The device uses 1.2 V core, 2.5 V or 3.3 V I/O, and 1.2 V auxiliary supply, with power management features including dynamic I/O banking and partial reconfiguration support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - provides gate count equivalent to ~450K ASIC gates for combinational and sequential logic implementation |
| User I/O Pins | 348 - supports high-density interface routing across multiple voltage domains (1.2V/1.5V/1.8V/2.5V/3.3V) |
| Block RAM | 3,009 kbits - enables large on-chip FIFOs, frame buffers, or lookup tables without external memory |
| GTP Transceivers | 8 lanes @ 3.2 Gb/s - delivers serial connectivity for Camera Link HS, CPRI, or JESD204B-compliant data links |
| Distributed RAM | 1,037 kbits - supplies fast, low-latency storage for control state machines or small coefficient tables |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency for critical paths in industrial temperature range |
| Package | CSG484 - 484-pin CSP BGA with 0.8 mm pitch, optimized for thermal dissipation and signal integrity in compact PCB layouts |
Pinout & Package
XC6SLX75T-2CSG484C is housed in a 484-pin Chip Scale Package (CSG484) with 0.8 mm ball pitch, 23 × 23 array, and thermal pad center. Pinout follows Xilinx Spartan-6 FPGA Pin Planning Guide UG381 (v1.11), with dedicated configuration, clock, JTAG, and transceiver banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Asserting low resets configuration logic and initiates reload from external SPI flash or PROM |
| INIT_B | Configuration Status Indicator | Open-drain output signaling configuration success (high) or error/failure (low) |
| CCLK | Configuration Clock Input | Drives internal configuration shift register; sourced externally during Master Serial mode |
| DONE | Configuration Completion Flag | Open-drain output pulled high when bitstream loading and startup sequence complete |
| M0–M2 | Mode Selection Inputs | Set configuration mode (SPI, SelectMAP, JTAG) at power-on reset; sampled on PROG_B deassertion |
| GTPCLK0/1 | Dedicated Transceiver Reference Clock | Accepts differential input (LVDS/CML) to synchronize all 8 GTP transceiver lanes |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DSP48A1 Slices | 18×18 multipliers with pre-adder and accumulator enable real-time FIR filtering and motor control loop computation |
| Partial Reconfiguration Support | Allows dynamic logic module swapping without full device reset-critical for adaptive communication protocols |
| Dual-Boot Configuration | Enables fail-safe firmware updates by storing primary and backup bitstreams in external flash |
| Multi-Voltage I/O Banks | 12 independent I/O banks support mixed-voltage interfaces (1.2V to 3.3V) on single device-reduces level-shifter count |
| Embedded Clock Management | Digital Clock Managers (DCMs) provide jitter reduction, phase shifting, and frequency synthesis for synchronous subsystems |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time preprocessing of 1080p60 video streams from CMOS sensors before transmission to host CPU. IC Role / Device Role / Timing Role: FPGA acts as pixel-level pipeline accelerator with programmable ROI cropping, gamma correction, and Bayer demosaicing. Use Value: Offloads 85% of image processing from host processor while maintaining sub-10 µs end-to-end latency per frame. | Use Scenario: Interfacing ultrasound probe arrays to digital beamformer ASICs via serialized LVDS links. IC Role / Device Role / Timing Role: XC6SLX75T-2CSG484C serves as serializer/deserializer bridge with precise skew calibration between 32-channel parallel ADC outputs. Use Value: Enables deterministic 2.5 Gb/s channel bonding with <±75 ps inter-lane skew tolerance across temperature range. |
| Avionics Data Concentrator | Programmable Logic Controller (PLC) |
Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals into unified Ethernet/IP packet stream. IC Role / Device Role / Timing Role: FPGA implements protocol translation engines, time-stamped buffering, and cyclic redundancy checking for safety-critical bus monitoring. Use Value: Meets DO-254 Level A design assurance requirements with traceable RTL and dual-lockstep watchdog logic. | Use Scenario: Executing deterministic ladder logic scans at 100 µs cycle time across 256 I/O points in harsh factory environments. IC Role / Device Role / Timing Role: XC6SLX75T-2CSG484C hosts soft-core MicroBlaze processor plus custom I/O co-processors for analog conditioning and PWM generation. Use Value: Achieves 99.999% uptime with field-upgradable logic and hot-swap I/O bank reconfiguration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture, 2,565k logic cells, 24 GTY transceivers @ 32.75 Gb/s, higher power and cost | Targets 400G Ethernet, AI inference acceleration, and radar beamforming-not suitable for cost-sensitive industrial control | Select only when >10× logic density and PCIe Gen4/100G KR support are mandatory |
| XC7A75T-2FGG484I | Artix-7 family, 74,000 logic cells, no transceivers, lower static power, -2 speed grade, same 484-pin package footprint | Used where serial connectivity is handled externally; better for low-power deterministic control without high-speed SerDes | Prefer when transceiver functionality is unnecessary and thermal budget is constrained below 4.5 W |
Compared with XC6SLX75T-2CSG484C, the XC7A75T-2FGG484I offers identical logic scale but eliminates transceivers to reduce cost and static power, while the XCVU9P-2FLGA2104I delivers 34× more transceiver bandwidth at 4× the logic density-making each alternative optimal only within sharply defined system constraints.
Availability
XC6SLX75T-2CSG484C is available at Aetrix Electronics and suitable for industrial machine vision, avionics data concentrators, and medical imaging interfaces requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX75T-2CSG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software-defined hardware solutions.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable I/O flexibility, moderate logic density, and embedded processing capability-especially in industrial automation and embedded vision.
FAQ
What is the maximum operating junction temperature for XC6SLX75T-2CSG484C?
The XC6SLX75T-2CSG484C has a maximum junction temperature of 100°C under continuous operation, validated per Xilinx DS162 specification. Thermal derating applies above 85°C ambient, and the CSG484 package's exposed thermal pad must be soldered to a solid copper plane for compliance. XC6SLX75T-2CSG484C thermal resistance (θJA) is 22.5°C/W in standard 4-layer board configuration.
Does XC6SLX75T-2CSG484C support partial reconfiguration in production systems?
Yes, XC6SLX75T-2CSG484C supports runtime partial reconfiguration via ICAP interface as documented in UG380. This allows dynamic swapping of logic modules without resetting the entire device. XC6SLX75T-2CSG484C requires specific floorplanning, checkpointed bitstreams, and configuration controller firmware-validated in industrial PLC deployments with <50 ms reconfiguration latency.
What configuration modes does XC6SLX75T-2CSG484C support?
XC6SLX75T-2CSG484C supports Master Serial (SPI flash), Slave SelectMAP (parallel PROM), JTAG boundary-scan, and system-level configuration via microprocessor bus. Mode selection is controlled by M0–M2 pins at power-on reset. XC6SLX75T-2CSG484C also enables dual-boot through external flash partitioning, allowing fallback to known-good bitstream on CRC failure.
Can XC6SLX75T-2CSG484C interface directly with DDR3 SDRAM at 800 Mbps?
Yes, XC6SLX75T-2CSG484C supports DDR3 interfaces up to 800 Mbps per pin using its dedicated memory controller IP and I/O banks configured for SSTL15. XC6SLX75T-2CSG484C requires external termination and careful PCB layout per UG388; verified operation includes 512 MB x16 configurations with 12 ns tRP/tRCD timing compliance.
Is XC6SLX75T-2CSG484C qualified for automotive applications?
No, XC6SLX75T-2CSG484C is rated for industrial temperature range (–40°C to +85°C) and is not AEC-Q100 qualified. It lacks automotive-specific screening, burn-in, or failure rate reporting. For automotive use, AMD recommends the XA Spartan-6 family (e.g., XA6SLX75), which shares logic architecture but includes extended qualification and enhanced reliability testing.
XC6SLX75T-2CSG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 292
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-CSPBGA (19x19)
XC6SLX75T-2CSG484C FAQ
1.How can I place an order for XC6SLX75T-2CSG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-2CSG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-2CSG484C reliable?
The price and inventory of XC6SLX75T-2CSG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-2CSG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-2CSG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-2CSG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-2CSG484C?
XC6SLX75T-2CSG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-2CSG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-2CSG484C?
For technical support, including XC6SLX75T-2CSG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-2CSG484C requirements.
6.How does Aetrix verify that XC6SLX75T-2CSG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-2CSG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-2CSG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-2CSG484C?
All XC6SLX75T-2CSG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-2CSG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-2CSG484C part is unused and in its original packaging.
Return procedure for XC6SLX75T-2CSG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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