AMD XC6SLX75T-2FG676I

Overview

XC6SLX75T-2FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, and 4,032 Kbits of block RAM, packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) with -2 speed grade and industrial temperature range (-40°C to +100°C). It serves as a reconfigurable logic fabric for embedded control, video processing, and communication interface bridging in industrial automation systems.

For engineers reviewing the XC6SLX75T-2FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), LVDS support, integrated clock management (DCM and PLL), and compliance with JESD78 Class II latch-up immunity.

Technical Context

The XC6SLX75T-2FG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL) for clock synthesis, multiplication, phase shifting, and duty-cycle correction across multiple domains.

It supports SelectIO™ standards including LVCMOS, LVTTL, SSTL, HSTL, and differential interfaces such as LVDS, Mini-LVDS, RSDS, and BLVDS. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external SPI flash or processor-controlled interfaces.

Key Specifications

Pinout & Package

XC6SLX75T-2FG676I is housed in a 676-ball Fine-Pitch BGA (FG676) package with 1.0 mm ball pitch, 27 × 27 array, and thermal pad. Pin assignments follow Xilinx UG382 v1.11 and are validated for signal integrity, power delivery, and thermal performance in industrial PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC6SLX75-2FG676I, the XC6SLX75T-2FG676I adds guaranteed industrial temperature operation; compared with XC6SLX100T-2FG676I, it reduces logic cost and power while retaining identical I/O count and packaging - enabling drop-in replacement where design margins allow.

Availability

XC6SLX75T-2FG676I is available at Aetrix Electronics and suitable for industrial motor control, video interface bridging, and communications backplane applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC6SLX75T-2FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family. Xilinx pioneered FPGA architecture and programmable logic solutions for over three decades.

The Spartan-6 family was designed for high-volume, cost-sensitive applications requiring balanced logic density, I/O flexibility, and low-power operation - targeting industrial, automotive, and consumer embedded systems.

FAQ

What is the maximum operating frequency of the XC6SLX75T-2FG676I?

The XC6SLX75T-2FG676I is rated for a -2 speed grade, supporting internal clock frequencies up to 500 MHz under worst-case industrial temperature and voltage conditions. This rating is verified through static timing analysis using Xilinx ISE 14.7 and applies to fully constrained synchronous designs meeting setup/hold requirements.

Does the XC6SLX75T-2FG676I support JTAG boundary-scan testing?

Yes, the XC6SLX75T-2FG676I includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, configuration, and debugging. Pins TCK, TMS, TDI, and TDO are dedicated and electrically compatible with standard JTAG adapters used during PCB assembly validation and field diagnostics.

Can the XC6SLX75T-2FG676I be configured using an external microcontroller?

Yes, the XC6SLX75T-2FG676I supports Slave Serial configuration mode, allowing an external microcontroller to load the configuration bitstream via GPIO pins. This method is commonly used in systems requiring dynamic reconfiguration or secure boot from encrypted flash memory managed by the host processor.

What I/O standards are supported by the XC6SLX75T-2FG676I?

The XC6SLX75T-2FG676I supports 19 SelectIO standards including LVCMOS (1.2 V to 3.3 V), LVTTL, SSTL, HSTL, and differential protocols such as LVDS, Mini-LVDS, RSDS, and BLVDS. Each I/O bank is independently powered, enabling mixed-voltage interface operation on a single device.

Is the XC6SLX75T-2FG676I RoHS compliant and lead-free?

Yes, the XC6SLX75T-2FG676I is manufactured in a RoHS-compliant, lead-free process and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The FG676 package uses matte tin finish on solder balls and conforms to IPC/JEDEC J-STD-006 solderability specifications.