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AMD XC6SLX75T-2FGG484C
- Part No.:
- XC6SLX75T-2FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX75T-2FGG484C.pdf
- Description:
- IC FPGA 268 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,238
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Product details
Overview
XC6SLX75T-2FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, and 4.9 Mb of total block RAM. It operates at -2 speed grade with 1.2 V core voltage and supports LVDS, SSTL, HSTL, and differential I/O standards. It is used in industrial vision systems requiring real-time image preprocessing and parallel data path control.
For engineers reviewing the XC6SLX75T-2FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O bank configuration, embedded memory capacity, and supported I/O standards for high-speed sensor interface design.
Technical Context
The XC6SLX75T-2FGG484C implements a configurable logic fabric based on 6-input LUTs and distributed RAM, with dedicated carry logic for arithmetic. It integrates dual-register flip-flops per slice and supports clock management via DCMs (Digital Clock Managers) with phase shifting and frequency synthesis.
I/O banks are organized into eight groups supporting independent voltage domains (1.2 V to 3.3 V), enabling mixed-voltage interfacing. Each bank supports programmable slew rate, drive strength, and on-die termination for signal integrity optimization in multi-protocol designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom datapath implementation |
| DSP Slices | 180 × DSP48A1 - enables fixed-point multiply-accumulate operations at up to 250 MHz for filtering or motor control |
| Block RAM | 4.9 Mb - supports dual-port buffering, FIFOs, or coefficient storage for real-time processing pipelines |
| I/O Pins | 348 user I/O - provides parallel sensor interface, high-speed serial links, and control bus expansion |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock with typical static timing analysis margins |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption in active mode |
Pinout & Package
XC6SLX75T-2FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 2.5 W under typical industrial operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCO_0 | I/O bank 0 output voltage supply - must be set to match connected peripheral interface standard (e.g., 2.5 V for SSTL18) |
| K20 | CLKIN_1 | Primary single-ended clock input - accepts 10–500 MHz external reference for DCM-based clock generation |
| R15 | M0 | Configuration mode select - sets boot source as Master SPI or Slave SelectMAP during power-up |
| T14 | INIT_B | Open-drain initialization status - asserts low during bitstream loading and releases high upon successful configuration |
| Y16 | GND | Ground reference for analog and digital sections - requires low-inductance connection to PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two Digital Clock Managers provide jitter-reduced clock synthesis, phase alignment, and frequency multiplication/division without external PLL ICs |
| Multi-Voltage I/O Banks | Eight independent I/O banks support simultaneous 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces - eliminates level-shifter components |
| Configurable Logic Blocks | Each CLB contains four 6-LUTs + 8 FFs - enables efficient mapping of both wide logic functions and register-intensive control logic |
| Embedded Memory | 18 Kb block RAM primitives can be configured as true dual-port RAM, ROM, or shift register - accelerates data buffering and lookup tasks |
Applications
| Industrial Machine Vision | Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Real-time pixel-level preprocessing of camera feeds in automated optical inspection (AOI) equipment. IC Role / Device Role / Timing Role: FPGA fabric executes parallel convolution kernels and histogram equalization while DCMs synchronize image capture and display timing. Use Value: 74,880 logic cells enable concurrent execution of multiple image pipelines; 348 I/O pins support direct CMOS sensor and LVDS display interface. | Use Scenario: Deterministic I/O scanning and motion control sequencing in modular PLC backplanes. IC Role / Device Role / Timing Role: Configurable logic implements cyclic executive scheduler and safety-critical watchdog timers; I/O banks interface with 24 V DC field inputs and relay outputs. Use Value: Multi-voltage I/O allows direct connection to legacy 24 V sensors and modern 3.3 V communication modules without external translators. |
| Medical Imaging Interface | Test & Measurement Equipment |
Use Scenario: High-fidelity digitization and protocol translation between ultrasound transducer arrays and host processors. IC Role / Device Role / Timing Role: FPGA routes time-aligned ADC samples, applies channel-specific gain correction, and packages data for PCIe or USB 2.0 transmission. Use Value: 180 DSP48A1 slices perform real-time beamforming calculations; 4.9 Mb block RAM buffers full-frame echo data before host transfer. | Use Scenario: Flexible signal generation and acquisition in automated test systems with mixed analog/digital stimulus requirements. IC Role / Device Role / Timing Role: FPGA generates synchronized multi-channel waveforms and captures response data with sub-ns timestamping using internal counters. Use Value: -2 speed grade ensures deterministic timing for 200+ MHz pattern generation; DCMs lock to external 10 MHz reference for traceable calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-TQG144C | Lower logic density (9,152 LUTs), 100 I/O pins, TQFP-144 package - reduced routing flexibility and no multi-bank voltage support | Suitable only for simple control logic or low-channel-count sensor aggregation | Select when cost and board space constrain design, and performance requirements fall below XC6SLX75T-2FGG484C capability |
| XC7A35T-CPG236C | Artix-7 architecture with 33,280 logic cells, 90 DSP slices, 2.1 Mb BRAM, and native PCI Express® endpoint support | Better suited for designs requiring integrated PCIe, higher DSP throughput, or lower static power in extended temperature ranges | Choose for new designs targeting longer lifecycle, enhanced I/O bandwidth, or migration path to 7-series toolflow |
Compared with XC6SLX75T-2FGG484C, XC6SLX9-TQG144C offers lower cost but lacks sufficient resources for multi-sensor fusion, while XC7A35T-CPG236C delivers architectural improvements and PCIe integration at higher unit cost and different pin compatibility.
Availability
XC6SLX75T-2FGG484C is available at Aetrix Electronics and suitable for industrial automation, medical imaging interface, and test & measurement equipment requiring stable component supply across long production lifecycles.
Supply support for XC6SLX75T-2FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low-power logic implementation, flexible I/O, and reliable configuration security - particularly in industrial and automotive subsystems.
FAQ
What is the maximum operating frequency of the XC6SLX75T-2FGG484C?
The XC6SLX75T-2FGG484C is rated at speed grade -2, guaranteeing reliable operation up to 500 MHz for internal logic paths under typical industrial temperature and voltage conditions. Actual achievable frequency depends on design complexity, placement, and routing; timing reports generated by Vivado or ISE tools confirm functional closure for each specific implementation of XC6SLX75T-2FGG484C.
Does the XC6SLX75T-2FGG484C support JTAG boundary-scan testing?
Yes, the XC6SLX75T-2FGG484C includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug access. Pins TCK, TMS, TDI, and TDO are dedicated to this interface and function independently of user I/O configuration, enabling in-system verification and fault isolation during manufacturing and field service of XC6SLX75T-2FGG484C-based boards.
Can the XC6SLX75T-2FGG484C be configured via SPI flash memory?
Yes, the XC6SLX75T-2FGG484C supports Master SPI configuration mode, allowing automatic loading of the bitstream from industry-standard serial NOR flash devices (e.g., Micron, Winbond, Macronix) upon power-up. This mode uses dedicated CONFIG_IO pins and requires proper pull-up/pull-down resistor settings on M0–M2 pins to select SPI as the configuration source for XC6SLX75T-2FGG484C.
What thermal considerations apply to the XC6SLX75T-2FGG484C in continuous operation?
The XC6SLX75T-2FGG484C has a maximum junction temperature of 100°C and requires a thermal solution capable of dissipating up to 2.5 W under worst-case operating conditions. PCB layout must include adequate copper pour, thermal vias under the exposed pad (if present), and airflow clearance; thermal performance validation should use the θJA value of 23.5°C/W specified in the XC6SLX75T-2FGG484C datasheet.
Is the XC6SLX75T-2FGG484C compatible with Xilinx ISE Design Suite?
Yes, the XC6SLX75T-2FGG484C is fully supported by Xilinx ISE Design Suite 14.7, the final official tool release for Spartan-6 devices. While Vivado does not support Spartan-6, ISE provides complete synthesis, implementation, and bitstream generation for XC6SLX75T-2FGG484C - including DRC checking, timing analysis, and configuration file generation.
XC6SLX75T-2FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 268
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX75T-2FGG484C FAQ
1.How can I place an order for XC6SLX75T-2FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-2FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-2FGG484C reliable?
The price and inventory of XC6SLX75T-2FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-2FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-2FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-2FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-2FGG484C?
XC6SLX75T-2FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-2FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-2FGG484C?
For technical support, including XC6SLX75T-2FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-2FGG484C requirements.
6.How does Aetrix verify that XC6SLX75T-2FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-2FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-2FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-2FGG484C?
All XC6SLX75T-2FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-2FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-2FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX75T-2FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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