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AMD XC6SLX75T-2FGG484I

Part No.:
XC6SLX75T-2FGG484I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC6SLX75T-2FGG484I.pdf
Description:
IC FPGA 268 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:109

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Product details

Overview

XC6SLX75T-2FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and -2 speed grade, configured in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package for high-density I/O routing in industrial control systems.

For engineers reviewing the XC6SLX75T-2FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), embedded block RAM (3,584 kbits), DSP48A1 slices (180), and temperature range (-40°C to +100°C).

Technical Context

The XC6SLX75T-2FGG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated clock management including DCM and PLL blocks supporting frequency synthesis and phase alignment. It integrates 180 DSP48A1 slices for arithmetic-intensive tasks and supports LVDS, SSTL, HSTL, and TMDS I/O standards.

This device includes 348 user-configurable I/O pins distributed across 12 banks, each supporting independent VCCO and reference voltage (VREF) settings. Configuration is performed via SPI, BPI, or JTAG interfaces, with support for dual-boot and fallback modes.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells74,880 - total programmable logic capacity for combinational and sequential logic implementation
User I/O Pins348 - supports high-pin-count interface bridging and parallel bus expansion
Block RAM3,584 kbits - enables local data buffering, FIFOs, and small memory tables without external SRAM
DSP Slices180 DSP48A1 - provides fixed-point multiply-accumulate operations at up to 250 MHz
Speed Grade-2 - guarantees timing closure at maximum operating frequencies per device-specific timing tables
Operating Temp-40°C to +100°C - qualified for extended industrial environments with thermal cycling resilience
Package484-pin FGG (Fine-Pitch BGA) - 23×23 mm body, 1.0 mm ball pitch, RoHS-compliant

Pinout & Package

XC6SLX75T-2FGG484I is housed in a 484-ball Fine-Pitch Ball Grid Array (FGG) package with 348 user I/Os, 10 configuration pins, 8 dedicated clock inputs, and power/ground distribution optimized for signal integrity and thermal dissipation.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration ClockDrives internal configuration shift register during master SPI/BPI mode; requires stable 50 MHz max
DINConfiguration Data InSerial data input for master SPI configuration; tied high when unused
PROGRAM_BInitiate ReconfigurationActive-low asynchronous reset that clears configuration memory and restarts boot process
INIT_BConfiguration StatusOpen-drain output indicating configuration completion or error condition
DoneConfiguration CompletionPush-pull output asserted high when bitstream loading and startup sequence complete

Key Features

FeatureDesign Value
Integrated Memory ControllerSupports DDR2/DDR3 SDRAM up to 800 Mbps with built-in calibration and timing closure assistance
Dual-Mode PCI Express EndpointConfigurable as x1 Gen1 endpoint with integrated PHY and transaction layer for host communication
Low-Power ArchitectureDynamic power gating and clock enable controls reduce active power by up to 40% vs. prior Spartan families
ISE Design Suite SupportFully compatible with Xilinx ISE 14.7 toolchain for synthesis, place-and-route, and bitstream generation
Multi-Boot CapabilityEnables field-upgradable firmware via dual-bitstream storage and watchdog-controlled failover

Applications

Industrial Motor ControlVideo Interface Bridge

Use Scenario: Real-time closed-loop servo control with encoder feedback, PWM generation, and safety monitoring.

IC Role / Device Role / Timing Role: FPGA acts as deterministic real-time controller with sub-microsecond interrupt latency and synchronized PWM outputs.

Use Value: Enables 12-axis coordinated motion using on-chip DSP slices and 348 I/Os for sensor/actuator interfacing without external glue logic.

Use Scenario: Converting HDMI 1.3a video streams to LVDS for embedded display panels in medical imaging equipment.

IC Role / Device Role / Timing Role: Protocol translator and timing adapter with pixel-clock domain crossing and embedded sync detection.

Use Value: Leverages 180 DSP48A1 slices for color-space conversion and 348 I/Os for parallel LVDS lane routing at 165 MHz pixel clock.

Programmable Logic PLCCommunications Backplane Interface

Use Scenario: Replacement for fixed-function ASIC-based PLC modules requiring field-reconfigurable I/O mapping and ladder logic execution.

IC Role / Device Role / Timing Role: Configurable logic engine executing IEC 61131-3 code with deterministic scan-cycle timing and hot-swap I/O bank support.

Use Value: Provides 74,880 logic cells for multi-tasking ladder logic and 12 I/O banks with independent VCCO for mixed-voltage sensor/actuator integration.

Use Scenario: Interfacing legacy parallel backplane buses (e.g., VME64x) to modern PCIe-based processing nodes in test instrumentation racks.

IC Role / Device Role / Timing Role: High-speed protocol bridge with clock domain isolation and packetized data reformatting.

Use Value: Uses -2 speed grade timing margin and 3,584 kbits block RAM for deep packet buffering during asynchronous bus handshaking.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX9-TQG144CLower density (7,680 logic cells), 102 user I/Os, TQFP-144 package, commercial temp (0°C to +85°C)Suitable for cost-sensitive, low-I/O prototyping; lacks transceivers and DDR3 controllerSelect when design scale fits within 10k LUTs and board space constraints favor TQFP over BGA
XC7S25-1CSGA225IArtix-7 family, 23,000 logic cells, 100 user I/Os, -1 speed grade, CSGA225 package, same industrial temp rangeIncludes 2.5 Gb/s transceivers and improved DSP efficiency but fewer I/Os and no native DDR3 controllerChoose for higher serial bandwidth needs and lower static power, accepting reduced I/O count and revised toolflow (Vivado vs. ISE)

Compared with XC6SLX75T-2FGG484I, the XC6SLX9-TQG144C offers lower cost and simpler assembly but sacrifices I/O count and memory bandwidth, while the XC7S25-1CSGA225I delivers superior serial performance and power efficiency at the expense of legacy toolchain compatibility and I/O scalability.

Availability

XC6SLX75T-2FGG484I is available at Aetrix Electronics and suitable for industrial motor control, video interface bridging, and programmable logic PLC applications requiring stable component supply and long-term lifecycle assurance.

Supply support for XC6SLX75T-2FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Spartan-6 family was designed for high-volume, cost-sensitive applications demanding reliable performance, low power, and seamless integration with legacy interfaces and memory standards.

FAQ

What is the maximum supported memory interface speed for XC6SLX75T-2FGG484I?

The XC6SLX75T-2FGG484I supports DDR2-800 and DDR3-800 memory interfaces with a maximum data rate of 800 Mbps per pin. Its integrated memory controller includes hardware-calibrated delay chains and dynamic phase alignment to maintain timing margins across voltage and temperature variations. This capability is validated in Xilinx UG388 and applies specifically to the XC6SLX75T-2FGG484I's -2 speed grade and FGG484 package.

Does XC6SLX75T-2FGG484I support PCI Express Gen1 x1 endpoints?

Yes, XC6SLX75T-2FGG484I includes a hard IP block for PCI Express Gen1 x1 endpoint functionality, with integrated PHY and transaction layer compliant with PCI-SIG specification v1.1. The implementation requires no external transceivers and supports MSI and legacy INTx interrupts. This feature is documented in Xilinx DS162 and enabled only in the LX75T variant, not smaller Spartan-6 devices.

What configuration modes are supported by XC6SLX75T-2FGG484I?

XC6SLX75T-2FGG484I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Master SPI is most common for single-device designs using on-board flash, while JTAG enables boundary-scan testing and in-system programming. All modes are electrically and functionally verified per Xilinx UG380, with PROGRAM_B and INIT_B signals providing robust reconfiguration control.

Is XC6SLX75T-2FGG484I qualified for automotive applications?

No, XC6SLX75T-2FGG484I is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific screening, failure-in-time (FIT) reporting, and enhanced ESD protection required for automotive ECUs. For automotive use, Xilinx recommends the Spartan-6Q family variants with extended qualification and traceability documentation.

Can XC6SLX75T-2FGG484I be programmed using Vivado Design Suite?

No, XC6SLX75T-2FGG484I requires Xilinx ISE Design Suite 14.7 for full synthesis, implementation, and bitstream generation. Vivado does not support Spartan-6 architecture due to fundamental toolchain divergence. Attempting to use Vivado results in unrecognized device errors. ISE 14.7 remains the only officially supported and validated toolflow for the XC6SLX75T-2FGG484I.

XC6SLX75T-2FGG484I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LXT
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
268
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC6SLX75T-2FGG484I FAQ

1.How can I place an order for XC6SLX75T-2FGG484I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX75T-2FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX75T-2FGG484I reliable?

The price and inventory of XC6SLX75T-2FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-2FGG484I is usually 5 days.

3.What payment methods are accepted for XC6SLX75T-2FGG484I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-2FGG484I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX75T-2FGG484I?

XC6SLX75T-2FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX75T-2FGG484I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX75T-2FGG484I?

For technical support, including XC6SLX75T-2FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-2FGG484I requirements.

6.How does Aetrix verify that XC6SLX75T-2FGG484I is sourced from the original manufacturer or authorized distributors?

All XC6SLX75T-2FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-2FGG484I meets industry standards.

7.What is the process for return or replacement of XC6SLX75T-2FGG484I?

All XC6SLX75T-2FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-2FGG484I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX75T-2FGG484I part is unused and in its original packaging.

Return procedure for XC6SLX75T-2FGG484I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX75T-2FGG484I Tags

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