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AMD XC6SLX75T-2FGG676C
- Part No.:
- XC6SLX75T-2FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX75T-2FGG676C.pdf
- Description:
- IC FPGA 348 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,071
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Product details
Overview
XC6SLX75T-2FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, and 3.2 MB of total block RAM. It operates at -2 speed grade (1.2 V core, 1.2 GHz I/O), housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package, and targets high-reliability industrial control and embedded vision systems.
For engineers reviewing the XC6SLX75T-2FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (480 user I/Os), differential signaling support (LVDS, TMDS), and temperature range (-40°C to +100°C).
Technical Context
The XC6SLX75T-2FGG676C implements a configurable logic fabric with six-input LUTs, distributed RAM, and shift registers. It integrates dedicated clock management resources including DCMs and PLLs for jitter reduction and frequency synthesis across multiple domains.
It supports SelectIO™ technology with programmable drive strength, slew rate, and on-die termination for interfacing with DDR2/DDR3 SDRAM, PCI Express Gen1, and parallel video standards. Configuration occurs via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 3,204 kbits - supports large FIFOs, frame buffers, or lookup tables without external memory |
| DSP Slices | 180 × DSP48A1 - enables fixed-point multiply-accumulate operations up to 250 MHz |
| User I/O Pins | 480 - provides high-density interface routing for multi-protocol connectivity |
| Speed Grade | -2 - guarantees timing closure at 1.2 GHz I/O toggle rate and 667 MHz DDR3 interface |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
| Core Voltage | 1.2 V ±3% - requires tight-regulation power delivery with low-noise decoupling |
Pinout & Package
XC6SLX75T-2FGG676C is packaged in a 676-ball FCBGA (Fine-Pitch Ceramic Ball Grid Array) with 1.0 mm ball pitch, 27 × 27 array, and thermal lid. Package dimensions are 27 mm × 27 mm × 2.33 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during Master SPI mode; must be stable before INIT_B assertion |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating readiness for configuration or error condition |
| PROGRAM_B | Configuration Reset Input | Asynchronous active-low reset that clears configuration memory and restarts boot sequence |
| DONE | Configuration Completion Output | Open-drain signal pulled high when bitstream loading and startup sequence complete successfully |
| M0–M2 | Mode Selection Inputs | Set configuration mode (SPI, BPI, JTAG, etc.) at power-on; sampled on PROGRAM_B release |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCM and PLL | Enables clock multiplication, phase shifting, and jitter filtering for synchronous system timing |
| SelectIO™ Technology | Supports 18 I/O standards including LVDS, SSTL, HSTL, and differential signaling with programmable termination |
| PCI Express Endpoint | Hard IP block compliant with PCIe Gen1 x1/x2/x4 for low-latency host communication |
| Embedded Memory | 3.2 MB block RAM + distributed RAM allows full-frame image buffering in vision pipelines |
| MultiBoot Support | Allows field-upgradable dual-image configuration with fail-safe fallback to known-good bitstream |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements deterministic PID controllers and high-speed quadrature decoding with sub-microsecond latency. Use Value: 480 user I/Os enable direct connection to multiple axis drivers and safety I/O modules without glue logic. | Use Scenario: High-bandwidth acquisition and preprocessing of ultrasound or endoscopic video streams. IC Role / Device Role / Timing Role: XC6SLX75T-2FGG676C acts as pixel pipeline accelerator with parallel LVDS receivers and line-buffered FIR filtering. Use Value: 180 DSP48A1 slices deliver real-time beamforming calculations at 100+ MHz sample rates. |
| Avionics Data Concentrator | Test & Measurement Instrumentation |
Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553, and discrete I/O in flight control systems. IC Role / Device Role / Timing Role: Configurable logic handles time-triggered message scheduling and CRC validation with deterministic response under DO-254 compliance. Use Value: -40°C to +100°C operating range meets extended environmental qualification for airborne electronics. | Use Scenario: High-resolution waveform generation and analysis in automated test equipment (ATE) platforms. IC Role / Device Role / Timing Role: XC6SLX75T-2FGG676C synchronizes DAC/ADC sampling clocks, manages pattern memory, and executes real-time pass/fail decision logic. Use Value: 74,880 logic cells support complex digital pattern generators with deep memory addressing and jitter-free triggering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-2FGG900C | Higher logic density (147,443 LCs), larger package (900-ball FCBGA), +25% DSP slices | Better suited for multi-channel video analytics or radar beamforming requiring >100k LCs | Select when design scales beyond XC6SLX75T-2FGG676C capacity but retains Spartan-6 toolchain compatibility |
| XC7A75T-2FGG484I | Artix-7 architecture, higher performance per watt, 2.5x more block RAM, no native PCIe Gen1 hard IP | Preferred for new designs needing lower power or DDR3/PCIe Gen2, but requires Vivado migration | Choose for greenfield projects where long-term roadmap and power efficiency outweigh legacy toolchain retention |
Compared with XC6SLX75T-2FGG676C, the XC6SLX150T-2FGG900C offers scalable logic headroom within the same family, while the XC7A75T-2FGG484I delivers architectural improvements at the cost of toolchain transition-both require PCB redesign due to incompatible packages and pinouts.
Availability
XC6SLX75T-2FGG676C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interfaces, and avionics data concentrators requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX75T-2FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets following its acquisition of Xilinx in 2022.
The Spartan-6 family was designed for cost-sensitive, high-volume embedded applications requiring balanced logic density, I/O flexibility, and industrial temperature operation-targeting control, interface, and vision systems.
FAQ
What is the maximum supported DDR3 data rate for XC6SLX75T-2FGG676C?
The XC6SLX75T-2FGG676C supports DDR3 SDRAM interfaces up to 800 Mbps data rate (400 MHz clock) using its SelectIO™ resources with calibrated output drivers and input delay chains. This capability is validated in Xilinx UG381 and applies directly to the XC6SLX75T-2FGG676C's -2 speed grade and industrial temperature range.
Does XC6SLX75T-2FGG676C include hard IP for PCI Express?
Yes, XC6SLX75T-2FGG676C integrates a hard PCIe Endpoint block compliant with PCI Express Base Specification v1.1 (Gen1), supporting x1, x2, and x4 lane configurations. This IP is factory-configured and does not consume logic resources, enabling low-latency host communication without soft-core implementation overhead.
What configuration modes are supported by XC6SLX75T-2FGG676C?
XC6SLX75T-2FGG676C supports Master SPI, Slave Serial, Slave Parallel (BPI), and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset, and all modes are fully documented in Xilinx UG380. The XC6SLX75T-2FGG676C also supports MultiBoot for dual-bitstream field updates.
Is XC6SLX75T-2FGG676C qualified for automotive applications?
No, XC6SLX75T-2FGG676C is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific screening, failure-in-time (FIT) reporting, and enhanced ESD/latch-up immunity required for automotive ECUs. For automotive use, consider Xilinx Automotive-grade Spartan-6 variants like XC6SLX75T-2FGG676I.
What is the total number of user I/O pins available on XC6SLX75T-2FGG676C?
XC6SLX75T-2FGG676C provides 480 user-configurable I/O pins in its 676-ball FCBGA package. These support single-ended and differential standards including LVDS, TMDS, and SSTL, with programmable drive strength, slew rate, and on-die termination-enabling direct interface to sensors, displays, and memory without level-shifting components.
XC6SLX75T-2FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 348
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX75T-2FGG676C FAQ
1.How can I place an order for XC6SLX75T-2FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-2FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-2FGG676C reliable?
The price and inventory of XC6SLX75T-2FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-2FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-2FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-2FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-2FGG676C?
XC6SLX75T-2FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-2FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-2FGG676C?
For technical support, including XC6SLX75T-2FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-2FGG676C requirements.
6.How does Aetrix verify that XC6SLX75T-2FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-2FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-2FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-2FGG676C?
All XC6SLX75T-2FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-2FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-2FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX75T-2FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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