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AMD XC6SLX75T-2FGG676I
- Part No.:
- XC6SLX75T-2FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX75T-2FGG676I.pdf
- Description:
- IC FPGA 348 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,939
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Product details
Overview
XC6SLX75T-2FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and embedded Block RAM totaling 3,001 kbits. It features 480 user I/Os in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package and operates across industrial temperature range (–40°C to +100°C). It is deployed in high-reliability industrial control and video processing systems requiring deterministic timing and low-power reconfigurable logic.
For engineers reviewing the XC6SLX75T-2FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver speed, logic density, thermal rating, and industrial-grade qualification status.
Technical Context
The XC6SLX75T-2FGG676I implements a synchronous, SRAM-based configurable logic fabric with six-input LUTs, dedicated carry chains, and integrated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It includes eight RocketIO GTP transceivers operating up to 3.2 Gb/s with built-in 8B/10B encoding and elastic buffers.
Configuration is performed via Master SelectMAP or JTAG mode using external SPI flash or PROM. The device supports partial reconfiguration and includes internal clock management with DCMs providing phase shifting, frequency synthesis, and duty cycle correction for up to 16 clock outputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 3,001 kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external memory interface |
| Max I/O Count | 480 - supports high-pin-count interfaces including parallel video, PCI Express x1, and multi-channel ADC/DAC buses |
| GTP Transceiver Speed | 3.2 Gb/s - enables serial video (SDI), Gigabit Ethernet PHY, or JESD204B link implementation |
| Operating Temp | –40°C to +100°C - qualified for extended industrial environments without derating or forced cooling |
| Package | 676-pin FGG - 27×27 mm fine-pitch FBGA with 1.0 mm ball pitch, compatible with standard SMT reflow profiles |
| Speed Grade | -2 - guarantees timing closure at worst-case voltage/temperature corners for critical paths up to specified max frequency |
Pinout & Package
XC6SLX75T-2FGG676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FGG) package with 1.0 mm ball pitch and 27×27 mm body size. Thermal pad is exposed on underside for enhanced heat dissipation in high-utilization designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Power | Supplies output driver voltage for Bank 0; sets LVCMOS/LVDS signaling levels independently per bank |
| VRN_1 / VRP_1 | Input Reference | Provides on-die termination reference for differential inputs in Bank 1; eliminates external resistors |
| CLKIN_2 | Primary Clock Input | Dedicated global clock input feeding DCMs; supports single-ended or differential (LVDS/LVPECL) sources |
| M0–M2 | Mode Pins | Configure boot source (SPI/JTAG/SelectMAP); sampled at power-up, not reprogrammable during operation |
| INIT_B | Configuration Status | Open-drain active-low signal indicating configuration memory readiness or error during startup |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DSP48A1 Slices | 18×18-bit multiplier + accumulator with pipeline registers; enables real-time FIR filtering and FFT computation |
| Dual-Range VCCO Support | 1.2 V to 3.3 V per I/O bank; allows mixed-voltage interfacing with legacy and modern peripherals |
| DCM Clock Management | Two DCMs per device with jitter reduction, phase alignment, and frequency synthesis; eliminates need for external clock ICs |
| Partial Reconfiguration | Enables dynamic logic swapping without full device reset; reduces system downtime in mission-critical applications |
| Industrial Temperature Rating | –40°C to +100°C operation verified per AEC-Q100 Class 3; supports uncooled deployment in factory automation |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop execution and multi-axis trajectory interpolation in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers and encoder interface logic with sub-microsecond latency. Use Value: Deterministic timing and 480 I/Os enable simultaneous control of 12+ axes with synchronized PWM and position capture. | Use Scenario: High-speed data aggregation from ultrasound or MRI sensor arrays before transmission to host processor. IC Role / Device Role / Timing Role: XC6SLX75T-2FGG676I acts as a parallel-to-serial bridge with embedded FIFO buffering and JESD204B encoding. Use Value: On-chip Block RAM and 3.2 Gb/s GTP transceivers eliminate external serializer ICs and reduce PCB layer count. |
| Avionics Data Concentrator | Video Broadcast Encoder |
Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals in airborne line-replaceable units. IC Role / Device Role / Timing Role: XC6SLX75T-2FGG676I serves as protocol translation hub with deterministic arbitration and time-stamped logging. Use Value: Industrial temperature rating and radiation-tolerant design (per Xilinx reliability reports) support DO-254 compliance without shielding. | Use Scenario: SDI/HDMI video stream encoding with color space conversion and on-the-fly compression in broadcast equipment. IC Role / Device Role / Timing Role: Configurable logic implements pixel-rate timing generators, chroma subsampling, and HD-SDI serialization. Use Value: 74,880 logic cells and dual DCMs allow full HD (1080p60) processing pipeline with <1-line latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX95T-2FGG676I | Higher logic density (94,080 LCs), same package and speed grade; larger die area increases static power by ~18% | Required when >74K LCs needed for complex control algorithms or additional protocol stacks | Select only if design exceeds XC6SLX75T-2FGG676I resource utilization; no pin change but requires thermal reassessment |
| XCKU035-2FFVA676E | Kintex UltraScale architecture; 216,000 logic cells, 16.3 Gb/s GTY transceivers, different pinout and voltage rails | Targets next-generation systems needing PCIe Gen3, 10G Ethernet, or higher bandwidth than GTP supports | Not drop-in; requires new PCB layout, power delivery redesign, and toolchain migration to Vivado 2019.2+ |
Compared with XC6SLX75T-2FGG676I, XC6SLX95T-2FGG676I offers headroom within identical footprint and tooling, while XCKU035-2FFVA676E delivers generational bandwidth and logic scale at cost of full hardware and software requalification.
Availability
XC6SLX75T-2FGG676I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, avionics data concentration, and broadcast video encoding requiring stable component supply across extended temperature ranges.
Supply support for XC6SLX75T-2FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 product family for long-lifecycle industrial and aerospace applications.
The Spartan-6 family was designed for cost-sensitive, power-efficient, high-reliability embedded control and interface bridging where ASIC development cycles are prohibitive.
FAQ
What is the maximum supported I/O standard for XC6SLX75T-2FGG676I?
XC6SLX75T-2FGG676I supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS, BLVDS, and RSDS across its 480 user I/Os. Each of the 12 I/O banks can be independently configured for 1.2 V to 3.3 V VCCO, enabling mixed-voltage board designs without level shifters. The device does not support DDR4 or MIPI I/O standards.
Does XC6SLX75T-2FGG676I support partial reconfiguration?
Yes, XC6SLX75T-2FGG676I supports partial reconfiguration through Xilinx ISE Design Suite 14.7 tools. This allows dynamic swapping of logic modules-such as communication protocol engines or filter coefficients-without resetting the entire device. Implementation requires dedicated floorplanning, checkpointed bitstreams, and use of the ICAP interface, all validated in Xilinx UG380.
What configuration modes are available for XC6SLX75T-2FGG676I?
XC6SLX75T-2FGG676I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial (SPI) configuration modes. Mode selection is controlled by M0–M2 pins at power-up. SPI mode uses external 4-/16-Mbit SPI flash; JTAG is used for debugging and programming during development. Configuration is one-time per power cycle unless reinitiated via PROG_B.
Is XC6SLX75T-2FGG676I qualified for automotive applications?
No, XC6SLX75T-2FGG676I is rated for industrial temperature (–40°C to +100°C) and is not AEC-Q100 qualified. While it meets extended temperature requirements, it lacks automotive-specific reliability testing such as HTOL, ESD, and latch-up validation per AEC standards. For automotive use, Xilinx recommends Spartan-6Q devices with Q-grade screening.
What clock resources are integrated into XC6SLX75T-2FGG676I?
XC6SLX75T-2FGG676I integrates two Digital Clock Managers (DCMs) per device, each supporting input frequency multiplication/division, phase shifting (±0.5 ns resolution), duty cycle correction, and jitter reduction. DCM outputs feed global clock networks with skew <150 ps. No PLLs are present; DCMs are the sole on-chip clock synthesis resource.
XC6SLX75T-2FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 348
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX75T-2FGG676I FAQ
1.How can I place an order for XC6SLX75T-2FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-2FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-2FGG676I reliable?
The price and inventory of XC6SLX75T-2FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-2FGG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-2FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-2FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-2FGG676I?
XC6SLX75T-2FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-2FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-2FGG676I?
For technical support, including XC6SLX75T-2FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-2FGG676I requirements.
6.How does Aetrix verify that XC6SLX75T-2FGG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-2FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-2FGG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-2FGG676I?
All XC6SLX75T-2FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-2FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-2FGG676I part is unused and in its original packaging.
Return procedure for XC6SLX75T-2FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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