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AMD XC6SLX75T-3CSG484C
- Part No.:
- XC6SLX75T-3CSG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, CSPBGA
- Datasheet:
-
XC6SLX75T-3CSG484C.pdf
- Description:
- IC FPGA 292 I/O 484CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,574
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Product details
Overview
XC6SLX75T-3CSG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and embedded Block RAM totaling 3,001 kbits. It operates at -3 speed grade (fastest in Spartan-6 family) and supports LVDS, SSTL, and HSTL I/O standards. Used in industrial imaging systems requiring real-time pixel processing and low-latency interface bridging.
For engineers reviewing the XC6SLX75T-3CSG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility (1.2 V to 3.3 V), integrated DSP48A1 slices for arithmetic acceleration, and support for PCI Express x1 Gen1 endpoint configuration.
Technical Context
The XC6SLX75T-3CSG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for high-speed arithmetic. It integrates eight 18×18 multipliers and 128 DSP48A1 slices for fixed-point computation.
It features six clock management tiles (CMTs), each containing a DCM and PLL, supporting phase alignment, frequency synthesis, and jitter reduction across multiple clock domains. The device includes 24 transceiver quads supporting up to 3.2 Gb/s per lane with built-in 8B/10B encoding.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Block RAM | 3,001 kbits - provides on-chip memory for FIFOs, frame buffers, or lookup tables without external SRAM |
| Speed Grade | -3 - enables operation at highest timing performance within Spartan-6 family (e.g., 500 MHz system clock) |
| Transceiver Speed | 3.2 Gb/s - supports high-speed serial links including SATA, PCIe Gen1, and custom protocols |
| I/O Standards | LVDS, SSTL-2, HSTL-I, LVCMOS - allows direct interfacing with DDR2 memory, image sensors, and FPD-Link sources |
| DSP Slices | 128 × DSP48A1 - delivers 18×18 signed multiplication and accumulation per slice for video filtering or motor control |
Pinout & Package
XC6SLX75T-3CSG484C is housed in a 484-pin CSG (Chip-Scale Grid Array) package with 0.8 mm pitch, 19×19 array, and 296 user I/O pins. Thermal pad exposed on underside for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCO_0 | I/O bank 0 power supply - sets output voltage level (1.2–3.3 V) for associated pins |
| M20 | CLKIN1_P | Differential primary clock input - feeds CMT for system timing generation and synchronization |
| T15 | IO_L1P_0 | Bank 0 LVDS positive input - used for high-speed differential data acquisition from CMOS image sensors |
| R14 | MGTREFCLK0P | Transceiver reference clock input - required for stable 3.2 Gb/s serial link operation |
| U13 | GND | Ground reference - critical for signal integrity and transceiver jitter performance |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express Endpoint | Hard IP block supporting x1 Gen1 - eliminates need for soft-core implementation and reduces resource usage |
| Multi-Voltage I/O Banks | 12 independent banks with programmable VCCO - enables mixed-voltage interface to DDR2, CMOS sensors, and legacy peripherals |
| Embedded Configuration Memory | On-chip PROM for single-image bitstream storage - simplifies boot process and removes external SPI flash dependency |
| Power-Down Mode | Supports selective shutdown of unused I/O banks and clock regions - reduces static power by up to 40% in idle states |
Applications
| Industrial Machine Vision | Medical Endoscopy Imaging |
|---|---|
Use Scenario: Real-time Bayer pattern demosaicing and edge enhancement on high-resolution endoscope video streams. IC Role / Device Role / Timing Role: Configurable pixel pipeline processor with synchronized parallel I/O for sensor interface and HDMI output timing control. Use Value: Enables sub-10 µs latency between sensor capture and display-ready frame using on-chip Block RAM and DSP48A1 slices. | Use Scenario: High-speed conversion of analog video signals from CCD-based fluoroscopy detectors into digital 10-bit YUV format. IC Role / Device Role / Timing Role: Digital front-end controller managing ADC interface, line buffering, and chroma subsampling with precise clock domain crossing. Use Value: Achieves 720p60 real-time processing using 240 kbits of dedicated Block RAM per frame buffer segment. |
| Avionics Data Concentrator | Test & Measurement Signal Generator |
Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control computers. IC Role / Device Role / Timing Role: Deterministic real-time bridge with time-triggered scheduling and hardware CRC validation per channel. Use Value: Meets DO-254 Level A timing constraints with guaranteed <500 ns interrupt latency via dedicated interrupt controller resources. | Use Scenario: Generation of calibrated analog waveforms (sine, square, arbitrary) using high-speed DACs controlled by FPGA logic. IC Role / Device Role / Timing Role: Precision waveform sequencer coordinating DAC update clocks, trigger inputs, and amplitude modulation registers. Use Value: Delivers 14-bit ENOB at 100 MS/s using internal clock management and jitter-cleaned sampling clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG484C | Higher logic density (147,443 LCs), same -3 speed grade, identical CSG484 package footprint | Supports larger video pipelines and dual-channel PCIe endpoints; requires higher power and thermal margin | Choose when expanding functionality beyond XC6SLX75T-3CSG484C capacity without PCB redesign |
| XC7A75T-2CSG324I | Artix-7 architecture, 75K logic cells, -2 speed grade, smaller 324-pin CSG package, no transceivers | Lacks 3.2 Gb/s serial I/O but offers improved DSP efficiency and lower static power | Prefer for cost-sensitive, power-constrained designs where high-speed serial links are not required |
Compared with XC6SLX75T-3CSG484C, XC6SLX150T-3FGG484C provides scalable logic headroom in same package, while XC7A75T-2CSG324I trades transceiver capability for lower power and newer architecture-both require evaluation of I/O count, thermal envelope, and toolchain compatibility.
Availability
XC6SLX75T-3CSG484C is available at Aetrix Electronics and suitable for industrial machine vision, avionics data concentrators, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX75T-3CSG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families.
The Spartan-6 family, including XC6SLX75T-3CSG484C, was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and embedded memory-targeting industrial control, video processing, and communications infrastructure.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX75T-3CSG484C?
XC6SLX75T-3CSG484C supports I/O voltages from 1.2 V to 3.3 V across its 12 independently powered banks. Each bank's VCCO can be set individually, enabling simultaneous interfacing with DDR2 memory (1.8 V), CMOS image sensors (2.5 V), and legacy TTL peripherals (3.3 V) without level shifters.
Does XC6SLX75T-3CSG484C include hard IP for PCI Express?
Yes, XC6SLX75T-3CSG484C integrates a hard PCIe endpoint block compliant with PCI Express Base Specification v1.1 (Gen1 x1). This dedicated logic handles link training, transaction layer packet handling, and configuration space access-reducing resource utilization versus soft-core implementations.
How many transceiver quads does XC6SLX75T-3CSG484C contain?
XC6SLX75T-3CSG484C contains six transceiver quads, each supporting two differential lanes. All 12 lanes operate up to 3.2 Gb/s with built-in 8B/10B encoding, comma detection, and elastic buffers-enabling protocols such as SATA, CPRI, and custom high-speed serial interfaces.
What configuration modes are supported by XC6SLX75T-3CSG484C?
XC6SLX75T-3CSG484C supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. It also includes on-chip PROM for storing a single bitstream, allowing autonomous startup without external configuration memory in space-constrained designs.
Is XC6SLX75T-3CSG484C qualified for extended temperature operation?
No, XC6SLX75T-3CSG484C is rated for commercial temperature range (0 °C to +85 °C). For industrial (-40 °C to +100 °C) or automotive applications, engineers should consider the XC6SLX75T-3FGG484I variant, which shares identical logic resources and pinout but is tested across extended temperature conditions.
XC6SLX75T-3CSG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 292
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-CSPBGA (19x19)
XC6SLX75T-3CSG484C FAQ
1.How can I place an order for XC6SLX75T-3CSG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-3CSG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-3CSG484C reliable?
The price and inventory of XC6SLX75T-3CSG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-3CSG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-3CSG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-3CSG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-3CSG484C?
XC6SLX75T-3CSG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-3CSG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-3CSG484C?
For technical support, including XC6SLX75T-3CSG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-3CSG484C requirements.
6.How does Aetrix verify that XC6SLX75T-3CSG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-3CSG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-3CSG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-3CSG484C?
All XC6SLX75T-3CSG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-3CSG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-3CSG484C part is unused and in its original packaging.
Return procedure for XC6SLX75T-3CSG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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