AMD XC6SLX75T-3CSG484I

Overview

XC6SLX75T-3CSG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 Gb/s differential I/O speed, and -3 speed grade with industrial temperature range (-40°C to +100°C). It integrates 18 Kb block RAM, 24 DSP48A1 slices, and supports LVDS, SSTL, and HSTL I/O standards for embedded control and interface bridging applications.

For engineers reviewing the XC6SLX75T-3CSG484I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, embedded memory depth, DSP resource count, and industrial-grade thermal performance.

Technical Context

The XC6SLX75T-3CSG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It includes dual-port 18 Kb block RAM with byte-write enable and parity support, and 24 hardwired DSP48A1 slices capable of 18×25 signed multiplication with pipelined accumulation.

I/O banks are organized into eight groups supporting independent VCCO voltages (1.2 V to 3.3 V), selectable IOSTANDARD per pin, and programmable slew rate and drive strength. Configuration is performed via Master Serial SPI or JTAG, with bitstream encryption and CRC error detection enabled.

Key Specifications

Pinout & Package

XC6SLX75T-3CSG484I is housed in a 484-pin CSG (Chip Scale Grid Array) package with 25 mm × 25 mm body size, 1.0 mm pitch, and Pb-free/ROHS-compliant construction. The package supports thermal dissipation up to 3.5 W under typical operating conditions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Compared with XC6SLX75T-3CSG484I, the XC6SLX9-2TQG144C offers reduced resources and commercial temperature range, while the XC7S25-1CSGA225I delivers modern architecture benefits but requires PCB redesign due to different package and pinout.

Availability

XC6SLX75T-3CSG484I is available at Aetrix Electronics and suitable for industrial motor control, automotive ADAS interface, and medical imaging data acquisition requiring stable component supply and long-term lifecycle support.

Supply support for XC6SLX75T-3CSG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.

The Spartan-6 family, including XC6SLX75T-3CSG484I, was designed for cost-sensitive, high-volume applications demanding reliable I/O flexibility, deterministic timing, and industrial temperature operation.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX75T-3CSG484I?

XC6SLX75T-3CSG484I supports I/O standards from 1.2 V to 3.3 V per bank, including LVDS, SSTL-2, SSTL-3, HSTL-I, and PCI-X. Each of the eight I/O banks can be independently configured with its own VCCO voltage, allowing mixed-voltage interfaces on a single device without level shifters.

Does XC6SLX75T-3CSG484I support encrypted configuration bitstreams?

Yes, XC6SLX75T-3CSG484I supports AES-128 bitstream encryption using a 128-bit key stored in on-chip eFUSE. This feature prevents unauthorized readback and cloning of the programmed logic design, and is enabled during bitstream generation in Vivado or ISE design tools.

What is the purpose of the INIT_B pin on XC6SLX75T-3CSG484I?

The INIT_B pin on XC6SLX75T-3CSG484I is an open-drain status indicator that goes low during configuration initialization and returns high upon successful CRC check. It signals configuration readiness to external controllers and can trigger system-level fault handling if it remains low after timeout.

Can XC6SLX75T-3CSG484I operate reliably at 100°C junction temperature?

Yes, XC6SLX75T-3CSG484I is rated for industrial temperature range (-40°C to +100°C) and qualified to operate continuously at 100°C junction temperature. Thermal design must maintain junction temperature within this limit using appropriate PCB copper area, airflow, or heatsinking per Xilinx UG381 guidelines.

How many block RAMs does XC6SLX75T-3CSG484I contain, and what is their access width?

XC6SLX75T-3CSG484I contains 112 × 18 Kb block RAMs, totaling 2,016 Kb. Each block supports true dual-port access with independent read/write widths up to 36 bits per port, and includes byte-write enable and optional parity bits for error detection.