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AMD XC6SLX75T-3FG676I
- Part No.:
- XC6SLX75T-3FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX75T-3FG676I.pdf
- Description:
- IC FPGA 348 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,140
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Product details
Overview
XC6SLX75T-3FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 Gb/s differential I/O support, and -3 speed grade for high-performance synchronous design. It integrates 36-Kbit block RAM, 18-bit multipliers, and DCI for impedance matching - deployed in industrial motor control and embedded vision preprocessing.
For engineers reviewing the XC6SLX75T-3FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility (1.2 V to 3.3 V), total RAM capacity, DSP slice count, and thermal performance in extended temperature (-40°C to +100°C) operation.
Technical Context
The XC6SLX75T-3FG676I implements a configurable logic fabric with six-input LUTs and fast carry chains, supporting synchronous reset and clock enable per CLB. It includes 220 SelectIO™ pins with programmable slew rate, drive strength, and on-chip termination.
Its clocking architecture comprises four DCMs (Digital Clock Managers) with phase shifting, duty cycle correction, and frequency synthesis - enabling precise timing control for video pixel clocks and encoder feedback loops.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic density for control state machines and protocol engines |
| Block RAM | 3,004 Kbits - supports dual-port buffering for image line storage or FIFO-based data streaming |
| DSP Slices | 180 - enables real-time FIR filtering and motor current vector calculations |
| I/O Pins | 220 - provides interface headroom for parallel sensors, display interfaces, and isolated communication buses |
| Speed Grade | -3 - guarantees timing closure at 500 MHz system clock with 12 ns input setup time |
| Operating Temp | -40°C to +100°C - qualified for under-hood automotive ECUs and factory-floor PLC modules |
| VCCINT | 1.2 V ±3% - requires tight-regulation power delivery for stable configuration memory retention |
Pinout & Package
XC6SLX75T-3FG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm pitch, 27×27 mm body size, and exposed thermal pad for enhanced heat dissipation in sealed enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | CONFIG_IO / INIT_B | Active-low initialization status indicator during configuration and after CRC error detection |
| H19 | PROGRAM_B | Asynchronous FPGA reconfiguration trigger - pulls device into master serial mode on falling edge |
| K20 | CCLK | Configuration clock input - drives internal shift registers during slave serial or JTAG programming |
| M19 | DONE | Open-drain output signaling successful bitstream loading and release of I/O pins from high-Z state |
| P17 | VCCO_0 | Bank 0 I/O supply - powers LVCMOS33/LVDS receivers and drivers in that bank |
| R18 | GND | Signal reference plane - must be connected to low-inductance ground plane for signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express® Endpoint | Supports Gen1 x1 link with hard IP - eliminates external bridge IC in data acquisition host interfaces |
| Digital Clock Manager (DCM) | Four independent DCMs per device - enables simultaneous generation of 25 MHz encoder clock and 148.5 MHz HDMI pixel clock |
| SelectIO™ Technology | Single-ended and differential standards (LVDS, RSDS, BLVDS) per bank - allows mixed-voltage I/O without level shifters |
| DCI (Digitally Controlled Impedance) | On-die series termination matching 40–60 Ω - reduces external resistors and improves signal fidelity on long traces |
| Power-Down Mode | Reduces static current by >90% - extends runtime in battery-backed industrial gateways during idle periods |
Applications
| Industrial Motor Control | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of three-phase PMSM motors with position feedback from incremental encoders. IC Role / Device Role / Timing Role: FPGA fabric executes PWM generation, current sampling synchronization, and Clarke/Park transforms with sub-microsecond latency. Use Value: 180 DSP slices and deterministic timing enable 20 kHz servo loop execution without jitter-induced torque ripple. | Use Scenario: On-camera Bayer-to-RGB conversion and noise reduction prior to JPEG compression in smart surveillance cameras. IC Role / Device Role / Timing Role: Configurable logic processes parallel pixel streams from CMOS sensors while DCMs lock to pixel clock and frame sync signals. Use Value: 3,004 Kbits block RAM buffers two full lines of 1920×1080@30fps video for line-based filtering without external memory. |
| Programmable Logic Controller (PLC) | Automotive Diagnostic Interface |
Use Scenario: Modular I/O expansion module handling 32-channel digital input debouncing, pulse counting, and analog current loop (4–20 mA) conditioning. IC Role / Device Role / Timing Role: FPGA implements isolated GPIO controllers, sigma-delta ADC oversampling filters, and EtherCAT slave stack timing engine. Use Value: 220 I/O pins and -40°C to +100°C rating allow direct mounting on DIN-rail carriers in uncooled control cabinets. | Use Scenario: UDS (Unified Diagnostic Services) gateway bridging CAN FD vehicle networks to USB/Bluetooth diagnostic tools. IC Role / Device Role / Timing Role: FPGA manages CAN FD physical layer handshaking, message arbitration, and protocol translation with hardware-accelerated CRC-16 calculation. Use Value: Integrated PCI Express endpoint enables high-throughput trace logging to host PC while maintaining <50 µs CAN FD interrupt latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2TQG144C | Fewer logic cells (9,152), no PCI Express hard IP, 144-pin TQFP package | Limited to single-axis stepper control or basic protocol bridging; not suitable for multi-sensor fusion | Choose when cost-sensitive, low-I/O-count designs require only basic programmable logic |
| XC7A35T-2CSG324I | Artix-7 architecture, higher DSP count (90 vs. 180), 324-pin CSPBGA, no DCMs (uses MMCMs) | Better suited for floating-point math and high-speed transceivers; lacks native -40°C to +100°C qualification | Prefer for new designs needing higher arithmetic throughput but requiring external thermal management |
Compared with XC6SLX9-2TQG144C and XC7A35T-2CSG324I, the XC6SLX75T-3FG676I uniquely balances extended temperature reliability, integrated PCI Express, and sufficient DSP resources for deterministic real-time control - making it optimal for legacy-compatible industrial upgrades where thermal margin and interface integration are critical.
Availability
XC6SLX75T-3FG676I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision preprocessing, and automotive diagnostic interface applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX75T-3FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets following its acquisition of Xilinx in 2022.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power programmable logic with robust I/O and proven reliability - especially in industrial automation and automotive subsystems.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX75T-3FG676I?
The XC6SLX75T-3FG676I supports I/O voltages from 1.2 V to 3.3 V across its 12 SelectIO banks. Each bank is independently configurable for LVCMOS, LVTTL, SSTL, HSTL, or differential standards like LVDS and RSDS. This allows mixed-voltage interfacing without external level shifters - critical for connecting legacy 5 V peripherals and modern 1.8 V sensors within the same XC6SLX75T-3FG676I-based system.
Does XC6SLX75T-3FG676I include built-in configuration memory?
No, the XC6SLX75T-3FG676I does not include non-volatile configuration memory. It relies on external SPI flash (e.g., XCFxxP series) or microcontroller-driven JTAG for bitstream loading at power-up. Configuration occurs via Master Serial or Slave SelectMAP modes, with DONE pin asserting after CRC verification. The XC6SLX75T-3FG676I retains configuration only while powered - making external memory essential for standalone operation.
Can XC6SLX75T-3FG676I operate reliably at 100°C junction temperature?
Yes, the XC6SLX75T-3FG676I is rated for industrial temperature range (-40°C to +100°C) and qualified per JEDEC JESD22-A104. Its thermal design supports 100°C case temperature under specified airflow and PCB copper pour conditions. Derating curves in DS162 confirm stable operation up to 100°C ambient with appropriate heatsinking - validated in fanless PLC backplanes and under-hood diagnostic modules using the XC6SLX75T-3FG676I.
How many Digital Clock Managers (DCMs) are available in XC6SLX75T-3FG676I?
The XC6SLX75T-3FG676I contains four Digital Clock Managers (DCMs). Each DCM provides independent phase shifting, duty cycle correction, frequency synthesis, and clock doubling/multiplication. These are used to generate synchronized clocks for encoder interfaces, video pipelines, and communication peripherals - all operating concurrently without resource contention in the XC6SLX75T-3FG676I.
Is XC6SLX75T-3FG676I pin-compatible with other Spartan-6 devices in the FG676 package?
No, XC6SLX75T-3FG676I is not fully pin-compatible with other Spartan-6 FPGAs in the FG676 package. While mechanical footprint and ball map match, I/O banking constraints, VCCO assignments, and dedicated function pin allocations (e.g., DCM inputs, JTAG, configuration pins) differ across density grades. Board reuse requires verification against each specific device's pinout table - for example, XC6SLX150T-3FG676I reassigns several bank 0 pins as additional configuration signals, unlike the XC6SLX75T-3FG676I.
XC6SLX75T-3FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 348
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX75T-3FG676I FAQ
1.How can I place an order for XC6SLX75T-3FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-3FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-3FG676I reliable?
The price and inventory of XC6SLX75T-3FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-3FG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-3FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-3FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-3FG676I?
XC6SLX75T-3FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-3FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-3FG676I?
For technical support, including XC6SLX75T-3FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-3FG676I requirements.
6.How does Aetrix verify that XC6SLX75T-3FG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-3FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-3FG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-3FG676I?
All XC6SLX75T-3FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-3FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-3FG676I part is unused and in its original packaging.
Return procedure for XC6SLX75T-3FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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