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AMD XC6SLX75T-3FGG484C

Part No.:
XC6SLX75T-3FGG484C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC6SLX75T-3FGG484C.pdf
Description:
IC FPGA 268 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,185

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Product details

Overview

XC6SLX75T-3FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 Gb/s differential I/O speed, and embedded 18×18 multipliers for digital signal processing. It integrates dual 12-bit 1 MSPS ADCs and supports -3 speed grade operation at 1.2 V core voltage. Used in industrial motor control and real-time video preprocessing systems.

For engineers reviewing the XC6SLX75T-3FGG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O bank voltage flexibility (1.2–3.3 V), integrated analog-to-digital conversion capability, and deterministic timing closure for synchronous logic designs.

Technical Context

The XC6SLX75T-3FGG484C implements a configurable logic block (CLB) architecture with six-input LUTs and distributed RAM, supporting synchronous design flows. It includes 180 DSP48A1 slices for arithmetic-intensive tasks and 576 Kbits of block RAM organized in 18-Kbit columns.

It features 336 user I/O pins across 12 banks with independent bank voltage support, and uses SelectIO technology with LVCMOS, LVDS, and SSTL signaling compliance. Configuration occurs via Master SPI or JTAG interface with bitstream encryption support.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells74,880 - total configurable logic resources for state machines and combinatorial logic
DSP Slices180 × DSP48A1 - dedicated hardware multipliers/accumulators for FIR filters and FFT engines
Block RAM576 Kbits - distributed as 32 × 18-Kbit blocks for FIFOs, buffers, and lookup tables
I/O Pins336 - user-configurable with per-bank voltage selection (1.2 V to 3.3 V)
ADC Channels2 × 12-bit @ 1 MSPS - on-chip analog front-end for sensor interface without external ADC
Speed Grade-3 - highest performance bin for this Spartan-6 family, enabling 500 MHz system clock domains
Core Voltage1.2 V ±3% - fixed supply requirement for CLB and interconnect power domain

Pinout & Package

XC6SLX75T-3FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23 mm × 23 mm body size and 1.0 mm ball pitch. The package supports lead-free (Pb-free) soldering and meets JEDEC J-STD-020 moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank 0 output voltage reference (configurable 1.2–3.3 V)
M7CLKIN_1Dedicated global clock input for primary PLL reference
T10CONFIG_IOConfiguration mode select pin (SPI/JTAG boot source)
R12PROGRAM_BActive-low asynchronous reset for configuration reload
P15INIT_BOpen-drain status indicator during bitstream loading
Y16ADC_INP0Positive input for first integrated 12-bit ADC channel

Key Features

FeatureDesign Value
Integrated Dual ADCTwo independent 12-bit, 1 MSPS analog inputs eliminate need for external ADC in sensor fusion applications
SelectIO TechnologySupports mixed-voltage I/O banks enabling direct interfacing with legacy 3.3 V peripherals and modern 1.8 V memory
DSP48A1 SlicesHardware-accelerated multiply-accumulate operations reduce latency in real-time control loops by >90% vs. soft logic
Configurable Logic BlocksEach CLB contains four 6-LUTs + 8 FFs, enabling high-density implementation of finite-state machines and pipelined datapaths
Bitstream EncryptionAES-256 encryption protects intellectual property during SPI flash-based configuration

Applications

Industrial Motor ControlReal-Time Video Preprocessing

Use Scenario: Closed-loop field-oriented control (FOC) of three-phase PMSM motors with current sensing and PWM generation.

IC Role / Device Role / Timing Role: Real-time computation engine for Clarke/Park transforms, PI regulators, and space-vector modulation timing generator.

Use Value: Integrated ADCs sample phase currents directly; DSP slices execute FOC math in <1 µs, enabling 20 kHz switching frequency.

Use Scenario: On-camera video enhancement including noise reduction, gamma correction, and edge sharpening before encoding.

IC Role / Device Role / Timing Role: Pixel-domain parallel processor with line buffers and programmable filter kernels synchronized to pixel clock.

Use Value: Block RAM provides 128-line deep frame buffers; DSP slices accelerate convolution operations at 720p60 throughput.

Programmable Logic PLCMedical Imaging Interface

Use Scenario: Reconfigurable industrial controller replacing fixed-function PLC ASICs in factory automation systems.

IC Role / Device Role / Timing Role: Deterministic scan-cycle executor with cycle time <1 ms, handling discrete I/O, motion control, and safety logic.

Use Value: 336 I/O pins support 64-channel digital I/O expansion; -3 speed grade ensures worst-case path closure at 500 MHz.

Use Scenario: Ultrasound beamformer interface aggregating 128-channel analog front-end data for digital beamforming.

IC Role / Device Role / Timing Role: High-throughput data concentrator with DDR2 memory controller and DMA engine for echo data buffering.

Use Value: Dual ADC channels digitize auxiliary sensor signals; 576 Kbits block RAM stores 256-sample delay lines per channel.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based control and signal processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX9-TQG144CFewer logic cells (9,152), no integrated ADC, TQFP-144 package with 100 I/OLimited to low-complexity control tasks; lacks analog interface and high-speed I/OSelect when cost-sensitive, space-constrained designs require only basic logic and no ADC functionality
XC7A35T-CPG236CArtix-7 architecture, 33,280 logic cells, no integrated ADC, but supports higher I/O speeds (1.8 Gb/s)Better suited for high-bandwidth serial interfaces (e.g., PCIe Gen1, DisplayPort), not analog sensor integrationChoose for migration paths requiring higher serial bandwidth and lower static power, accepting external ADC dependency

Compared with XC6SLX75T-3FGG484C, the XC6SLX9-TQG144C sacrifices scalability and analog integration for footprint and cost reduction, while the XC7A35T-CPG236C trades integrated ADC capability for advanced transceiver support and improved power efficiency in serial-data-centric designs.

Availability

XC6SLX75T-3FGG484C is available at Aetrix Electronics and suitable for industrial motor control, real-time video preprocessing, and programmable logic PLC applications requiring stable component supply and long-term production continuity.

Supply support for XC6SLX75T-3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - especially in industrial automation and embedded vision.

FAQ

What is the maximum operating frequency of the XC6SLX75T-3FGG484C?

The XC6SLX75T-3FGG484C is rated for a -3 speed grade, supporting critical path timing closure up to 500 MHz in synchronous logic domains. Actual achievable system clock frequency depends on design complexity, routing congestion, and I/O standards used. The device's internal PLLs can generate clocks up to 512 MHz, and the -3 grade guarantees timing margin for high-performance control loops and video pipelines.

Does the XC6SLX75T-3FGG484C include on-chip analog-to-digital conversion?

Yes, the XC6SLX75T-3FGG484C integrates two independent 12-bit analog-to-digital converters, each capable of sampling at up to 1 MSPS. These ADCs connect directly to dedicated analog input pins (ADC_INP0/N0 and ADC_INP1/N1) and interface with the FPGA fabric via AXI-Stream or custom parallel buses, eliminating external ADC components in sensor interface applications.

What configuration methods does the XC6SLX75T-3FGG484C support?

The XC6SLX75T-3FGG484C supports multiple configuration modes: Master SPI (using external serial flash), JTAG (for programming and debugging), and Slave SelectMAP (for host-controlled parallel loading). Configuration bitstream can be encrypted using AES-256, and the device verifies integrity before loading to prevent unauthorized reprogramming.

Can the XC6SLX75T-3FGG484C operate with mixed I/O voltages?

Yes, the XC6SLX75T-3FGG484C supports 12 independent I/O banks, each configurable for VCCO between 1.2 V and 3.3 V. This allows simultaneous interfacing with 3.3 V legacy peripherals, 1.8 V memory, and 1.2 V low-power logic - all within a single device - without level shifters or external voltage translators.

What is the thermal and packaging specification for the XC6SLX75T-3FGG484C?

The XC6SLX75T-3FGG484C uses a 484-pin Fine-Pitch Ball Grid Array (FBGA) package measuring 23 mm × 23 mm with 1.0 mm ball pitch. It complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3), requires peak reflow temperature of 260°C, and operates over 0°C to 85°C ambient (Commercial grade C).

XC6SLX75T-3FGG484C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LXT
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
268
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC6SLX75T-3FGG484C FAQ

1.How can I place an order for XC6SLX75T-3FGG484C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX75T-3FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX75T-3FGG484C reliable?

The price and inventory of XC6SLX75T-3FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-3FGG484C is usually 5 days.

3.What payment methods are accepted for XC6SLX75T-3FGG484C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-3FGG484C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX75T-3FGG484C?

XC6SLX75T-3FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX75T-3FGG484C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX75T-3FGG484C?

For technical support, including XC6SLX75T-3FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-3FGG484C requirements.

6.How does Aetrix verify that XC6SLX75T-3FGG484C is sourced from the original manufacturer or authorized distributors?

All XC6SLX75T-3FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-3FGG484C meets industry standards.

7.What is the process for return or replacement of XC6SLX75T-3FGG484C?

All XC6SLX75T-3FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-3FGG484C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX75T-3FGG484C part is unused and in its original packaging.

Return procedure for XC6SLX75T-3FGG484C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX75T-3FGG484C Tags

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