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AMD XC6SLX75T-3FGG484I
- Part No.:
- XC6SLX75T-3FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX75T-3FGG484I.pdf
- Description:
- IC FPGA 268 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,494
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Product details
Overview
XC6SLX75T-3FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 Gb/s transceiver capability, and embedded Block RAM totaling 3,009 kbits. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and is used in high-reliability industrial control and communications infrastructure.
For engineers reviewing the XC6SLX75T-3FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS support, DCI termination, and dual-register flip-flop architecture for timing-critical logic implementation.
Technical Context
The XC6SLX75T-3FGG484I implements a configurable logic fabric based on 6-input LUTs and dual-register flip-flops, supporting synchronous design with dedicated carry logic and shift registers. It integrates six CMT clock management tiles-each with two DCMs-for low-jitter clock synthesis and phase alignment across multiple domains.
It supports SelectIO standards including LVCMOS, LVDS, SSTL, and HSTL, with internal differential termination and dynamic impedance control (DCI). The device includes 228 DSP48A1 slices for arithmetic-intensive tasks and supports PCI Express x1 Gen1 via dedicated hard IP blocks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - provides gate-equivalent capacity for medium-complexity digital systems |
| User I/O Pins | 348 - enables high-density interface routing with bank-level voltage flexibility |
| Block RAM | 3,009 kbits - supports large FIFOs, buffers, or lookup tables without external memory |
| DSP Slices | 228 × DSP48A1 - delivers 18×25-bit multiply-accumulate per slice for signal processing |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial and transportation applications |
| Transceiver Speed | 3.2 Gb/s - supports serial protocols including SATA, CPRI, and Gigabit Ethernet |
Pinout & Package
XC6SLX75T-3FGG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23 mm × 23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 3.5 W under typical operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCO_0 | I/O bank 0 power supply - sets output voltage level for associated pins (1.2–3.3 V) |
| M20 | CLK0 | Dedicated global clock input - low-skew path to all CMTs and logic regions |
| P19 | INIT_B | Configuration status indicator - active-low open-drain output signaling bitstream load readiness |
| T14 | PROGRAM_B | Asynchronous configuration reset - forces reinitialization of configuration memory and logic |
| Y17 | M0/M1/M2 | Mode select pins - determine boot source (JTAG, SPI, or BPI) during power-up |
| R18 | CCLK | Configuration clock - generated internally or supplied externally during master serial mode |
Key Features
| Feature | Design Value |
|---|---|
| Dual-register flip-flops | Enables time-borrowing and pipelining within single logic stage for improved Fmax |
| Integrated DCI | Eliminates external termination resistors for differential I/O standards like LVDS |
| PCIe x1 Gen1 hard IP | Reduces integration effort and resource usage for endpoint PCIe connectivity |
| Multi-voltage I/O banks | Allows concurrent interfacing to 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V devices |
| Configurable I/O standards | Supports 17+ I/O standards per bank without external level shifters |
Applications
| Industrial Motor Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time closed-loop servo control with multi-axis synchronization and encoder feedback processing. IC Role / Device Role / Timing Role: FPGA acts as deterministic real-time controller handling PWM generation, position interpolation, and safety monitoring. Use Value: Dual-register flip-flops and deterministic routing enable sub-100 ns jitter on critical timing paths. | Use Scenario: High-speed data aggregation from ultrasound transducer arrays and preprocessing before GPU transfer. IC Role / Device Role / Timing Role: FPGA serves as parallel data concentrator and protocol bridge between analog front-end and PCIe host interface. Use Value: 348 user I/Os and integrated PCIe x1 Gen1 block reduce latency and eliminate external bridge ICs. |
| Wireless Baseband Processing | Ruggedized Networking Equipment |
Use Scenario: Digital predistortion (DPD) and crest factor reduction (CFR) in LTE macrocell remote radio heads. IC Role / Device Role / Timing Role: FPGA implements adaptive signal conditioning pipeline using 228 DSP48A1 slices and Block RAM-based coefficient storage. Use Value: 3.2 Gb/s transceivers support JESD204B links to high-speed ADC/DACs with deterministic latency. | Use Scenario: Layer-2 packet switching and deep packet inspection in fanless, conduction-cooled routers. IC Role / Device Role / Timing Role: FPGA functions as programmable forwarding engine with TCAM-like pattern matching using distributed RAM. Use Value: Industrial temperature rating and DCI-enabled LVDS I/O ensure reliable operation in uncontrolled environmental enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-TQG144C | Fewer logic cells (7,680), no transceivers, smaller TQFP-144 package | Limited to low-bandwidth control and glue logic; unsuitable for serial interface or DSP-heavy tasks | Select when cost-sensitive, space-constrained designs require only basic programmable logic |
| XC7A75T-2CSG324I | Artix-7 architecture, higher logic density (75,520 LUTs), 6.6 Gb/s transceivers, -2 speed grade | Better suited for next-gen protocols (PCIe Gen2, DisplayPort) and higher-clock-rate signal processing | Choose for migration path requiring increased bandwidth and lower power per logic unit |
Compared with XC6SLX75T-3FGG484I, the XC6SLX9-TQG144C offers lower cost and footprint but lacks transceivers and scalability, while the XC7A75T-2CSG324I delivers higher performance and protocol support at the expense of legacy toolchain compatibility and higher BOM cost.
Availability
XC6SLX75T-3FGG484I is available at Aetrix Electronics and suitable for industrial motor control, medical imaging interfaces, and ruggedized networking equipment requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX75T-3FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low power, small form factor, and seamless integration with legacy microprocessors and memory interfaces.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX75T-3FGG484I?
The XC6SLX75T-3FGG484I supports I/O voltages from 1.2 V to 3.3 V across its 12 configurable I/O banks. Each bank operates independently, allowing mixed-voltage interfaces such as 1.8 V DDR2 memory and 3.3 V legacy peripherals simultaneously. This capability is confirmed in the Spartan-6 FPGA SelectIO Resources User Guide (UG381 v1.12).
Does XC6SLX75T-3FGG484I include built-in PCIe support?
Yes, the XC6SLX75T-3FGG484I integrates a hard PCIe x1 Gen1 endpoint block compliant with PCI Express Base Specification v1.1. It handles link training, transaction layer packet (TLP) generation, and error reporting without consuming logic resources. This feature is documented in the Spartan-6 FPGA Connectivity User Guide (UG386 v1.7).
What configuration modes does XC6SLX75T-3FGG484I support?
The XC6SLX75T-3FGG484I supports master serial (SPI flash), slave serial (external controller), JTAG, and boundary-scan configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstream can be stored in external SPI flash or loaded dynamically via JTAG for debugging and field updates.
Is XC6SLX75T-3FGG484I qualified for automotive applications?
No, the XC6SLX75T-3FGG484I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While it operates reliably in harsh environments, AMD does not certify this part for automotive safety-critical systems. Automotive-grade alternatives require explicit qualification documentation from AMD.
How many clock management tiles (CMTs) does XC6SLX75T-3FGG484I contain?
The XC6SLX75T-3FGG484I contains six Clock Management Tiles (CMTs), each with two Digital Clock Managers (DCMs). These provide independent clock synthesis, phase shifting, frequency multiplication/division, and duty cycle correction for up to 12 distinct clock domains with sub-100 ps jitter performance.
XC6SLX75T-3FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 268
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX75T-3FGG484I FAQ
1.How can I place an order for XC6SLX75T-3FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-3FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-3FGG484I reliable?
The price and inventory of XC6SLX75T-3FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-3FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-3FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-3FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-3FGG484I?
XC6SLX75T-3FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-3FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-3FGG484I?
For technical support, including XC6SLX75T-3FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-3FGG484I requirements.
6.How does Aetrix verify that XC6SLX75T-3FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-3FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-3FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-3FGG484I?
All XC6SLX75T-3FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-3FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-3FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX75T-3FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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