AMD XC6SLX75T-3FGG676C

Overview

XC6SLX75T-3FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and embedded Block RAM totaling 3,009 kbits. It features 480 user I/Os in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at -3 speed grade (fastest within Spartan-6 T-grade), targeting high-reliability industrial control and reconfigurable digital signal processing systems.

For engineers reviewing the XC6SLX75T-3FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver data rate, logic cell density, Block RAM capacity, and thermal performance under sustained 85°C ambient operation.

Technical Context

The XC6SLX75T-3FGG676C implements a fully programmable logic fabric based on 6-input LUTs and distributed RAM, with integrated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations at up to 250 MHz. It includes six CMT clock management tiles-each with two DCMs and one PLL-for low-jitter clock synthesis and phase alignment across multiple domains.

Configuration is supported via Master SPI, Slave SelectMAP, or JTAG interfaces; configuration bitstream security includes AES-128 decryption and HMAC authentication. The device supports partial reconfiguration and IEEE 1149.1 boundary-scan testing.

Key Specifications

Pinout & Package

The XC6SLX75T-3FGG676C is housed in a 676-ball Fine-Pitch Ball Grid Array (FGG) package with 27×27 array, 1.0 mm ball pitch, and standard 0.75 mm ball diameter. Thermal pad is exposed on underside for enhanced heat dissipation in high-utilization configurations.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC6SLX75T-3FGG676C, the XC6SLX150T-3FGG676C offers scalable logic density in identical packaging, while the XC7K160T-2FFG676C delivers architectural advancement for higher-speed serial protocols and memory interfaces-both require design migration but preserve board footprint compatibility.

Availability

XC6SLX75T-3FGG676C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging subsystems, avionics data concentrators, and test & measurement instrumentation requiring stable component supply across extended product lifecycles.

Supply support for XC6SLX75T-3FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.

The Spartan-6 family-including XC6SLX75T-3FGG676C-was architected for cost-sensitive, high-volume industrial and automotive applications demanding low-power programmable logic with robust I/O and proven reliability.

FAQ

What is the maximum operating frequency of the XC6SLX75T-3FGG676C?

The XC6SLX75T-3FGG676C is rated at speed grade -3, guaranteeing timing closure for critical paths up to 667 MHz for internal logic and 1,000 Mbps for LVDS I/O. Actual achievable frequency depends on design complexity, routing, and thermal conditions-but the -3 grade ensures worst-case performance meets these targets across 0°C to 85°C ambient.

Does the XC6SLX75T-3FGG676C support partial reconfiguration?

Yes, the XC6SLX75T-3FGG676C supports partial reconfiguration through Xilinx ISE Design Suite tools. This allows dynamic replacement of logic modules without resetting the entire device-enabling runtime adaptation in industrial controllers and communication gateways where continuous operation is required.

What configuration modes does the XC6SLX75T-3FGG676C support?

The XC6SLX75T-3FGG676C supports three primary configuration modes: Master SPI (internal clock drives external flash), Slave SelectMAP (external processor controls parallel data load), and JTAG (boundary-scan programming and debugging). Mode selection is controlled by M0–M2 pins sampled at power-on reset.

Is the XC6SLX75T-3FGG676C pin-compatible with other Spartan-6 devices in the FGG676 package?

No-while XC6SLX75T-3FGG676C shares the 676-ball FGG package with other Spartan-6 devices like XC6SLX9, XC6SLX16, and XC6SLX25, pin functions differ significantly across densities due to varying I/O bank allocations and dedicated resource placement. Board-level reuse requires verification against each specific device's pinout documentation.

What thermal management guidance applies to the XC6SLX75T-3FGG676C?

The XC6SLX75T-3FGG676C requires a minimum 4×4 array of thermal vias beneath the exposed thermal pad, connected to an internal ground plane. For sustained operation at 85°C ambient, a 2-layer PCB with ≥1 oz copper and localized airflow of ≥200 LFM is recommended. Junction-to-board thermal resistance (ψJB) is 5.2°C/W per Xilinx UG382.