AMD XC6SLX75T-3FGG676I

Overview

XC6SLX75T-3FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 Gb/s transceiver capability, and -3 speed grade for high-performance synchronous design. It integrates 18 Kbit block RAM, 24 DSP48A1 slices, and supports LVDS, SSTL, and HSTL I/O standards. Used in industrial vision systems requiring deterministic latency and real-time pixel processing.

For engineers reviewing the XC6SLX75T-3FGG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility (1.2 V to 3.3 V), embedded clock management (DCM and PLL), and support for PCI Express Gen1 endpoint configuration.

Technical Context

The XC6SLX75T-3FGG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It includes two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL) for clock synthesis, multiplication, phase shifting, and duty-cycle correction across multiple domains.

It supports SelectIO™ technology with programmable drive strength (2–24 mA), slew rate control, and on-die termination (ODT) for 30 Ω, 40 Ω, 50 Ω, and 60 Ω. The device complies with PCI Express Base Specification v1.1 as an endpoint and supports DDR2/DDR3 memory interfaces up to 800 Mbps.

Key Specifications

Pinout & Package

XC6SLX75T-3FGG676I is housed in a 676-ball Fine-Pitch Flip-Chip BGA (FFBG) package with 1.0 mm ball pitch and 27 × 27 array. Package dimensions are 27 mm × 27 mm, RoHS-compliant, and designed for thermal reliability in high-density PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and processing applications.

Compared with XC6SLX75-3FGG676I, the XC6SLX75T-3FGG676I adds essential transceiver capability for serial protocols, while XC7K70T-2FBG676I offers architectural upgrades at the cost of legacy toolchain compatibility and increased thermal footprint.

Availability

XC6SLX75T-3FGG676I is available at Aetrix Electronics and suitable for industrial machine vision, avionics data concentrators, and medical imaging interface applications requiring stable component supply and long-term lifecycle support.

Supply support for XC6SLX75T-3FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines.

The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small footprint, and reliable I/O interfacing - especially in industrial and embedded systems.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX75T-3FGG676I?

The XC6SLX75T-3FGG676I supports I/O voltages from 1.2 V to 3.3 V across its 12 selectable I/O banks. Each bank can be independently configured for HR (high-range) or HP (high-performance) I/O standards, enabling mixed-voltage operation such as interfacing 1.8 V sensors with 3.3 V microcontrollers. This flexibility is implemented via VCCO and VREF pins per bank, with strict compliance to JEDEC specifications for each standard.

Does XC6SLX75T-3FGG676I include hard IP for PCI Express?

Yes, XC6SLX75T-3FGG676I integrates a hard PCIe endpoint block compliant with PCI Express Base Specification v1.1. It supports x1 lane width, 2.5 GT/s data rate, and endpoint configuration only - not root complex functionality. The block includes integrated PHY, transaction layer, data link layer, and configuration space, reducing soft-logic resource usage and ensuring deterministic latency for real-time applications.

What clock management resources are available in XC6SLX75T-3FGG676I?

XC6SLX75T-3FGG676I provides two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL). Each DCM supports frequency synthesis, phase shifting, and duty-cycle correction; the PLL adds wider multiplication range and lower jitter performance. These resources operate independently per clock region and support global, regional, and I/O clock distribution networks - critical for synchronizing multi-domain interfaces like DDR3 and LVDS video streams.

Is XC6SLX75T-3FGG676I qualified for extended temperature operation?

Yes, the XC6SLX75T-3FGG676I is rated for operation from -40°C to +100°C and is classified as an industrial-grade device. This qualification includes thermal cycling, high-temperature operating life (HTOL), and unbiased highly accelerated stress test (uHAST) per JESD22-A108. The FGG676 package uses lead-free, halogen-free substrate materials compatible with IPC/JEDEC J-STD-020 moisture sensitivity level 3 handling.

Can XC6SLX75T-3FGG676I be used as a replacement for XC6SLX75-3FGG676I in existing designs?

No, XC6SLX75T-3FGG676I is not a drop-in replacement for XC6SLX75-3FGG676I due to differences in transceiver pin assignments and power delivery requirements. While both share identical logic resources and package outline, the T-suffix variant adds MGTCLK and transceiver I/O pins that occupy positions used for general-purpose I/O in the non-T version. Board-level redesign is required to accommodate these dedicated serial interface pins.