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AMD XC6SLX75T-4CSG484C
- Part No.:
- XC6SLX75T-4CSG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, CSPBGA
- Datasheet:
-
XC6SLX75T-4CSG484C.pdf
- Description:
- IC FPGA 292 I/O 484CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,506
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Product details
Overview
XC6SLX75T-4CSG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and embedded Block RAM totaling 3,001 kbits. It features 348 user I/Os in a 484-pin CSG package and targets high-speed industrial control and video processing systems.
For engineers reviewing the XC6SLX75T-4CSG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver speed, logic density, and thermal performance in compact PCB layouts.
Technical Context
The XC6SLX75T-4CSG484C implements a fully programmable logic fabric based on 6-input LUTs and distributed RAM, with integrated DSP48A1 slices supporting 18×25-bit multiply-accumulate operations. It includes dual-clock DDR2/DDR3 memory controllers and supports LVDS, TMDS, and RSDS signaling standards.
This device uses a 45 nm bulk CMOS process, operates at 1.2 V core voltage, and supports JTAG boundary-scan and ICAP configuration interfaces. Its -4 speed grade guarantees timing closure up to 400 MHz for critical paths under industrial temperature conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational and sequential logic capacity for system-on-chip integration |
| Block RAM | 3,001 kbits - enables local data buffering, FIFOs, and small on-chip memory arrays without external DRAM |
| User I/Os | 348 - supports high-pin-count peripheral interfacing including parallel video, PCI Express Gen1, and custom buses |
| Transceiver Speed | 3.2 Gb/s - enables serial video links (e.g., FPD-Link III), Gigabit Ethernet PHY, and JESD204B interface support |
| Speed Grade | -4 - guarantees timing closure for 400 MHz clock domains in industrial temperature range (-40°C to +85°C) |
| Package | 484-pin CSG (Fine-Pitch CSP BGA) - 19×19 mm body, 0.8 mm pitch, optimized for thermal dissipation and board space efficiency |
Pinout & Package
The XC6SLX75T-4CSG484C is housed in a 484-pin Fine-Pitch Chip-Scale Package (CSG) with 19×19 array, 0.8 mm ball pitch, and exposed thermal pad. Pin functions are defined per UG382 v1.11 and include dedicated configuration, clock, and transceiver banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | CONFIG_DONE | Open-drain status signal indicating successful configuration completion and readiness for user logic execution |
| P17 | INIT_B | Active-low bidirectional initialization and reconfiguration status indicator during power-up or fallback |
| VCCO_0 | I/O Bank Voltage | Supplies 1.2–3.3 V to Bank 0 I/Os, enabling mixed-voltage interface compatibility with legacy peripherals |
| M20 | CLKIN1_P | Dedicated differential input for primary clock source feeding global clock network and PLL inputs |
| R15 | GTCLK0_P | Primary transceiver reference clock input for high-speed serial lanes (up to 3.2 Gb/s) |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DSP48A1 Slices | 180 units supporting 18×25-bit signed multiplication and 48-bit accumulation for real-time filtering and FFT acceleration |
| Dual-Channel DDR2/DDR3 Controller | Supports up to 800 MT/s data rates with 64-bit bus width and hardware calibration for reliable memory subsystem design |
| Multi-Standard I/O Support | LVDS, RSDS, TMDS, SSTL, HSTL, and LVCMOS across 12 I/O banks enable direct connection to displays, sensors, and FPGAs |
| ICAP Interface | Enables partial reconfiguration of logic blocks in-system without full device reset or external programming hardware |
| JTAG Boundary-Scan | IEEE 1149.1-compliant test access port for production testing, debug visibility, and in-circuit verification |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop coordination across 8-axis CNC machines using encoder feedback and PWM output generation. IC Role / Device Role / Timing Role: FPGA fabric executes deterministic PID control algorithms with sub-microsecond latency; transceivers interface with high-speed position sensors. Use Value: 348 I/Os route encoder A/B/Z signals and PWM outputs simultaneously; -4 speed grade ensures 400 MHz servo update rate stability. | Use Scenario: Aggregation and preprocessing of raw ultrasound echo data from 128-channel probe front-end ASICs before transmission to host processor. IC Role / Device Role / Timing Role: XC6SLX75T-4CSG484C acts as a high-bandwidth data concentrator and beamformer preprocessor using DSP48A1 slices. Use Value: 3.2 Gb/s transceivers handle serialized sensor data streams; 3,001 kbits Block RAM buffers frame-aligned echo samples for real-time filtering. |
| HD Video Transport Bridge | Avionics Data Concentrator |
Use Scenario: Conversion between HDMI 1.4a video stream and MIPI DSI interface for embedded cockpit displays in commercial aircraft. IC Role / Device Role / Timing Role: XC6SLX75T-4CSG484C implements protocol translation, color space conversion, and pixel clock domain crossing. Use Value: Dual DDR3 controller manages frame buffering; TMDS and LVDS I/O banks support native HDMI and MIPI physical layer signaling. | Use Scenario: Consolidation of ARINC 429, MIL-STD-1553, and discrete I/O signals from flight control sensors into a unified Ethernet AVB backbone. IC Role / Device Role / Timing Role: XC6SLX75T-4CSG484C serves as a deterministic time-synchronized gateway with hardware timestamping and packet shaping. Use Value: 74,880 logic cells implement multiple protocol state machines concurrently; JTAG and ICAP support field-upgradable avionics firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-4FGG484C | 147,443 logic cells, same -4 speed grade, identical CSG484 package but higher power consumption (1.9 W typical vs. 1.3 W) | Required for designs needing >100 k logic cells or additional transceiver lanes beyond XC6SLX75T-4CSG484C's 8 GT lanes | Select when scaling logic density while retaining pin-compatible footprint and thermal profile |
| XC7K160T-2FFG676I | Kintex-7 architecture, 162,240 logic cells, 12.5 Gb/s transceivers, larger 676-pin FFG package, -2 speed grade | Suitable for next-generation designs requiring PCIe Gen2, 10GbE, or advanced DSP where XC6SLX75T-4CSG484C lacks bandwidth or logic headroom | Choose for migration path requiring higher serial bandwidth and logic capacity; not pin-compatible |
Compared with XC6SLX75T-4CSG484C, XC6SLX150T-4FGG484C offers scalable logic density within the same package, while XC7K160T-2FFG676I delivers generational improvements in transceiver speed and DSP throughput at the cost of larger footprint and redesign effort.
Availability
XC6SLX75T-4CSG484C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, HD video transport bridge, and avionics data concentrator applications requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX75T-4CSG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small form factor, and robust I/O flexibility - especially in industrial automation and video infrastructure.
FAQ
What is the maximum operating temperature for the XC6SLX75T-4CSG484C?
The XC6SLX75T-4CSG484C is rated for industrial temperature range operation from –40°C to +85°C ambient. Its thermal design supports continuous operation at full logic utilization and 3.2 Gb/s transceiver activity within this range when mounted on a 4-layer PCB with adequate copper pour and thermal vias beneath the exposed pad.
Does the XC6SLX75T-4CSG484C support partial reconfiguration?
Yes, the XC6SLX75T-4CSG484C supports partial reconfiguration via its ICAP (Internal Configuration Access Port) interface. This allows dynamic modification of specific logic regions without resetting the entire device or interrupting active I/O or memory functions - a capability confirmed in Xilinx UG380 v1.12 and validated in industrial gateware deployments.
How many transceiver lanes does the XC6SLX75T-4CSG484C include?
The XC6SLX75T-4CSG484C integrates eight GTX transceiver lanes, each capable of 600 Mb/s to 3.2 Gb/s operation. These lanes are grouped into two quads (GTX0–GTX3 and GTX4–GTX7), with dedicated reference clocks and termination controls per quad as documented in UG382 section 3.4.2.
What configuration modes are supported by the XC6SLX75T-4CSG484C?
The XC6SLX75T-4CSG484C supports Master SelectMAP, Slave SelectMAP, Serial Peripheral Interface (SPI), and JTAG configuration modes. Configuration bitstream loading can be initiated from external flash (e.g., Micron N25Q series), microcontroller, or boundary-scan tool - all verified in Xilinx UG380 and production hardware designs.
Is the XC6SLX75T-4CSG484C RoHS compliant and lead-free?
Yes, the XC6SLX75T-4CSG484C is RoHS 2011/65/EU compliant and manufactured with lead-free (Pb-free) solder finish on all 484 balls. The device meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) and requires bake conditioning prior to reflow if exposed to ambient for >168 hours.
XC6SLX75T-4CSG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 292
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-CSPBGA (19x19)
XC6SLX75T-4CSG484C FAQ
1.How can I place an order for XC6SLX75T-4CSG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-4CSG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-4CSG484C reliable?
The price and inventory of XC6SLX75T-4CSG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-4CSG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-4CSG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-4CSG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-4CSG484C?
XC6SLX75T-4CSG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-4CSG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-4CSG484C?
For technical support, including XC6SLX75T-4CSG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-4CSG484C requirements.
6.How does Aetrix verify that XC6SLX75T-4CSG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-4CSG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-4CSG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-4CSG484C?
All XC6SLX75T-4CSG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-4CSG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-4CSG484C part is unused and in its original packaging.
Return procedure for XC6SLX75T-4CSG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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