My Inquiry
My Account
AMD XC6SLX75T-4FGG484C
- Part No.:
- XC6SLX75T-4FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX75T-4FGG484C.pdf
- Description:
- IC FPGA 268 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,727
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX75T-4FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and embedded Block RAM totaling 3,009 kbits. It operates at -4 speed grade, supports LVDS and SSTL I/O standards, and is used in industrial vision systems requiring real-time image preprocessing and interface bridging.
For engineers reviewing the XC6SLX75T-4FGG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility (1.2 V to 3.3 V), integrated DSP48A1 slices for filtering, and support for PCI Express x1 Gen1 endpoint functionality.
Technical Context
The XC6SLX75T-4FGG484C implements a synchronous, SRAM-based FPGA architecture with configurable logic blocks (CLBs), dedicated digital signal processing (DSP48A1) slices, and clock management tiles (CMT) containing DCMs and PLLs. It supports multi-standard I/O with programmable drive strength and slew rate control.
This device integrates 220 user I/O pins across 12 banks, includes 220 SelectIO™ resources, and features dual-register flip-flops per LUT for high-speed pipelining. Its -4 speed grade guarantees timing closure up to 500 MHz for critical paths under specified thermal conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - provides gate count equivalent to ~450K ASIC gates for complex control and datapath logic |
| Block RAM | 3,009 kbits - enables on-chip buffering for video line buffers or protocol packet staging |
| DSP Slices | 180 DSP48A1 - supports 25×18 signed multiplication and accumulation per slice at 250 MHz |
| I/O Pins | 220 - distributed across 12 banks with independent VCCO per bank for mixed-voltage interfacing |
| Speed Grade | -4 - guarantees maximum system clock frequency of 500 MHz for internal logic under commercial temperature |
| Transceiver Speed | 3.2 Gb/s - enables SerDes links for Camera Link HS or custom high-speed serial interfaces |
| Configuration Mode | Master SPI, Slave Parallel, JTAG - supports field-upgradable bitstreams via flash or host processor |
Pinout & Package
XC6SLX75T-4FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 22 mm × 22 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 3.5 W under typical industrial airflow conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | 1.2 V core supply input - must be filtered with ≥10 µF ceramic + 100 nF bypass per power rail |
| P17 | VCCAUX | 2.5 V auxiliary supply - powers configuration circuitry, JTAG, and certain I/O banks |
| A14 | PROGRAM_B | Active-low asynchronous reset - initiates reconfiguration when pulsed low |
| T13 | DONE | Open-drain status output - goes high-Z after successful bitstream loading and CRC check |
| R15 | CCLK | Configuration clock input - drives internal shift register during master SPI mode |
| Y16 | M0/M1/M2 | Mode select inputs - determine boot source (SPI, BPI, or JTAG) at power-on |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two CMTs each with DCM + PLL - enables jitter-tolerant clock synthesis and phase alignment across multiple domains |
| Low-Power Architecture | 1.2 V core voltage + dynamic power gating - reduces active power to ~1.8 W at 200 MHz toggle rate |
| SelectIO Technology | Support for 18 I/O standards including LVDS, SSTL-2, HSTL-I - eliminates level-shifter ICs in memory and sensor interfaces |
| PCIe Endpoint Logic | Hard IP for PCIe x1 Gen1 - delivers 250 MB/s throughput without consuming logic resources |
| Configurable I/O Drive | Programmable 2–24 mA drive strength + slow/fast slew - minimizes EMI while maintaining signal integrity on long traces |
Applications
| Industrial Machine Vision | Automated Test Equipment |
|---|---|
Use Scenario: Real-time Bayer demosaicing and edge detection on 1080p@60fps camera streams. IC Role / Device Role / Timing Role: Configurable datapath accelerator with parallel pixel processing pipelines and DDR2 memory controller. Use Value: Reduces host CPU load by offloading compute-intensive vision algorithms while meeting sub-16 ms latency budget. | Use Scenario: High-precision waveform generation and acquisition using synchronized analog front-ends. IC Role / Device Role / Timing Role: Timing engine and pattern generator controlling DAC/ADC sampling clocks and trigger sequencing. Use Value: Achieves <±25 ps channel-to-channel skew across 32 digital I/O lines using deterministic routing and delay calibration. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Bridging legacy LVDS-based ultrasound probe signals to modern PCIe-based image processors. IC Role / Device Role / Timing Role: Protocol translator with embedded FIFOs and clock domain crossing logic. Use Value: Enables seamless integration without redesigning probe electronics or replacing existing backplane infrastructure. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals into a single Ethernet/IP uplink. IC Role / Device Role / Timing Role: Deterministic real-time gateway with time-stamped message buffering and priority scheduling. Use Value: Meets DO-254 DAL-B timing requirements with worst-case interrupt latency < 3.2 µs from signal arrival to Ethernet frame initiation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-4FGG676C | Higher logic density (147,443 LC), larger package (676-pin FBGA), +20% DSP slices | Required for designs needing >100 kLC or dual-camera stream processing | Choose when expanding functionality beyond XC6SLX75T-4FGG484C capacity without changing architecture |
| XC7S25-1CSGA225C | 7-series architecture, lower power (0.9 W typical), smaller 225-pin CSP package, no transceivers | Suitable for cost-sensitive, low-bandwidth control-only roles where SerDes is unnecessary | Prefer for new designs targeting reduced BOM cost and thermal footprint where 3.2 Gb/s serial I/O is not required |
Compared with XC6SLX75T-4FGG484C, the XC6SLX150T-4FGG676C offers scalable logic headroom for future feature additions, while the XC7S25-1CSGA225C trades transceiver capability and density for lower power and footprint-making it viable only where serial interface bandwidth is omitted from system requirements.
Availability
XC6SLX75T-4FGG484C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and avionics data concentrator applications requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX75T-4FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development of adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance embedded and datacenter applications.
The Spartan-6 family, including XC6SLX75T-4FGG484C, was designed for cost-sensitive, high-volume applications demanding reliable I/O flexibility, moderate logic density, and low static power-especially in industrial control and video processing.
FAQ
What is the maximum operating junction temperature for XC6SLX75T-4FGG484C?
The XC6SLX75T-4FGG484C has a maximum operating junction temperature of 100°C under commercial temperature grade (0°C to +85°C ambient). Thermal design must ensure that power dissipation, PCB copper area, and airflow maintain junction temperature below this limit during sustained operation at full logic utilization and I/O toggle rates.
Does XC6SLX75T-4FGG484C support JTAG boundary-scan testing?
Yes, XC6SLX75T-4FGG484C fully supports IEEE 1149.1 JTAG boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device implements mandatory instruction register and boundary-scan register logic, enabling board-level interconnect verification and in-system programming without requiring external configuration memory.
Can XC6SLX75T-4FGG484C configure itself from a serial NOR flash device?
Yes, XC6SLX75T-4FGG484C supports master SPI configuration mode and can autonomously load its bitstream from standard 3.3 V serial NOR flash devices such as Spansion S25FL series. The configuration process begins automatically after power-up when M0–M2 pins are set to 001, and requires no external controller intervention.
What I/O standards are supported on Bank 14 of XC6SLX75T-4FGG484C?
Bank 14 of XC6SLX75T-4FGG484C supports LVDS_25, LVDS_33, BLVDS_25, RSDS_25, and differential SSTL18_I. These standards are enabled by VCCO = 2.5 V or 3.3 V and require proper termination matching per Xilinx UG381. Single-ended standards like LVTTL or LVCMOS are not supported in this bank.
Is XC6SLX75T-4FGG484C qualified for automotive applications?
No, XC6SLX75T-4FGG484C is rated for commercial temperature range (0°C to +85°C) and is not AEC-Q100 qualified. For automotive use, designers must select XA Spartan-6 derivatives such as XA6SLX75T-4FGG484Q, which undergo extended temperature screening and qualification testing per automotive reliability standards.
XC6SLX75T-4FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 268
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX75T-4FGG484C FAQ
1.How can I place an order for XC6SLX75T-4FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-4FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-4FGG484C reliable?
The price and inventory of XC6SLX75T-4FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-4FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-4FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-4FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-4FGG484C?
XC6SLX75T-4FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-4FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-4FGG484C?
For technical support, including XC6SLX75T-4FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-4FGG484C requirements.
6.How does Aetrix verify that XC6SLX75T-4FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-4FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-4FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-4FGG484C?
All XC6SLX75T-4FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-4FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-4FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX75T-4FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX75T-4FGG484C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
