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AMD XC6SLX75T-4FGG676C
- Part No.:
- XC6SLX75T-4FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX75T-4FGG676C.pdf
- Description:
- IC FPGA 348 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,363
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Product details
Overview
XC6SLX75T-4FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, 3.2 Mb of total block RAM, and operates at -4 speed grade with 1.2 V core supply. It is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) with RoHS-compliant lead-free finish and targets high-volume industrial control and embedded vision systems.
For engineers reviewing the XC6SLX75T-4FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), differential signaling support (LVDS, TMDS), embedded memory depth, and thermal performance in convection-cooled enclosures.
Technical Context
The XC6SLX75T-4FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates six clock management tiles (CMTs), each containing a DCM and PLL for precise clock synthesis and phase alignment across multiple domains.
It supports SelectIO™ technology with programmable drive strength (2–24 mA), slew rate control, and on-die termination (up to 150 Ω). Configuration is performed via Master SPI, Slave Serial, or JTAG, with bitstream encryption available using AES-256.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 3,200 kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external SRAM |
| DSP Slices | 180 × DSP48A1 - enables fixed-point multiply-accumulate operations at up to 250 MHz |
| User I/O Pins | 480 - supports wide parallel interfaces, multi-channel ADC/DAC, or high-density peripheral expansion |
| Speed Grade | -4 - guarantees timing closure at 100% worst-case junction temperature (85°C) and voltage (1.14–1.26 V) |
| Configuration Mode | Master SPI / Slave Serial / JTAG - enables flexible, field-upgradable bitstream loading |
| Operating Temp | 0°C to 85°C (Commercial) - validated for use in non-extended-temperature industrial environments |
Pinout & Package
XC6SLX75T-4FGG676C is housed in a 676-ball Fine-Pitch BGA (FGG) package with 1.0 mm ball pitch, 27 × 27 array, and 35 mm × 35 mm body size. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply (1.2/1.5/1.8/2.5/3.3 V selectable per bank) |
| A2 | IO_L0N_0 | Differential input pair (negative) for Bank 0, supports LVDS/TTL/PCI |
| B2 | IO_L0P_0 | Differential input pair (positive) for Bank 0, paired with A2 |
| T1 | CCLK | Configuration clock output during Master SPI mode; drives external PROM |
| R2 | DONE | Open-drain status signal indicating successful configuration completion |
| P2 | INIT_B | Active-low open-drain signal indicating device readiness for configuration |
| Y1 | VCCAUX | 1.8 V auxiliary supply for configuration logic, clock management, and transceivers |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CMT clocking | 6 independent clock management tiles (DCM + PLL) enable multi-domain clock generation with < ±100 ps jitter |
| SelectIO™ technology | Per-bank voltage and standard flexibility allows mixed-voltage I/O interfacing (e.g., 3.3 V microcontroller + 1.8 V sensor) |
| AES-256 bitstream encryption | Hardware-accelerated encryption prevents reverse engineering and unauthorized configuration cloning |
| Embedded Block RAM | Configurable as true dual-port RAM, ROM, or shift register - eliminates need for external memory in many control loops |
| Low-power 45 nm process | Reduces dynamic and static power vs. previous 90 nm Spartan families, enabling fanless operation in space-constrained enclosures |
Applications
| Industrial PLC Logic Controller | Machine Vision Preprocessing Unit |
|---|---|
Use Scenario: Real-time ladder logic execution and deterministic I/O scanning in modular automation racks. IC Role / Device Role / Timing Role: Configurable logic fabric implements custom motion control state machines and high-speed encoder capture with sub-microsecond latency. Use Value: 480 user I/Os allow direct connection to 32+ discrete sensors/actuators; -4 speed grade ensures cycle time stability under ambient temperature swings. | Use Scenario: On-camera pixel-level filtering, Bayer demosaicing, and ROI cropping before sending data to host processor. IC Role / Device Role / Timing Role: Parallel pipeline accelerator offloading CPU-intensive image processing tasks using embedded DSP48A1 slices. Use Value: 180 DSP slices deliver >2.5 GOPS at 200 MHz, enabling real-time 1080p@60fps preprocessing without external co-processor. |
| Medical Imaging Data Aggregator | Avionics Display Interface Bridge |
Use Scenario: Consolidating analog and digital signals from ultrasound, ECG, and pulse oximetry modules into unified LVDS video stream. IC Role / Device Role / Timing Role: Protocol translator and serializer handling multiple asynchronous inputs with precise timestamp alignment. Use Value: SelectIO™ supports simultaneous LVDS, RSDS, and CMOS I/O standards; block RAM buffers transient data bursts during bus arbitration. | Use Scenario: Converting ARINC 429 or RS-422 avionics bus data into RGB/TTL or LVDS display signals for cockpit HUDs. IC Role / Device Role / Timing Role: Deterministic interface bridge with hardware CRC generation and error logging for DO-254 compliance. Use Value: AES-256 encryption secures configuration bitstream; CMT-based clock domain crossing ensures pixel-clock stability across safety-critical display paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-TQG144C | Fewer logic cells (9,152), no DSP slices, 102 user I/Os, TQFP-144 package | Suitable for low-complexity control-only designs with minimal math or memory needs | Select when cost, board area, and thermal envelope constrain use of larger FPGAs |
| XC7A35T-CPG236C | Artix-7 architecture, 33,280 logic cells, 90 DSP slices, 105 user I/Os, smaller 236-pin CP package | Better power efficiency and higher DSP density per mm², but requires migration to Vivado toolchain | Choose for new designs prioritizing lower static power and future roadmap continuity over legacy ISE compatibility |
Compared with XC6SLX75T-4FGG676C, XC6SLX9-TQG144C trades scalability for footprint and cost reduction, while XC7A35T-CPG236C offers architectural modernization and improved DSP efficiency at the expense of toolchain and pinout discontinuity.
Availability
XC6SLX75T-4FGG676C is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and avionics display interfaces requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX75T-4FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software-defined SoCs for high-performance embedded and datacenter applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable I/O flexibility, moderate logic density, and low static power - especially where long-lifecycle support and mature toolchain (ISE) stability are critical.
FAQ
What is the maximum operating frequency of the XC6SLX75T-4FGG676C?
The XC6SLX75T-4FGG676C is rated for a -4 speed grade, meaning its internal logic paths are guaranteed to operate reliably up to 500 MHz for register-to-register transfers under worst-case voltage (1.14–1.26 V) and temperature (85°C) conditions. Actual achievable frequency depends on design placement, routing, and resource utilization - typical system clocks range from 100–250 MHz for balanced logic and I/O workloads. The XC6SLX75T-4FGG676C supports higher frequencies in specific paths using dedicated carry chains or DSP slices.
Does the XC6SLX75T-4FGG676C support JTAG boundary-scan testing?
Yes, the XC6SLX75T-4FGG676C fully supports IEEE 1149.1 (JTAG) boundary-scan testing through dedicated TDI, TDO, TMS, and TCK pins. This enables in-circuit verification of solder joints, interconnect integrity, and basic device presence prior to configuration. The XC6SLX75T-4FGG676C also uses JTAG for programming, debugging, and accessing internal configuration registers during development and production test.
Can the XC6SLX75T-4FGG676C be configured using an external SPI flash memory?
Yes, the XC6SLX75T-4FGG676C supports Master SPI configuration mode, where it actively clocks out CCLK and reads the configuration bitstream from a standard quad-SPI or standard SPI flash memory (e.g., Micron MT25QL, Spansion S25FL). The XC6SLX75T-4FGG676C initializes the flash interface automatically upon power-up when M[2:0] pins are set to 001, eliminating need for external controllers.
What I/O standards are supported by the XC6SLX75T-4FGG676C?
The XC6SLX75T-4FGG676C supports 21 I/O standards including LVCMOS, LVTTL, PCI, SSTL, HSTL, and differential standards such as LVDS, RSDS, and BLVDS - all configurable per I/O bank. Each bank operates at a single VCCO voltage (1.2 V to 3.3 V), allowing mixed-voltage operation across banks. The XC6SLX75T-4FGG676C does not support DDR3 or MIPI D-PHY natively without external PHY bridging.
Is the XC6SLX75T-4FGG676C still in active production and supported by AMD?
Yes, the XC6SLX75T-4FGG676C remains in active production and is supported by AMD through its Long-Term Support (LTS) program for Spartan-6 devices. AMD provides continued access to ISE Design Suite 14.7, technical documentation, and lifecycle notifications. The XC6SLX75T-4FGG676C has a published product change notification (PCN) history and is designated for extended availability in industrial and medical applications.
XC6SLX75T-4FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 348
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX75T-4FGG676C FAQ
1.How can I place an order for XC6SLX75T-4FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-4FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-4FGG676C reliable?
The price and inventory of XC6SLX75T-4FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-4FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-4FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-4FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-4FGG676C?
XC6SLX75T-4FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-4FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-4FGG676C?
For technical support, including XC6SLX75T-4FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-4FGG676C requirements.
6.How does Aetrix verify that XC6SLX75T-4FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-4FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-4FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-4FGG676C?
All XC6SLX75T-4FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-4FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-4FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX75T-4FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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