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AMD XC6SLX75T-N3CSG484I
- Part No.:
- XC6SLX75T-N3CSG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, CSPBGA
- Datasheet:
-
XC6SLX75T-N3CSG484I.pdf
- Description:
- IC FPGA 292 I/O 484CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,083
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Product details
Overview
XC6SLX75T-N3CSG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, and 3.2 MB of total block RAM. It operates at -3 speed grade with industrial temperature range (–40°C to +100°C) and uses a 484-pin CSBGA package. It is deployed in industrial motor control systems requiring deterministic I/O timing and real-time logic processing.
For engineers reviewing the XC6SLX75T-N3CSG484I datasheet, pinout, applications, or equivalent options, key selection factors include I/O bank voltage flexibility (1.2 V/1.8 V/2.5 V/3.3 V), LVDS support, built-in clock management (DCM), and JTAG boundary-scan compliance for production testability.
Technical Context
The XC6SLX75T-N3CSG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates six Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty-cycle correction across multiple clock domains.
I/O banks are organized into eight groups with independent VCCO and VREF settings per bank, enabling mixed-voltage interface operation. Each bank supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling such as LVDS and RSDS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - provides gate count equivalent to ~450K ASIC gates for medium-complexity digital logic implementation |
| DSP Slices | 180 × DSP48A1 - enables parallel multiply-accumulate operations for motor control algorithms and FIR filtering |
| Block RAM | 3,204 kbit (3.2 MB) - supports dual-port buffering, FIFOs, and lookup tables without external memory |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in critical paths under industrial temperature conditions |
| I/O Pins | 349 user I/O - supports high-density peripheral interfacing with bank-wise voltage isolation |
| Operating Temp | –40°C to +100°C - qualified for deployment in enclosed industrial enclosures without forced cooling |
| Package | 484-pin CSBGA (23×23 mm, 1.0 mm pitch) - enables compact PCB layout with thermal via compatibility |
Pinout & Package
XC6SLX75T-N3CSG484I is housed in a 484-pin Ceramic Substrate Ball Grid Array (CSBGA) package with 23×23 ball array and 1.0 mm pitch. Thermal and mechanical design supports reflow soldering per IPC/JEDEC J-STD-020D.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | 1.2 V core supply input - must be filtered locally with ≥10 µF ceramic capacitor |
| P17 | VCCAUX | 2.5 V auxiliary supply for configuration and JTAG circuitry |
| A14 | PROGRAM_B | Active-low asynchronous reset for configuration state machine |
| T16 | DONE | Open-drain status output indicating successful configuration completion |
| R15 | INIT_B | Open-drain output reflecting internal configuration controller readiness |
| H16 | TCK | JTAG test clock input - requires 10 kΩ pull-up for IEEE 1149.1 compliance |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Six fully independent Digital Clock Managers provide jitter-tolerant clock synthesis and phase alignment without external PLL ICs |
| SelectIO Technology | Per-bank programmable I/O standards support concurrent 1.8 V and 3.3 V interfaces on adjacent pins, reducing level-shifter count |
| Configurable Logic Blocks | Each CLB contains four 6-LUTs and eight flip-flops - optimized for pipelined control logic and state-machine acceleration |
| Embedded Memory | 18 kbit block RAM primitives can be configured as true dual-port RAM, ROM, or shift register - eliminates need for discrete SRAM in data buffering |
| Multi-Boot Support | Internal configuration memory allows dual-bitstream storage and runtime switching - enables field-upgradable firmware without external flash controller |
Applications
| Industrial Motor Drives | Programmable Logic Controllers |
|---|---|
Use Scenario: Real-time current loop control and encoder position decoding in servo drives. IC Role / Device Role / Timing Role: FPGA fabric executes PID computation and PWM generation with sub-microsecond latency; DCMs synchronize ADC sampling and gate driver timing. Use Value: Enables closed-loop response times < 500 ns and deterministic jitter < ±50 ps across 16-axis coordinated motion. | Use Scenario: Modular I/O expansion and safety-critical logic execution in DIN-rail mounted PLCs. IC Role / Device Role / Timing Role: Configurable logic implements fail-safe watchdog timers, hot-swap arbitration, and protocol translation between Modbus RTU and EtherCAT. Use Value: Reduces BOM cost by consolidating three discrete logic ICs and supports SIL2-certifiable architectures via dual-lockstep configuration. |
| Medical Imaging Subsystems | Test & Measurement Equipment |
Use Scenario: High-speed data acquisition and real-time image preprocessing in ultrasound beamformers. IC Role / Device Role / Timing Role: Block RAM buffers raw ADC samples while DSP slices perform channel compensation and beam summation in pipeline stages. Use Value: Achieves 12-bit @ 65 MSPS throughput with on-chip gain/phase correction, eliminating external DSP co-processor. | Use Scenario: Flexible signal generation and analysis in automated test equipment (ATE) platforms. IC Role / Device Role / Timing Role: Generates synchronized multi-channel waveforms using distributed memory and captures response data with precise timestamping via DCM-derived clocks. Use Value: Supports 16-channel 100 MHz pattern generation with < 100 ps inter-channel skew and hardware-accelerated pass/fail decision logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX75-3FGG484I | Same logic capacity and I/O count but uses Fine-Pitch BGA (FBGA) package with 22×22 mm footprint and 1.0 mm pitch; lacks thermal pad | Preferred for space-constrained designs where thermal dissipation is managed externally; not suitable for high-power density industrial enclosures | Select when board area is prioritized over thermal performance and no internal heat spreading is required |
| XC7A75T-2CSG324I | Artix-7 successor with 75K logic cells, higher DSP density (210 slices), and 2.5× faster transceivers; requires different configuration voltage (1.8 V VCCO for CONFIG) | Enables PCIe Gen2 endpoint integration and higher-bandwidth sensor fusion; demands updated power delivery and layout rules | Choose for new designs needing higher throughput or SerDes capability; migration requires full PCB redesign |
Compared with XC6SLX75-3FGG484I, the XC6SLX75T-N3CSG484I offers superior thermal performance in sealed environments due to its ceramic substrate and integrated thermal pad; compared with XC7A75T-2CSG324I, it provides proven industrial qualification and lower power consumption at equivalent logic utilization, making it optimal for cost-sensitive, thermally constrained legacy upgrades.
Availability
XC6SLX75T-N3CSG484I is available at Aetrix Electronics and suitable for industrial motor drives, programmable logic controllers, and medical imaging subsystems requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX75T-N3CSG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing solutions including FPGAs, ACAPs, and software-defined platforms for data center, embedded, and edge applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low static power, flexible I/O, and industrial-grade reliability - particularly in motor control, industrial networking, and video processing.
FAQ
What is the maximum operating frequency supported by XC6SLX75T-N3CSG484I?
The XC6SLX75T-N3CSG484I is rated at speed grade -3, guaranteeing timing closure for system clocks up to 500 MHz in critical paths under industrial temperature conditions (–40°C to +100°C). Actual achievable frequency depends on design complexity, routing, and I/O standard selection. The XC6SLX75T-N3CSG484I includes six Digital Clock Managers that support internal frequency multiplication and phase alignment to meet these targets.
Does XC6SLX75T-N3CSG484I support JTAG boundary-scan testing?
Yes, the XC6SLX75T-N3CSG484I fully complies with IEEE 1149.1 (JTAG) boundary-scan standards. Its TCK, TMS, TDI, and TDO pins support in-system programming, device-level debugging, and production test access. The XC6SLX75T-N3CSG484I also provides mandatory INIT_B and DONE signals to coordinate JTAG-based configuration verification during manufacturing test sequences.
What I/O standards are supported by XC6SLX75T-N3CSG484I?
The XC6SLX75T-N3CSG484I supports SelectIO standards across eight independently powered I/O banks, including LVCMOS, LVTTL, SSTL, HSTL, and differential protocols such as LVDS and RSDS. Each bank accepts VCCO voltages of 1.2 V, 1.8 V, 2.5 V, or 3.3 V, allowing mixed-voltage operation on a single device. This capability is documented in the XC6SLX75T-N3CSG484I datasheet Table 13 and verified in Xilinx UG381.
Is XC6SLX75T-N3CSG484I qualified for industrial temperature operation?
Yes, the XC6SLX75T-N3CSG484I carries the 'I' suffix denoting industrial temperature grade, certified for continuous operation from –40°C to +100°C ambient. It undergoes extended burn-in and characterization across this range, and its CSBGA package includes thermal enhancement features suitable for sealed enclosures. The XC6SLX75T-N3CSG484I is commonly deployed in motor drives and PLCs where passive cooling is standard.
Can XC6SLX75T-N3CSG484I be configured via SPI flash memory?
Yes, the XC6SLX75T-N3CSG484I supports master serial configuration mode using industry-standard SPI flash devices (e.g., Micron, Spansion, Winbond). Configuration bitstream is loaded automatically on power-up via the dedicated CCLK and DIN pins. The XC6SLX75T-N3CSG484I also supports fallback and multi-boot modes when paired with appropriate flash memory addressing logic.
XC6SLX75T-N3CSG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 292
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-CSPBGA (19x19)
XC6SLX75T-N3CSG484I FAQ
1.How can I place an order for XC6SLX75T-N3CSG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-N3CSG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-N3CSG484I reliable?
The price and inventory of XC6SLX75T-N3CSG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-N3CSG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-N3CSG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-N3CSG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-N3CSG484I?
XC6SLX75T-N3CSG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-N3CSG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-N3CSG484I?
For technical support, including XC6SLX75T-N3CSG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-N3CSG484I requirements.
6.How does Aetrix verify that XC6SLX75T-N3CSG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-N3CSG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-N3CSG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-N3CSG484I?
All XC6SLX75T-N3CSG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-N3CSG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-N3CSG484I part is unused and in its original packaging.
Return procedure for XC6SLX75T-N3CSG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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