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AMD XC6SLX75T-N3FG484C
- Part No.:
- XC6SLX75T-N3FG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX75T-N3FG484C.pdf
- Description:
- IC FPGA 268 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,091
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Product details
Overview
XC6SLX75T-N3FG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, and 4,032 Kbits of block RAM. It operates at -3 speed grade, supports 1.2V core voltage, and is packaged in a 484-pin Fine-Pitch BGA (FG484) for high-density embedded control and interface bridging applications.
For engineers reviewing the XC6SLX75T-N3FG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (348 user I/Os), LVDS/PCIe Gen1-compatible transceivers, and support for DDR2/DDR3 memory interfaces in industrial automation and test equipment designs.
Technical Context
The XC6SLX75T-N3FG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates six CMT clock management tiles-each containing two DCMs and one PLL-for multi-domain clock synthesis and phase alignment.
It supports SelectIO standards including LVCMOS, LVDS, SSTL, and HSTL across 348 user-configurable I/O pins, and includes integrated PCI Express® endpoint capability (Gen1 x1/x2/x4) compliant with PCIe Base Specification v1.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom digital functions |
| DSP Slices | 180 × DSP48A1 - enables fixed-point multiply-accumulate operations at up to 250 MHz |
| Block RAM | 4,032 Kbits - supports dual-port memory buffers, FIFOs, and lookup tables up to 36 Kb per block |
| User I/O Pins | 348 - provides flexible interface connectivity for parallel buses, sensor arrays, and protocol bridges |
| Speed Grade | -3 - guarantees timing closure at 100% of rated frequency for critical paths in industrial temperature range |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
| PCIe Support | Gen1 x1/x2/x4 endpoint - enables direct host communication without external bridge ICs |
Pinout & Package
XC6SLX75T-N3FG484C is housed in a 484-ball Fine-Pitch BGA (FG484) package with 23×23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad is not present; thermal dissipation relies on PCB copper area and via stitching.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Power | Supplies 1.2–3.3 V to Bank 0 I/Os; must be decoupled locally per Xilinx UG381 |
| VCCAUX | Auxiliary Power | Provides 3.3 V to configuration logic, JTAG, and clock management circuitry |
| GND | Ground Reference | Multiple dedicated balls serve as low-inductance return paths for I/O and core domains |
| M0–M2 | Configuration Mode | Set boot mode (e.g., Master SPI, Slave SelectMAP) at power-up; pulled high/low externally |
| CCLK | Configuration Clock | Drives internal configuration shift register during SPI or SelectMAP programming |
| INIT_B | Configuration Status | Open-drain active-low signal indicating configuration memory readiness or error |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Endpoint | Eliminates need for external PCIe switch or bridge IC in endpoint-only systems |
| Dual-Register Flip-Flops | Enables time-multiplexed I/O or high-speed register retiming without LUT usage |
| DCM + PLL Clock Management | Supports jitter reduction, frequency synthesis, and phase shifting across six independent clock domains |
| SelectIO Technology | Allows mixed-voltage I/O banks (1.2V–3.3V) on same device for legacy and modern interface coexistence |
| ISE Design Suite Support | Ensures full synthesis, place-and-route, and bitstream generation compatibility with Xilinx ISE 14.7 |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time servo loop execution with encoder feedback and PWM output generation. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controller, encoder counter, and gate driver timing sequencer. Use Value: 74,880 logic cells enable concurrent motor axis control and HMI interface logic within single XC6SLX75T-N3FG484C. | Use Scenario: High-speed digital pattern generation and response capture for semiconductor device validation. IC Role / Device Role / Timing Role: XC6SLX75T-N3FG484C acts as programmable vector generator and comparator with sub-ns timing resolution. Use Value: 348 user I/Os and -3 speed grade support 100+ MHz parallel test vectors and real-time pass/fail analysis. |
| Medical Imaging Interface | Communications Backplane Bridge |
Use Scenario: Aggregation of multiple sensor data streams (ultrasound transducer arrays, ADC outputs) into a unified PCIe endpoint. IC Role / Device Role / Timing Role: XC6SLX75T-N3FG484C serves as PCIe Gen1 x4 endpoint bridging sensor interface logic to host CPU memory space. Use Value: Integrated PCIe hard IP reduces latency and eliminates external PHY, enabling deterministic 2 GB/s throughput in compact form factor. | Use Scenario: Protocol translation between legacy parallel bus (e.g., VME) and modern serial interconnect (PCIe/Serial RapidIO). IC Role / Device Role / Timing Role: XC6SLX75T-N3FG484C implements dual-bus master logic with DMA engines and address mapping tables. Use Value: 4,032 Kbits block RAM provides deep buffering for burst-mode transfers across mismatched bus widths and clock domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-TQG144C | Fewer logic cells (7,680), no PCIe hard IP, TQFP-144 package with only 102 I/Os | Suitable for low-complexity control logic only; cannot replace XC6SLX75T-N3FG484C in PCIe or high-I/O designs | Select only when design fits within 102 I/Os and requires no transceiver or high-speed memory interface |
| XC7A50T-CPG236C | Artix-7 architecture, 52,000 logic cells, PCIe Gen2 x2, 210 I/Os, smaller CPG236 package | Higher performance per watt but lower I/O count; lacks native DDR3 controller support in base configuration | Prefer for new designs needing PCIe Gen2 or lower power; not drop-in due to different pinout and configuration scheme |
Compared with XC6SLX75T-N3FG484C, XC6SLX9-TQG144C offers cost reduction at the expense of scalability and interface capability, while XC7A50T-CPG236C delivers architectural upgrades and Gen2 PCIe-but requires board redesign and toolchain migration.
Availability
XC6SLX75T-N3FG484C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging interface applications requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX75T-N3FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family-including XC6SLX75T-N3FG484C-was designed for cost-sensitive, high-volume applications demanding reliable I/O flexibility, embedded memory, and integrated interface IP without premium architecture overhead.
FAQ
What is the operating temperature range for XC6SLX75T-N3FG484C?
The XC6SLX75T-N3FG484C is rated for commercial temperature range (0°C to +85°C ambient), as indicated by the 'C' suffix in the part number. This specification applies to junction temperature under normal operating conditions with appropriate PCB thermal design per Xilinx UG381. The device does not support extended or industrial temperature grades.
Does XC6SLX75T-N3FG484C support DDR3 memory interfaces?
XC6SLX75T-N3FG484C supports DDR2 memory interfaces natively via its DQS-capable I/O banks and dedicated memory controller primitives. DDR3 support is not included in the Spartan-6 architecture; it requires external PHY or soft logic implementation, which is not recommended due to timing closure challenges and lack of vendor-verified IP.
Can XC6SLX75T-N3FG484C be programmed via JTAG after configuration?
Yes, XC6SLX75T-N3FG484C supports IEEE 1149.1 JTAG boundary-scan and in-system programming throughout its lifecycle. The JTAG port remains accessible post-configuration for debugging, partial reconfiguration, and SRAM content verification-provided TCK, TMS, TDI, TDO, and TREN_B are properly routed and terminated per UG381.
What configuration modes are supported by XC6SLX75T-N3FG484C?
XC6SLX75T-N3FG484C supports Master SPI, Slave SPI, Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstream can be loaded from SPI flash, external processor, or JTAG debugger, with fallback options defined in the startup sequence per UG380.
Is there a pin-compatible replacement for XC6SLX75T-N3FG484C in newer AMD FPGA families?
No pin-compatible replacement exists for XC6SLX75T-N3FG484C in AMD's 7-series or UltraScale families. The FG484 package and I/O assignment are unique to Spartan-6. Migration to Artix-7 or Kintex-7 requires complete PCB redesign, new power delivery, and updated constraints due to differing pin functions, voltage requirements, and configuration schemes.
XC6SLX75T-N3FG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 268
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX75T-N3FG484C FAQ
1.How can I place an order for XC6SLX75T-N3FG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-N3FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-N3FG484C reliable?
The price and inventory of XC6SLX75T-N3FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-N3FG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-N3FG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-N3FG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-N3FG484C?
XC6SLX75T-N3FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-N3FG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-N3FG484C?
For technical support, including XC6SLX75T-N3FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-N3FG484C requirements.
6.How does Aetrix verify that XC6SLX75T-N3FG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-N3FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-N3FG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-N3FG484C?
All XC6SLX75T-N3FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-N3FG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-N3FG484C part is unused and in its original packaging.
Return procedure for XC6SLX75T-N3FG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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