AMD XC6SLX75T-N3FG676C

Overview

XC6SLX75T-N3FG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, and 3.2 MB of total block RAM. It uses a 65 nm CMOS process, supports -3 speed grade, and is packaged in a 676-pin Fine-Pitch BGA (FG676) with 1.0 V core voltage. It targets high-volume industrial control and embedded vision systems requiring deterministic I/O timing and low static power.

For engineers reviewing the XC6SLX75T-N3FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2–3.3 V), LVDS/BLVDS support, integrated clock management (DCM), and compatibility with Xilinx ISE Design Suite v14.7 for synthesis and place-and-route.

Technical Context

The XC6SLX75T-N3FG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates six Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction across multiple clock domains.

I/O banks are organized into eight groups with independent VCCO and VREF settings per bank, enabling mixed-voltage interface operation. Each I/O supports programmable slew rate, drive strength, and on-chip termination (up to 150 Ω parallel).

Key Specifications

Pinout & Package

XC6SLX75T-N3FG676C is housed in a 27×27 mm, 676-ball Fine-Pitch BGA (FG676) package with 1.0 mm ball pitch and Pb-free (RoHS-compliant) finish. The package supports thermal dissipation up to 3.5 W under typical industrial ambient conditions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface applications.

Compared with XC6SLX75T-N3FG676C, XC6SLX150T-3FG676C offers scalable logic headroom within identical footprint and toolflow, while XC7S75-2FTG676C delivers architectural improvements at the cost of legacy I/O constraint compatibility and ISE-to-Vivado migration effort.

Availability

XC6SLX75T-N3FG676C is available at Aetrix Electronics and suitable for industrial motion control, embedded vision processing, and avionics data acquisition requiring stable component supply across long-lifecycle programs.

Supply support for XC6SLX75T-N3FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.

The Spartan-6 family was designed for high-volume, cost-sensitive applications demanding low-power logic fabric, flexible I/O, and mature tool support - targeting industrial automation, broadcast, and medical imaging systems.

FAQ

What is the maximum operating frequency of the XC6SLX75T-N3FG676C?

The XC6SLX75T-N3FG676C supports a maximum system clock frequency of 750 MHz for internal logic and 1.2 GHz for dedicated clock networks, as validated in Xilinx DS162 for speed grade -3. Actual achievable frequency depends on design complexity, routing, and thermal conditions. The XC6SLX75T-N3FG676C DCMs deliver stable output clocks up to 500 MHz with jitter under ±150 ps.

Does the XC6SLX75T-N3FG676C support JTAG boundary scan?

Yes, the XC6SLX75T-N3FG676C includes IEEE 1149.1-compliant JTAG TAP controller for boundary scan testing, configuration via JTAG, and debug access using Xilinx ChipScope or third-party tools. All four JTAG pins (TCK, TMS, TDI, TDO) are dedicated and mapped to specific FG676 balls. The XC6SLX75T-N3FG676C also supports internal logic analyzer integration through ICON and ILA cores.

What configuration modes does the XC6SLX75T-N3FG676C support?

The XC6SLX75T-N3FG676C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. It can boot from external SPI flash (up to 128 Mbit), load bitstreams from microcontroller over parallel bus, or accept configuration data via JTAG. Configuration bitstream encryption and HMAC authentication are not supported in this Spartan-6 variant; the XC6SLX75T-N3FG676C relies on external security mechanisms for IP protection.

Is the XC6SLX75T-N3FG676C RoHS compliant?

Yes, the XC6SLX75T-N3FG676C is manufactured with lead-free (Pb-free) solder balls and complies with EU RoHS Directive 2011/65/EU and China RoHS II. The FG676 package uses matte tin finish on copper pillars and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The XC6SLX75T-N3FG676C is rated for industrial temperature range (-40°C to +100°C junction).

Can the XC6SLX75T-N3FG676C interface directly with DDR2 SDRAM?

Yes, the XC6SLX75T-N3FG676C supports DDR2 SDRAM interfaces up to 400 Mbps data rate using its SelectIO resources and built-in IDELAY/ODELAY primitives. It requires external termination resistors and careful PCB layout for signal integrity. The XC6SLX75T-N3FG676C does not include hard DDR2 controller logic - implementation relies on Xilinx MIG v3.7 IP core targeting Spartan-6 architecture.