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AMD XC6SLX75T-N3FGG484C
- Part No.:
- XC6SLX75T-N3FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX75T-N3FGG484C.pdf
- Description:
- IC FPGA 268 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,015
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Product details
Overview
XC6SLX75T-N3FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 MB of block RAM, and support for DDR2/DDR3 memory interfaces. It integrates dual 18×18 multipliers, digital clock managers (DCMs), and I/Os compliant with LVCMOS, LVDS, and SSTL standards. Used in industrial imaging systems requiring real-time pixel processing and low-latency frame buffering.
For engineers reviewing the XC6SLX75T-N3FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, embedded memory capacity, I/O voltage flexibility, and DCM-based clock synthesis capability for deterministic timing closure.
Technical Context
The XC6SLX75T-N3FGG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It includes six Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction - each capable of generating up to eight independent output clocks.
Its SelectIO™ technology supports 24 I/O standards across 348 user-configurable pins, including programmable slew rate and drive strength. The device uses 45 nm CMOS process technology and operates at -3 speed grade (1.2 V core, industrial temperature range).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - provides sufficient resources for mid-complexity control + datapath logic in video preprocessing pipelines |
| Block RAM | 3.2 MB - enables dual-port frame buffers for progressive scan image capture at 1080p60 |
| Multipliers | 180 × 18×18 - supports real-time FIR filtering and color space conversion without external DSP |
| DCMs | 6 × DCM - allows independent clock domain management for sensor interface, memory controller, and output serialization |
| I/O Pins | 348 user I/O - accommodates parallel CMOS image sensor bus, DDR3 SDRAM, and high-speed serial links |
| Speed Grade | -3 - guarantees timing closure at 500 MHz system clock with 1.2 V core supply and industrial temp range |
| Process Node | 45 nm - balances power efficiency and performance for fanless industrial enclosures |
Pinout & Package
XC6SLX75T-N3FGG484C is housed in a 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 27 mm × 27 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) finish. Thermal pad on underside requires solder paste stencil design per Xilinx UG381.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% required; decoupling must be within 5 mm of each VCCINT ball group |
| VCCAUX | Auxiliary power supply | 2.5 V or 3.3 V for configuration, JTAG, and DCM circuitry |
| VCCO | I/O bank power | Configurable per bank (1.2–3.3 V); determines compatible interface standards (e.g., SSTL18, LVCMOS25) |
| CONFIG_DONE | Configuration status indicator | Open-drain output pulled high externally; signals successful bitstream loading |
| INIT_B | Configuration initialization | Active-low input; driven low during configuration errors or reconfiguration requests |
| PROGRAM_B | Configuration reset | Active-low input; forces reload of configuration memory from external SPI flash |
Key Features
| Feature | Design Value |
|---|---|
| Dual-ported Block RAM | Enables simultaneous read/write access for ping-pong frame buffering in machine vision applications |
| SelectIO™ Technology | Supports mixed-voltage I/O banks - allows direct interfacing to 1.8 V image sensors and 1.5 V DDR3 memory on same device |
| Digital Clock Manager (DCM) | Provides jitter < ±100 ps RMS for pixel clock generation and synchronous data capture from parallel sensors |
| Embedded Multipliers | 18×18 signed multiplication completed in single cycle - accelerates edge detection and histogram computation |
| ISE Design Suite Support | Full toolchain compatibility including synthesis, place-and-route, and bitstream generation using Xilinx ISE 14.7 |
Applications
| Industrial Machine Vision | Medical Endoscopy Imaging |
|---|---|
Use Scenario: Real-time defect detection on high-speed production lines using CMOS area sensors. IC Role / Device Role / Timing Role: FPGA acts as pixel-level preprocessor and frame synchronizer, managing sensor timing, Bayer demosaicing, and ROI extraction. Use Value: 74,880 logic cells and 3.2 MB block RAM enable concurrent 1080p60 capture and hardware-accelerated convolution kernels. | Use Scenario: Miniaturized endoscopic camera head with integrated image pipeline and HDMI output. IC Role / Device Role / Timing Role: Configurable logic handles sensor interface timing, gamma correction LUTs, and HDMI TMDS serialization. Use Value: SelectIO™ supports 1.8 V LVCMOS for ultra-low-power image sensor interface and 3.3 V for HDMI PHY control signals. |
| Avionics Data Acquisition | Test & Measurement Equipment |
Use Scenario: Ruggedized flight data recorder capturing analog sensor inputs via ADCs and storing to flash. IC Role / Device Role / Timing Role: FPGA implements time-stamped sampling, CRC generation, and flash wear-leveling logic. Use Value: Six DCMs ensure precise synchronization across multiple ADC channels and isolated flash interface clock domains. | Use Scenario: Modular signal generator with arbitrary waveform synthesis and real-time modulation. IC Role / Device Role / Timing Role: FPGA generates high-resolution DAC control waveforms and manages PCIe host interface for pattern upload. Use Value: 180 embedded multipliers enable real-time IQ modulation math; 348 I/Os support parallel DAC bus and PCIe x4 edge connector. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC6SLX9-TQG144C | Lower logic density (9,152 LUTs), no DDR3 support, only 2 DCMs, TQFP-144 package | Suitable for simple control logic or low-resolution sensor interface only | Select when cost and board space constrain requirements below 1080p processing needs |
| AMD XC7A75T-2CSG324C | Artix-7 architecture, higher logic density (74,000 LUTs), 2.5x more block RAM, native PCIe Gen2 endpoint support | Required for designs needing PCIe host interface or >100 MHz DDR3 bandwidth | Choose for new designs targeting longer lifecycle and enhanced I/O bandwidth beyond Spartan-6 capabilities |
Compared with XC6SLX75T-N3FGG484C, XC6SLX9-TQG144C lacks sufficient resources for full HD frame buffering, while XC7A75T-2CSG324C offers architectural upgrades but requires PCB redesign due to different package and power delivery requirements.
Availability
XC6SLX75T-N3FGG484C is available at Aetrix Electronics and suitable for industrial imaging, avionics data acquisition, and test equipment requiring stable component supply through extended product lifecycles.
Supply support for XC6SLX75T-N3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and edge applications.
The Spartan-6 family, including XC6SLX75T-N3FGG484C, was designed for cost-sensitive, high-volume applications requiring reliable I/O flexibility, moderate logic density, and industrial-grade thermal performance.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6SLX75T-N3FGG484C?
The XC6SLX75T-N3FGG484C supports DDR3 SDRAM interfaces up to 800 Mbps data rate (400 MHz clock) using its dedicated memory controller logic and I/O banks configured for SSTL15. This capability is validated in Xilinx UG388 and enables use in frame buffer subsystems for 1080p60 video applications. The XC6SLX75T-N3FGG484C requires proper PCB layout with matched trace lengths and controlled impedance for reliable operation at this speed.
Does XC6SLX75T-N3FGG484C support JTAG boundary-scan testing?
Yes, XC6SLX75T-N3FGG484C includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug. All four JTAG pins (TCK, TMS, TDI, TDO) are assigned to dedicated package balls and require 2.5 V VCCAUX supply. The XC6SLX75T-N3FGG484C supports INTEST and SAMPLE instructions per Xilinx UG381, enabling manufacturing test coverage for board-level interconnects.
What configuration modes are supported by XC6SLX75T-N3FGG484C?
XC6SLX75T-N3FGG484C supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial mode uses an external SPI flash (e.g., Micron N25Q series) connected to dedicated configuration pins. The XC6SLX75T-N3FGG484C boots automatically after power-up when M[2:0] pins are set to 001. Configuration bitstream can also be loaded dynamically via JTAG for field updates.
Is XC6SLX75T-N3FGG484C qualified for automotive applications?
No, XC6SLX75T-N3FGG484C is rated for industrial temperature range (–40°C to +100°C case temperature) and is not AEC-Q100 qualified. It lacks automotive-specific reliability screening, failure-in-time (FIT) reporting, and extended temperature validation. For automotive use, AMD recommends the XA Spartan-6 family (e.g., XA6SLX75), which undergoes additional qualification testing and offers identical logic resources with automotive-grade packaging and screening.
Can XC6SLX75T-N3FGG484C implement a PCI Express endpoint?
No, XC6SLX75T-N3FGG484C does not include native PCI Express hard IP blocks. It lacks the dedicated transceivers and protocol stack required for PCIe Gen1 compliance. While soft-core PCIe implementations exist, they consume significant logic resources and do not meet standard compliance requirements. For PCIe connectivity, AMD recommends Artix-7 devices such as XC7A75T-2CSG324C, which includes integrated PCIe Gen2 endpoint blocks compatible with the XC6SLX75T-N3FGG484C's target applications.
XC6SLX75T-N3FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 268
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX75T-N3FGG484C FAQ
1.How can I place an order for XC6SLX75T-N3FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-N3FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-N3FGG484C reliable?
The price and inventory of XC6SLX75T-N3FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-N3FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-N3FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-N3FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-N3FGG484C?
XC6SLX75T-N3FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-N3FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-N3FGG484C?
For technical support, including XC6SLX75T-N3FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-N3FGG484C requirements.
6.How does Aetrix verify that XC6SLX75T-N3FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-N3FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-N3FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-N3FGG484C?
All XC6SLX75T-N3FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-N3FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-N3FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX75T-N3FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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