AMD XC6SLX75T-N3FGG484I
- Part No.:
- XC6SLX75T-N3FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX75T-N3FGG484I.pdf
- Description:
- IC FPGA 268 I/O 484FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,955
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Product details
Overview
XC6SLX75T-N3FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, 3.2 MB of total block RAM, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It is used in industrial motor control systems requiring deterministic I/O timing and real-time logic processing.
For engineers reviewing the XC6SLX75T-N3FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS support, configuration interface options (SPI/BPI), and thermal performance in convection-cooled enclosures.
Technical Context
The XC6SLX75T-N3FGG484I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports SelectIO™ standards including LVCMOS, LVTTL, LVDS, and TMDS up to 1.0 Gbps per differential pair.
Configuration is performed via Master SPI, Slave SPI, or BPI parallel mode using on-chip startup circuitry and internal voltage regulation. The device includes integrated clock management with two DCMs (Digital Clock Managers) supporting phase shifting, frequency synthesis, and duty cycle correction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - provides sufficient resources for medium-complexity digital controllers and protocol bridges |
| User I/O Pins | 348 - supports high-density interface routing for industrial backplanes and sensor arrays |
| Block RAM | 3.2 MB - enables local buffering of video frames or multi-axis motion profiles without external memory |
| DSP Slices | 180 × DSP48A1 - delivers 180 parallel 25×18-bit multiply-accumulate operations per clock cycle |
| Speed Grade | -3 - guarantees timing closure at 500 MHz system clock with worst-case industrial temperature derating |
| Operating Temp | -40°C to +100°C - qualified for sealed industrial enclosures without active cooling |
| Configuration Mode | Master/Slave SPI, BPI - allows flexible boot from serial flash or parallel NOR devices |
Pinout & Package
XC6SLX75T-N3FGG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports standard reflow profiles and provides thermal pad compatibility for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 4.7 µF near package |
| P2 | CLKIN_1 | Dedicated single-ended clock input for DCM0 - accepts 1.2–200 MHz CMOS/LVCMOS |
| A19 | M0 | BPI configuration mode select - low = x16 data bus width, high = x8 |
| T18 | PROGRAM_B | Active-low asynchronous reset - initiates full reconfiguration when pulsed low |
| Y17 | CCLK | Configuration clock output - drives external SPI flash during master mode boot |
| R14 | INIT_B | Open-drain status indicator - goes high-Z after successful bitstream load |
Key Features
| Feature | Design Value |
|---|---|
| Dual DCM clock management | Enables independent clock domain crossing between 25 MHz encoder feedback and 100 MHz EtherCAT MAC layer |
| SelectIO™ technology | Supports mixed-voltage I/O banks (1.2 V to 3.3 V) enabling direct interfacing with legacy fieldbus transceivers |
| Integrated PCIe® endpoint logic | Provides Gen1 x1 root complex compatibility without external bridge IC - reduces BOM count by one component |
| Power-optimized architecture | Reduces dynamic power by 40% vs. Virtex-5 at equivalent logic density - critical for fanless industrial HMIs |
| ISE Design Suite support | Full toolchain compatibility through Xilinx ISE 14.7 - avoids migration cost for legacy motor drive designs |
Applications
| Industrial Motor Drive Controller | Programmable Logic Relay (PLR) |
|---|---|
Use Scenario: Closed-loop vector control of 3-phase PMSM motors with dual current loop sampling at 20 kHz. IC Role / Device Role / Timing Role: Real-time PWM generator with dead-time insertion, ADC interface, and position loop computation engine. Use Value: Deterministic 250 ns interrupt latency ensures sub-microsecond response to overcurrent faults. | Use Scenario: Replacement for electromechanical relays in HVAC zone control panels with 32 discrete inputs/outputs. IC Role / Device Role / Timing Role: Configurable logic sequencer implementing safety interlocks and state-based sequencing per UL 508A. Use Value: 348 user I/Os allow full integration of DIN-rail I/O expansion without external glue logic. |
| Machine Vision Preprocessor | Industrial Ethernet Gateway |
Use Scenario: Real-time Bayer demosaicing and edge detection on 1280×960 monochrome CMOS sensor streams. IC Role / Device Role / Timing Role: Pixel pipeline accelerator with embedded block RAM frame buffers and parallel pixel arithmetic units. Use Value: On-chip 3.2 MB RAM eliminates need for external DDR2, reducing EMI and board area by 28%. | Use Scenario: Protocol translation between Modbus RTU field devices and EtherNet/IP supervisory SCADA systems. IC Role / Device Role / Timing Role: Dual-port memory controller bridging RS-485 UART and 100BASE-TX MAC with time-stamped packet forwarding. Use Value: Integrated DCMs synchronize UART sampling clocks to Ethernet PHY reference, eliminating jitter-induced CRC errors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based industrial control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX75-3FGG484C | Commercial temperature grade (0°C to +85°C); identical logic resources and I/O count | Limited to climate-controlled cabinet environments; not rated for ambient >85°C | Select only if operating environment remains within commercial temp range and cost sensitivity outweighs industrial qualification |
| XC6SLX100T-3FGG676I | Higher logic capacity (101,280 CLBs), larger 676-pin FBGA, +25% block RAM | Requires PCB redesign due to different package footprint and power delivery requirements | Choose when design requires >75K logic cells or additional high-speed transceivers not present in XC6SLX75T-N3FGG484I |
Compared with XC6SLX75-3FGG484C, the XC6SLX75T-N3FGG484I offers guaranteed operation at 100°C ambient, making it suitable for uncooled drive cabinets; versus XC6SLX100T-3FGG676I, it provides pin-compatible scalability only within the same FG484 package family - no direct upgrade path without layout change.
Availability
XC6SLX75T-N3FGG484I is available at Aetrix Electronics and suitable for industrial motor drives, programmable logic relays, and machine vision preprocessing systems requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX75T-N3FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, industrial, and automotive markets.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume industrial and embedded applications requiring low power, small form factor, and long-term availability - precisely the profile of XC6SLX75T-N3FGG484I.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX75T-N3FGG484I?
The XC6SLX75T-N3FGG484I supports I/O standards from 1.2 V to 3.3 V across its 12 selectable I/O banks. Each bank is independently configurable for LVCMOS, LVTTL, or differential standards like LVDS, with VCCO per bank set externally. This allows direct interfacing with both modern 1.8 V sensors and legacy 3.3 V fieldbus transceivers without level-shifting components. The XC6SLX75T-N3FGG484I datasheet specifies absolute maximum VCCO as 3.465 V.
Does XC6SLX75T-N3FGG484I include built-in configuration memory?
No, the XC6SLX75T-N3FGG484I does not include non-volatile configuration memory. It loads its bitstream from external sources such as SPI flash (Master SPI mode), parallel NOR flash (BPI mode), or host processor (Slave Serial/SelectMAP). Configuration occurs on power-up or after assertion of PROGRAM_B. The XC6SLX75T-N3FGG484I relies on external storage, which enables field updates and multiple configuration images - a key requirement for industrial firmware flexibility.
Can XC6SLX75T-N3FGG484I operate with a single 1.2 V supply?
No, the XC6SLX75T-N3FGG484I requires three distinct supply rails: VCCINT (1.2 V core), VCCAUX (2.5 V auxiliary), and VCCO (1.2–3.3 V I/O). These must be independently regulated and sequenced during power-up per Xilinx UG381 guidelines. Failure to meet VCCAUX ramp rate or sequencing order may result in configuration failure. The XC6SLX75T-N3FGG484I specification defines strict tolerances: ±3% for VCCINT and ±5% for VCCAUX/VCCO.
What clocking resources are available in XC6SLX75T-N3FGG484I?
The XC6SLX75T-N3FGG484I integrates two Digital Clock Managers (DCMs) - DCM_CLKGEN and DCM_ADV - each supporting input frequency ranges from 1.2 MHz to 200 MHz. They provide phase shifting, frequency synthesis (up/down multiplication), duty cycle correction, and spread-spectrum clocking. There are no PLLs in Spartan-6; all clock generation relies on DCMs. The XC6SLX75T-N3FGG484I supports up to eight global clock networks driven from these DCM outputs or dedicated clock pins.
Is XC6SLX75T-N3FGG484I compatible with Vivado Design Suite?
No, the XC6SLX75T-N3FGG484I is supported exclusively by Xilinx ISE Design Suite 14.7 and earlier versions. Vivado does not support Spartan-6 devices. Migration to newer toolchains requires FPGA replacement (e.g., Artix-7). For ongoing maintenance of legacy industrial systems, continued use of ISE 14.7 - with its verified timing models and device-specific constraints - remains essential. The XC6SLX75T-N3FGG484I bitstream format is incompatible with Vivado-generated configurations.
XC6SLX75T-N3FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 268
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX75T-N3FGG484I FAQ
1.How can I place an order for XC6SLX75T-N3FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-N3FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-N3FGG484I reliable?
The price and inventory of XC6SLX75T-N3FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-N3FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-N3FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-N3FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-N3FGG484I?
XC6SLX75T-N3FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-N3FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-N3FGG484I?
For technical support, including XC6SLX75T-N3FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-N3FGG484I requirements.
6.How does Aetrix verify that XC6SLX75T-N3FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-N3FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-N3FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-N3FGG484I?
All XC6SLX75T-N3FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-N3FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-N3FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX75T-N3FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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