My Inquiry
My Account
AMD XC6SLX75T-N3FGG676I
- Part No.:
- XC6SLX75T-N3FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX75T-N3FGG676I.pdf
- Description:
- IC FPGA 348 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,679
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX75T-N3FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 Mb of block RAM, 220 DSP48A1 slices, and operates at -3 speed grade with industrial temperature range (–40°C to +100°C). It is used in industrial motor control systems requiring deterministic I/O timing and real-time logic processing.
For engineers reviewing the XC6SLX75T-N3FGG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (480 user I/Os), differential signaling support (LVDS, TMDS), configuration interface options (SPI, SelectMAP), and thermal performance in sealed enclosures.
Technical Context
The XC6SLX75T-N3FGG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated carry chains, and distributed RAM. It supports multi-standard I/O banks with programmable drive strength (2–24 mA), slew rate control, and on-chip termination (100 Ω differential, 50–150 Ω single-ended).
Configuration is performed via Master SPI or Slave SelectMAP mode using external flash or processor. Bitstream encryption and SEU mitigation features are not included - this device lacks built-in AES decryption or CRC-based configuration monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom state machines or protocol engines |
| Block RAM | 3.2 Mb - supports dual-port buffering for video frame stores or FIFOs up to 256K × 16-bit depth |
| DSP Slices | 220 × DSP48A1 - enables fixed-point filtering, FFT, or motor control PWM generation at ≤250 MHz |
| User I/O Pins | 480 - provides high-density connectivity for parallel buses, sensor arrays, or multi-channel ADC interfaces |
| Speed Grade | -3 - guarantees timing closure at 500 MHz internal clocking with worst-case industrial temperature derating |
| Operating Temp | –40°C to +100°C - validated for deployment in unventilated industrial cabinets without active cooling |
Pinout & Package
XC6SLX75T-N3FGG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports standard reflow profiles and is compatible with automated optical inspection (AOI) and X-ray void detection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SPI mode; requires clean 50 MHz max clock with <1 ns jitter |
| DIN | Serial Configuration Data Input | Accepts bitstream LSB-first from SPI flash; no internal pull-up; must be driven externally |
| PROGRAM_B | Active-Low Configuration Reset | Asynchronous reset that clears configuration memory and restarts boot sequence on rising edge |
| INIT_B | Configuration Status Output | Open-drain signal indicating configuration status; pulled high externally to monitor load completion |
| IO_LxxN/IO_LxxP | Differential I/O Pair | Supports LVDS, RSDS, or BLVDS signaling with internal 100 Ω termination when enabled |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Each of 12 I/O banks independently supports 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V signaling - enables direct interfacing with mixed-voltage peripherals without level shifters |
| SelectIO Technology | Programmable drive strength (2–24 mA), slew rate control, and on-die termination reduce signal integrity issues in high-speed parallel bus designs |
| Dedicated Clock Routing | Eight global clock networks with low-skew distribution ensure synchronous timing across large logic partitions without manual routing constraints |
| Embedded Memory Blocks | 18 Kb block RAMs configurable as true dual-port, simple dual-port, or single-port RAM/ROM - supports independent read/write clocks for buffer decoupling |
Applications
| Industrial Motor Control | Video Processing Bridge |
|---|---|
Use Scenario: Closed-loop servo drive with field-oriented control (FOC) and real-time current sampling. IC Role / Device Role / Timing Role: FPGA fabric executes FOC algorithm, generates synchronized PWM outputs, and manages encoder feedback decoding. Use Value: 480 I/Os enable direct connection to 3-phase gate drivers, analog front-end, and position sensors without glue logic. | Use Scenario: HDMI-to-DisplayPort protocol translation in digital signage controllers. IC Role / Device Role / Timing Role: Implements TMDS receiver, pixel clock recovery, and DisplayPort serializer with embedded timing compensation. Use Value: SelectIO supports both 3.3 V HDMI input and 1.2 V DisplayPort output voltage domains simultaneously. |
| Medical Imaging Interface | Test & Measurement Equipment |
Use Scenario: Ultrasound beamformer data aggregation from 64-channel ADC array. IC Role / Device Role / Timing Role: Synchronizes parallel ADC samples, applies channel-specific delay compensation, and buffers data before PCIe transfer. Use Value: 3.2 Mb block RAM provides sufficient depth for 16-sample buffering per channel at 40 MSPS. | Use Scenario: Modular PXIe digitizer with programmable trigger routing and deep acquisition memory. IC Role / Device Role / Timing Role: Manages high-speed ADC interface, implements real-time trigger decision logic, and controls DDR2 memory controller. Use Value: -3 speed grade ensures reliable 200 MHz DDR2 clocking with setup/hold margin under industrial thermal stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX95T-3FGG676I | Higher logic density (94,080 LUTs), same package and I/O count - requires revised place-and-route but identical PCB footprint | Better suited for designs needing additional pipeline stages or larger state machines without board redesign | Select when future firmware expansion or added protocol support is anticipated |
| XC7S75-2FGG676I | Artix-7 generation with 74,000 logic cells, enhanced DSP (210 × DSP48E1), and integrated 12-bit ADC - not pin-compatible | Enables analog sensor integration and higher clock frequencies (up to 450 MHz system logic), but requires new layout and toolchain migration | Choose for new designs prioritizing power efficiency and mixed-signal integration over legacy compatibility |
Compared with XC6SLX75T-N3FGG676I, the XC6SLX95T-3FGG676I offers headroom within the same footprint, while the XC7S75-2FGG676I delivers architectural improvements at the cost of full hardware redesign - neither is a drop-in replacement.
Availability
XC6SLX75T-N3FGG676I is available at Aetrix Electronics and suitable for industrial motor control, medical imaging interface, and test & measurement equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX75T-N3FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-6 family was designed for cost-sensitive, high-volume industrial and automotive applications requiring reliable logic density, flexible I/O, and long-term availability - XC6SLX75T-N3FGG676I represents its highest-capacity industrial-grade variant.
FAQ
What is the maximum supported I/O standard for XC6SLX75T-N3FGG676I?
XC6SLX75T-N3FGG676I supports LVDS, RSDS, BLVDS, SSTL, HSTL, and PCI-X signaling standards across its 12 I/O banks. Each bank is independently configurable for voltage levels from 1.2 V to 3.3 V, enabling mixed-standard interfaces without external level shifters. Differential standards require pairing of adjacent IO_LxxN/IO_LxxP pins with internal 100 Ω termination enabled.
Does XC6SLX75T-N3FGG676I include built-in configuration security features?
No, XC6SLX75T-N3FGG676I does not include bitstream encryption, AES decryption, or configuration CRC checking. Its configuration relies on external SPI flash with optional external authentication mechanisms. Secure boot and tamper-resistant configuration are not supported - these capabilities were introduced in later 7-series and UltraScale families.
Can XC6SLX75T-N3FGG676I operate with a single 1.2 V supply for core logic?
Yes, XC6SLX75T-N3FGG676I requires a dedicated 1.2 V core supply (VCCINT) for FPGA fabric operation. This rail must be tightly regulated (±3%) and filtered per Xilinx UG380 guidelines. Additional supplies include 2.5 V or 3.3 V for I/O banks (VCCO) and 1.2 V or 2.5 V for auxiliary circuits (VCCAUX), depending on configuration mode and I/O usage.
What configuration modes are supported by XC6SLX75T-N3FGG676I?
XC6SLX75T-N3FGG676I supports Master SPI, Slave SelectMAP, JTAG, and boundary-scan configuration modes. Master SPI is most common for standalone boot from serial flash; Slave SelectMAP enables processor-controlled loading via parallel bus. JTAG is used for programming and debugging but not for production configuration.
Is XC6SLX75T-N3FGG676I qualified for automotive applications?
No, XC6SLX75T-N3FGG676I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While it meets thermal requirements for under-hood environments, it lacks automotive-specific reliability testing, failure reporting, and documentation required for Tier-1 automotive use. For automotive applications, AMD recommends the XA Spartan-6 family variants.
XC6SLX75T-N3FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 348
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX75T-N3FGG676I FAQ
1.How can I place an order for XC6SLX75T-N3FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75T-N3FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75T-N3FGG676I reliable?
The price and inventory of XC6SLX75T-N3FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75T-N3FGG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX75T-N3FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75T-N3FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75T-N3FGG676I?
XC6SLX75T-N3FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75T-N3FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75T-N3FGG676I?
For technical support, including XC6SLX75T-N3FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75T-N3FGG676I requirements.
6.How does Aetrix verify that XC6SLX75T-N3FGG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75T-N3FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75T-N3FGG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX75T-N3FGG676I?
All XC6SLX75T-N3FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75T-N3FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75T-N3FGG676I part is unused and in its original packaging.
Return procedure for XC6SLX75T-N3FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX75T-N3FGG676I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
