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AMD XC6SLX9-2CPG196C
- Part No.:
- XC6SLX9-2CPG196C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 196-TFBGA, CSBGA
- Datasheet:
-
XC6SLX9-2CPG196C.pdf
- Description:
- IC FPGA 106 I/O 196CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,667
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Product details
Overview
XC6SLX9-2CPG196C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 9,152 logic cells, 576 Kbits of block RAM, and a maximum I/O count of 102 in a 196-pin CPFGA (Chip Scale Package, Fine Pitch Ball Grid Array). It operates at -2 speed grade with 1.2 V core voltage and supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards. It is used in industrial control logic, low-power video interface bridging, and embedded system reconfigurable acceleration.
For engineers reviewing the XC6SLX9-2CPG196C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded memory capacity, and thermal performance in compact PCB layouts.
Technical Context
The XC6SLX9-2CPG196C implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated carry logic. It integrates up to 16 DSP48A1 slices for arithmetic-intensive tasks and supports dual-channel DDR2/DDR3 memory interfaces via dedicated I/O banks.
Configuration is performed via Master Serial or Slave SelectMAP modes using external SPI flash or processor-controlled parallel interface. JTAG boundary-scan support enables in-system debugging and programming verification per IEEE 1149.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - provides sufficient resources for medium-complexity control state machines and protocol translators |
| Block RAM | 576 Kbits - supports dual-port buffering for video FIFOs or packetized data streams |
| I/O Count | 102 - enables direct connection to microcontrollers, sensors, and display interfaces without glue logic |
| Core Voltage | 1.2 V ±3% - requires tight regulation; compatible with standard DC-DC converters for low-power systems |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz for critical paths in synchronous designs |
| I/O Standards | LVCMOS/LVTTL/SSTL/HSTL - allows interoperability with legacy and modern peripherals across voltage domains |
Pinout & Package
XC6SLX9-2CPG196C uses a 196-ball CPFGA (14 × 14 mm, 0.8 mm pitch) package with 102 user I/Os distributed across eight I/O banks. Power and ground balls are arranged to minimize supply noise and support simultaneous switching output (SSO) compliance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank 0 Supply | Configurable 1.2–3.3 V output drive voltage; must match connected peripheral VDDIO |
| VCCAUX | Auxiliary Supply | 1.8 V supply for configuration logic, JTAG, and internal clock circuitry |
| PROGRAM_B | Active-Low Configuration Init | Pull-low to reset configuration state and initiate reload from external SPI flash |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and device readiness |
| TCK/TMS/TDI/TDO | JTAG Interface | IEEE 1149.1-compliant test access port for boundary-scan and debug operations |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP48A1 Slices | 16 units supporting 18×18-bit multiply-accumulate with pipeline registers for real-time filtering |
| Embedded Memory | 576 Kbits of true dual-port block RAM enabling independent read/write ports per memory block |
| SelectIO Technology | Per-bank I/O voltage control allows mixed-voltage interfacing without level shifters |
| MultiBoot Support | Enables field-upgradable configurations via dual-image SPI flash with fail-safe fallback |
| ISE Design Suite Compatibility | Fully supported in Xilinx ISE 14.7 with place-and-route, timing analysis, and bitstream generation |
Applications
| Industrial PLC Logic | Video Interface Bridge |
|---|---|
Use Scenario: Replacing ASIC-based sequence controllers in modular automation cabinets with field-upgradable logic. IC Role / Device Role / Timing Role: Configurable logic fabric implementing ladder logic execution, I/O scanning, and serial protocol gateways (Modbus RTU/ASCII). Use Value: Reduces NRE cost versus custom ASIC while maintaining deterministic scan cycle timing under 10 ms. | Use Scenario: Converting parallel RGB video from an image sensor to MIPI D-PHY for downstream SoC input. IC Role / Device Role / Timing Role: Pixel-clock-synchronized bridge with programmable timing generator and data alignment logic. Use Value: Enables reuse of legacy sensor modules with newer mobile-class processors without redesigning sensor PCB. |
| Low-Power Edge Node | Test Equipment Control |
Use Scenario: Real-time signal preprocessing in battery-powered condition monitoring nodes with vibration and temperature sensors. IC Role / Device Role / Timing Role: Hardware-accelerated FFT and threshold detection engine operating from wake-on-interrupt mode. Use Value: Cuts MCU active time by 65% versus software-only FFT, extending battery life beyond 12 months. | Use Scenario: Managing stimulus-response sequencing and digital pattern capture in automated benchtop test fixtures. IC Role / Device Role / Timing Role: High-precision timing sequencer with sub-10 ns edge resolution and synchronized trigger I/O. Use Value: Eliminates need for external timing ICs and reduces fixture latency jitter to <2 ns RMS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2TQG144C | 144-pin TQFP package; lower I/O count (102 → 101), no bank 1.35 V support | Suitable for prototyping and space-constrained boards where BGA assembly is unavailable | Choose when lead-free reflow capability and manual soldering accessibility outweigh density and thermal advantages |
| LFE5U-12F-6BG256C | 12K LUTs, 1.2 V core, 256-ball fpBGA; lacks dedicated DSP slices and DDR PHY hard blocks | Better suited for ultra-low-power always-on functions but not high-speed memory interfacing | Prefer for battery-operated edge devices requiring <25 mW static power, not for DDR-connected subsystems |
Compared with XC6SLX9-2CPG196C, the XC6SLX9-2TQG144C trades thermal performance and I/O flexibility for assembly simplicity, while the LFE5U-12F-6BG256C offers lower static power but omits hardened memory controllers essential for video or communication buffers.
Availability
XC6SLX9-2CPG196C is available at Aetrix Electronics and suitable for industrial automation, embedded vision, and test equipment requiring stable component supply and long-term obsolescence management.
Supply support for XC6SLX9-2CPG196C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 family as part of its legacy FPGA portfolio for cost-sensitive, high-reliability applications.
The Spartan-6 family targets mid-range reconfigurable logic needs in industrial, automotive, and communications infrastructure where power efficiency, I/O flexibility, and design maturity are prioritized over cutting-edge process node advantages.
FAQ
What is the maximum operating junction temperature for XC6SLX9-2CPG196C?
The XC6SLX9-2CPG196C has a maximum junction temperature of 100°C under continuous operation. This rating assumes proper PCB thermal vias, copper pour, and airflow per Xilinx UG380. Exceeding this limit risks timing violation or configuration loss. The XC6SLX9-2CPG196C datasheet specifies derating curves for ambient temperature and power dissipation above 85°C ambient.
Does XC6SLX9-2CPG196C support JTAG boundary-scan testing?
Yes, XC6SLX9-2CPG196C fully supports IEEE 1149.1 JTAG boundary-scan with TCK, TMS, TDI, TDO, and TRST pins. It enables pre- and post-assembly testing of PCB interconnects and facilitates in-system programming. The XC6SLX9-2CPG196C configuration logic responds to JTAG instructions for IDCODE, SAMPLE/PRELOAD, EXTEST, and INTEST operations as defined in Xilinx UG380.
Can XC6SLX9-2CPG196C interface directly with DDR3 SDRAM?
No, XC6SLX9-2CPG196C does not include a hardened DDR3 PHY. It supports DDR2-400 and DDR3-800 via source-synchronous I/O with user-defined logic and DQS capture, but requires external calibration and timing closure effort. The XC6SLX9-2CPG196C reference designs use IDELAY/ODELAY primitives and phase-aligned clocks for reliable DDR3 operation up to 400 MHz data rate.
What configuration modes are supported by XC6SLX9-2CPG196C?
XC6SLX9-2CPG196C supports Master Serial (via SPI flash), Slave SelectMAP (parallel bus), and JTAG modes. Master Serial is most common for production; Slave SelectMAP enables processor-controlled reconfiguration. All modes are documented in Xilinx UG380. The XC6SLX9-2CPG196C requires correct M[2:0] pin strapping and matching boot mode settings in the bitstream header.
Is XC6SLX9-2CPG196C RoHS compliant and halogen-free?
Yes, XC6SLX9-2CPG196C is RoHS 2011/65/EU compliant and halogen-free per IEC 61249-2-21. The CPFGA package uses lead-free solder balls (SnAgCu) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3). Full compliance documentation is available in AMD's Product Change Notification PCN-2021-001 for Spartan-6 devices.
XC6SLX9-2CPG196C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 196-TFBGA, CSBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 106
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 196-CSPBGA (8x8)
XC6SLX9-2CPG196C FAQ
1.How can I place an order for XC6SLX9-2CPG196C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-2CPG196C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-2CPG196C reliable?
The price and inventory of XC6SLX9-2CPG196C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-2CPG196C is usually 5 days.
3.What payment methods are accepted for XC6SLX9-2CPG196C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-2CPG196C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-2CPG196C?
XC6SLX9-2CPG196C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-2CPG196C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-2CPG196C?
For technical support, including XC6SLX9-2CPG196C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-2CPG196C requirements.
6.How does Aetrix verify that XC6SLX9-2CPG196C is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-2CPG196C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-2CPG196C meets industry standards.
7.What is the process for return or replacement of XC6SLX9-2CPG196C?
All XC6SLX9-2CPG196C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-2CPG196C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-2CPG196C part is unused and in its original packaging.
Return procedure for XC6SLX9-2CPG196C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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