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AMD XC6SLX9-2CPG196I
- Part No.:
- XC6SLX9-2CPG196I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 196-TFBGA, CSBGA
- Datasheet:
-
XC6SLX9-2CPG196I.pdf
- Description:
- IC FPGA 106 I/O 196CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,109
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Product details
Overview
XC6SLX9-2CPG196I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 196-pin CSBGA package rated for industrial temperature range (–40°C to +85°C). It supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards and is used in low-power embedded control and industrial interface bridging.
For engineers reviewing the XC6SLX9-2CPG196I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O voltage flexibility, embedded memory depth, and industrial-grade thermal reliability.
Technical Context
The XC6SLX9-2CPG196I implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated carry logic. It integrates up to 24 DSP48A1 slices for arithmetic acceleration and supports dual-register flip-flops per CLB for timing-critical paths.
Configuration is performed via Master Serial or Slave SelectMAP modes using external SPI flash or processor-controlled parallel interface. JTAG boundary-scan support enables IEEE 1149.1-compliant testing and in-system programming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - provides gate count equivalent to ~15K ASIC gates for moderate-complexity control and glue logic |
| Block RAM | 576 Kbits - supports dual-port FIFOs, small buffers, or configuration data storage without external memory |
| I/O Pins | 133 user I/O - configurable across 12 banks with independent VCCO per bank for mixed-voltage interfacing |
| Max I/O Speed | 1,050 Mbps LVDS - enables high-speed differential signaling for sensor interfaces or display links |
| Operating Temp | –40°C to +85°C - qualified for uncontrolled industrial environments without forced cooling |
| Supply Voltages | VCCINT = 1.2 V, VCCAUX = 3.3 V, VCCO = 1.2–3.3 V - supports low-power core and flexible I/O rail selection |
Pinout & Package
XC6SLX9-2CPG196I uses a 196-pin Fine-Pitch Chip Scale Ball Grid Array (CPG196) with 1.0 mm pitch, 12 × 12 array, and center power/ground ball pattern for thermal and EMI performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be filtered locally with ≥10 µF ceramic capacitor |
| K1 | VCCAUX | 3.3 V auxiliary supply for configuration and clock circuitry |
| M1 | GND | Dedicated ground ball adjacent to VCCINT - forms critical power delivery loop |
| R1 | PROGRAM_B | Active-low asynchronous reset - pulls device into configuration reload state on falling edge |
| T1 | INIT_B | Open-drain status output - signals configuration memory readiness or CRC error |
| U1 | CCLK | Configuration clock input - drives internal shift register during Master Serial mode |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Digital Clock Managers (DCMs) | Two DCMs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication/division without external PLLs |
| Embedded Block RAM (BRAM) | 18 Kbits per block with true dual-port access - enables simultaneous read/write for ping-pong buffering |
| SelectIO Technology | Supports 18 I/O standards including LVDS, RSDS, and Differential SSTL - eliminates level-shifter ICs in mixed-voltage systems |
| Power-Down Mode | Reduces static current by >90% when all clocks are gated - extends battery life in portable industrial tools |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) Interface |
|---|---|
Use Scenario: Real-time digital signal conditioning and protocol translation between fieldbus sensors and host controller. IC Role / Device Role / Timing Role: FPGA acts as programmable logic layer handling GPIO expansion, pulse-width modulation, and RS-485/Modbus framing. Use Value: XC6SLX9-2CPG196I delivers deterministic latency under 50 ns and supports hot-swap I/O bank reconfiguration without system reset. | Use Scenario: High-speed stimulus/response generation for semiconductor wafer probing and functional validation. IC Role / Device Role / Timing Role: XC6SLX9-2CPG196I serves as pattern generator and comparator engine synchronized to 100 MHz system clock. Use Value: On-chip BRAM stores test vectors; DCMs generate precise timing edges for sub-nanosecond setup/hold margin control. |
| Medical Imaging Front-End | Smart Energy Meter Communication Hub |
Use Scenario: Acquisition and preprocessing of analog-to-digital converter streams from ultrasound transducer arrays. IC Role / Device Role / Timing Role: XC6SLX9-2CPG196I performs real-time FIR filtering, beamforming delay alignment, and LVDS serialization. Use Value: DSP48A1 slices execute 16-bit multiply-accumulate at 200 MHz; LVDS I/O drives 800 Mbps serial links to ADCs. | Use Scenario: Protocol bridging between metrology SoC (SPI), RF mesh radio (UART), and PLC communication (FSK modulator). IC Role / Device Role / Timing Role: XC6SLX9-2CPG196I manages concurrent peripheral interfaces with independent clock domains and DMA arbitration. Use Value: 133 user I/O pins allow full isolation of analog/digital/RF sections; industrial temp rating ensures outdoor meter cabinet operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC6SLX16-2CSG324C | 14,579 logic cells, 324-pin CSBGAs, commercial temp (0°C to +70°C) | Higher density and I/O count; lacks industrial temperature qualification | Choose when design requires >9K LUTs and operates in controlled environments |
| Lattice LCMXO3LF-1300E-5UWG36CTR | MachXO3L FPGA, 1,300 LUTs, 36-pin WLCSP, 1.2 V core, no block RAM | Ultra-low power (<1 mW static), smaller footprint, but insufficient logic/memory for XC6SLX9-2CPG196I workloads | Prefer for simple I/O expansion or level translation where <2K LUTs suffice |
Compared with XC6SLX9-2CPG196I, the XC6SLX16-2CSG324C offers greater logic resources but sacrifices industrial temperature compliance, while the LCMXO3LF-1300E-5UWG36CTR trades density and memory for ultra-low power and minimal footprint-neither matches the XC6SLX9-2CPG196I's balance of mid-range capacity, embedded memory, and extended temperature operation.
Availability
XC6SLX9-2CPG196I is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and smart grid infrastructure requiring stable component supply over multi-year production cycles.
Supply support for XC6SLX9-2CPG196I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families for adaptive computing solutions.
The Spartan-6 family, including XC6SLX9-2CPG196I, was designed for cost-sensitive, power-efficient embedded applications requiring reliable logic density and flexible I/O without high-end routing complexity.
FAQ
What is the maximum operating frequency of the XC6SLX9-2CPG196I fabric?
The XC6SLX9-2CPG196I is speed-grade -2, meaning its internal logic can operate up to 540 MHz for register-to-register paths under typical conditions. Actual achievable frequency depends on design placement, routing, and timing constraints. The device datasheet specifies TPD and setup/hold values for each CLB and I/O standard used in the XC6SLX9-2CPG196I implementation.
Does the XC6SLX9-2CPG196I support JTAG boundary-scan testing?
Yes, the XC6SLX9-2CPG196I fully supports IEEE 1149.1 JTAG boundary-scan for device-level testing and in-system programming. TDI, TDO, TMS, TCK, and TRST pins are assigned to dedicated balls and function per Xilinx UG380. This capability is integral to production test flow for boards using XC6SLX9-2CPG196I.
Can the XC6SLX9-2CPG196I be configured using an SPI flash memory?
Yes, the XC6SLX9-2CPG196I supports Master Serial configuration mode, allowing direct boot from industry-standard x1/x2/x4 SPI flash devices such as Micron MT25QL or Winbond W25Q series. Configuration occurs automatically on power-up when MODE pins are set to 01, and the XC6SLX9-2CPG196I drives the CCLK signal to read bitstream data.
What I/O standards are supported by the XC6SLX9-2CPG196I?
The XC6SLX9-2CPG196I supports 18 I/O standards including LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVTTL, PCI, SSTL18_I/II, SSTL2_I/II, HSTL_I/II/III/IV, and differential standards like LVDS, RSDS, and BLVDS. Each I/O bank on the XC6SLX9-2CPG196I can be independently powered and configured.
Is the XC6SLX9-2CPG196I pin-compatible with other Spartan-6 devices in the CPG196 package?
No, the XC6SLX9-2CPG196I is not pin-compatible with larger Spartan-6 devices in the same CPG196 package. While package footprint and ball pitch match, power, configuration, and I/O pin assignments differ across density variants. Migration requires PCB redesign and constraint file updates specific to XC6SLX9-2CPG196I.
XC6SLX9-2CPG196I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 196-TFBGA, CSBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 106
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 196-CSPBGA (8x8)
XC6SLX9-2CPG196I FAQ
1.How can I place an order for XC6SLX9-2CPG196I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-2CPG196I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-2CPG196I reliable?
The price and inventory of XC6SLX9-2CPG196I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-2CPG196I is usually 5 days.
3.What payment methods are accepted for XC6SLX9-2CPG196I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-2CPG196I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-2CPG196I?
XC6SLX9-2CPG196I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-2CPG196I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-2CPG196I?
For technical support, including XC6SLX9-2CPG196I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-2CPG196I requirements.
6.How does Aetrix verify that XC6SLX9-2CPG196I is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-2CPG196I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-2CPG196I meets industry standards.
7.What is the process for return or replacement of XC6SLX9-2CPG196I?
All XC6SLX9-2CPG196I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-2CPG196I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-2CPG196I part is unused and in its original packaging.
Return procedure for XC6SLX9-2CPG196I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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