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AMD XC6SLX9-2CSG324C
- Part No.:
- XC6SLX9-2CSG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX9-2CSG324C.pdf
- Description:
- IC FPGA 200 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:233
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Product details
Overview
XC6SLX9-2CSG324C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 24 DSP48A1 slices, operating at -2 speed grade (1.2 V core, industrial temperature range). It is used in low-cost embedded control, industrial I/O bridging, and compact video interface designs.
For engineers reviewing the XC6SLX9-2CSG324C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (232 user I/Os), differential signaling support (LVDS, TMDS), configuration interface options (SPI, JTAG, SelectMAP), and availability of hardened primitives like clock management tiles and PCI Express® endpoint logic.
Technical Context
The XC6SLX9-2CSG324C integrates six DCM (Digital Clock Manager) blocks for clock synthesis, phase shifting, and jitter reduction, supporting up to 32 independent clock outputs. It features 232 user-configurable I/O pins compliant with 18 I/O standards including LVCMOS, LVTTL, SSTL, HSTL, and differential LVDS.
Configuration is supported via Master SPI, Slave SPI, JTAG, or SelectMAP modes; bitstream encryption and readback protection are available. The device includes dedicated 10/100 Ethernet MAC logic and supports PCI Express x1 Gen1 endpoint operation through hard IP blocks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - provides gate count equivalent to ~12,000 ASIC gates for combinational + sequential logic implementation |
| Block RAM | 576 Kbits - organized as 24 × 18-Kbit dual-port RAM blocks for FIFO, buffer, or lookup table use |
| DSP Slices | 24 × DSP48A1 - each supports 18×18-bit multiply-accumulate with pre-adder for filtering and math-intensive tasks |
| User I/O Pins | 232 - supports high-density parallel interfaces, multi-channel ADC/DAC control, and display timing signals |
| DCM Blocks | 6 - enables internal clock multiplication, division, phase alignment, and duty-cycle correction without external PLLs |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock (I/O) and 250 MHz internal logic (LX9 fabric) |
| Operating Temp | 0°C to 85°C - qualified for industrial environments with no derating required up to 85°C ambient |
Pinout & Package
XC6SLX9-2CSG324C is housed in a 324-pin CSG (Chip Scale Grid Array) package with 1.0 mm pitch, 15×15 mm body size, and 232 user I/Os distributed across 12 banks. Thermal pad on underside requires solder connection for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be set to match connected interface voltage (e.g., 3.3 V or 1.8 V) |
| K1 | IO_L2N_0 | Differential pair negative input for bank 0 - used with L2P for LVDS or TMDS signal reception |
| M1 | CLKIN_0 | Primary single-ended clock input to DCM0 - accepts 1–500 MHz CMOS or LVCMOS signals |
| T1 | M0 | Master SPI mode select - pulled High to enable Master SPI configuration from external flash |
| U1 | PROGRAM_B | Active-Low asynchronous reset - initiates reconfiguration and clears internal state on falling edge |
| W1 | CCLK | Configuration clock output - drives external PROM during Master SPI mode; bidirectional in Slave SPI |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | 6 independent digital clock managers eliminate need for external clock ICs in timing-critical subsystems |
| SelectMAP Interface | Parallel 8-/16-bit configuration port enables fast in-system programming and field firmware updates |
| PCIe Endpoint Logic | Hardened Gen1 x1 endpoint block reduces FPGA resource usage and simplifies compliance testing |
| Bitstream Encryption | AES-128 decryption prevents unauthorized readback or cloning of configured logic design |
| Multi-Voltage I/O Banks | 12 independently powered I/O banks allow mixed-voltage interfacing (e.g., 3.3 V MCU + 1.8 V sensor bus) |
Applications
| Industrial PLC I/O Module | Compact HDMI Video Bridge |
|---|---|
Use Scenario: Modular expansion card for real-time digital input/output conditioning and protocol translation in factory automation controllers. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines, level-shifting logic, and isolated serial bus gateways (RS-485, CAN). Use Value: 232 I/Os and multi-bank voltage support enable direct connection to diverse field devices without level translators. | Use Scenario: Embedded video processor in portable projectors and kiosks converting parallel RGB to HDMI 1.3a output. IC Role / Device Role / Timing Role: Timing-critical pixel pipeline controller with integrated TMDS encoder and HDCP key storage. Use Value: Hard DCMs lock to pixel clocks; DSP slices perform color space conversion; block RAM buffers frame data. |
| Low-Cost PCIe Endpoint Adapter | Smart Sensor Hub Controller |
Use Scenario: Add-in card providing USB-to-PCIe bridge functionality for legacy instrumentation systems. IC Role / Device Role / Timing Role: PCIe Gen1 x1 endpoint handling TLP routing, configuration space access, and memory-mapped I/O transactions. Use Value: Hard PCIe block ensures deterministic latency and eliminates soft-core overhead; 9K logic cells host host-interface glue logic. | Use Scenario: Central aggregation node in predictive maintenance systems collecting vibration, temperature, and current data from multiple MEMS sensors. IC Role / Device Role / Timing Role: Time-synchronized data acquisition engine with oversampling filters, timestamping, and SPI/I²C master control. Use Value: 24 DSP48A1 slices execute real-time FFT and envelope detection; block RAM stores calibration coefficients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2CSG324C | 14,579 logic cells, 900 Kbits BRAM, 32 DSP slices - larger capacity, same package and pinout | Supports more complex protocols (e.g., dual-camera MIPI CSI-2), deeper buffering, and additional PCIe lanes | Choose when design requires >9K logic or >576 Kbits BRAM; footprint-compatible upgrade path |
| LFE5U-25F-6BG256C | 25K LUTs, 1.2 Mb embedded SRAM, 24 DSP blocks - lower static power, instant-on, no external config flash needed | Better suited for battery-powered edge nodes and rapid boot applications; lacks native PCIe hard IP | Prefer for ultra-low-power or fast-startup systems where PCIe is not required |
Compared with XC6SLX9-2CSG324C, XC6SLX16-2CSG324C offers higher density in identical packaging, while LFE5U-25F-6BG256C trades PCIe capability for lower power and faster initialization - both require functional validation but no PCB redesign.
Availability
XC6SLX9-2CSG324C is available at Aetrix Electronics and suitable for industrial control, video interface, and PCIe endpoint applications requiring stable component supply and long-term manufacturability.
Supply support for XC6SLX9-2CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated systems.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable performance, low power, and seamless integration with microcontrollers and analog peripherals.
FAQ
What is the maximum operating frequency of the XC6SLX9-2CSG324C?
The XC6SLX9-2CSG324C is rated for a -2 speed grade, guaranteeing internal logic operation up to 250 MHz and I/O signaling up to 500 MHz. Actual achievable frequency depends on design placement, routing, and clock domain constraints - verified using Xilinx ISE or Vivado timing analysis tools. The XC6SLX9-2CSG324C DCM blocks support input frequencies from 1 MHz to 500 MHz.
Does the XC6SLX9-2CSG324C support JTAG boundary-scan testing?
Yes, the XC6SLX9-2CSG324C fully supports IEEE 1149.1 JTAG boundary-scan for board-level test and debug. Dedicated TCK, TMS, TDI, and TDO pins are assigned in the CSG324 package, and the device implements mandatory instruction register and boundary-scan register logic per standard. This capability is enabled by default and does not require configuration bitstream loading - the XC6SLX9-2CSG324C responds to JTAG commands immediately after power-up.
Can the XC6SLX9-2CSG324C be configured via SPI flash memory?
Yes, the XC6SLX9-2CSG324C supports Master SPI configuration mode, where it actively clocks an external SPI flash (e.g., Micron N25Q, Spansion S25FL) and loads its bitstream at power-up. Pin M0 must be held High, and CCLK drives the flash clock. The XC6SLX9-2CSG324C supports standard SPI opcodes and 8-/16-/32-bit address widths, enabling fast, reliable, and field-upgradable configuration without host intervention.
Is bitstream encryption available on the XC6SLX9-2CSG324C?
Yes, the XC6SLX9-2CSG324C supports AES-128 bitstream encryption to protect intellectual property. Encryption keys are stored in on-chip eFUSE memory and activated during configuration. Once enabled, unencrypted readback is disabled, and only authenticated, encrypted bitstreams can configure the device. This security feature is configurable per design and applies to all configuration modes - the XC6SLX9-2CSG324C enforces decryption before logic initialization.
What I/O standards are supported by the XC6SLX9-2CSG324C?
The XC6SLX9-2CSG324C supports 18 I/O standards across its 12 banks, including LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVTTL, SSTL18_I/II, SSTL2_I/II, HSTL_I/II, and differential standards LVDS, BLVDS, RSDS, and TMDS. Each bank is independently powered, allowing mixed-voltage operation - for example, one bank at 3.3 V for legacy peripherals and another at 1.8 V for modern sensors. All I/Os are compatible with the XC6SLX9-2CSG324C's specified voltage and timing ranges.
XC6SLX9-2CSG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 200
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX9-2CSG324C FAQ
1.How can I place an order for XC6SLX9-2CSG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-2CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-2CSG324C reliable?
The price and inventory of XC6SLX9-2CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-2CSG324C is usually 5 days.
3.What payment methods are accepted for XC6SLX9-2CSG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-2CSG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-2CSG324C?
XC6SLX9-2CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-2CSG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-2CSG324C?
For technical support, including XC6SLX9-2CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-2CSG324C requirements.
6.How does Aetrix verify that XC6SLX9-2CSG324C is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-2CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-2CSG324C meets industry standards.
7.What is the process for return or replacement of XC6SLX9-2CSG324C?
All XC6SLX9-2CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-2CSG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-2CSG324C part is unused and in its original packaging.
Return procedure for XC6SLX9-2CSG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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