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AMD XC6SLX9-2CSG324I
- Part No.:
- XC6SLX9-2CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX9-2CSG324I.pdf
- Description:
- IC FPGA 200 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:251
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Product details
Overview
XC6SLX9-2CSG324I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 9,152 logic cells, 576 Kbits of block RAM, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It integrates dual 18×18 multipliers, six digital clock managers (DCMs), and supports LVCMOS/LVTTL/I²C interfaces for embedded control and interface bridging in space-constrained industrial controllers.
For engineers reviewing the XC6SLX9-2CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (232 user I/Os), package footprint (324-pin CSBGA), DCM availability, and industrial-grade thermal performance.
Technical Context
The XC6SLX9-2CSG324I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It includes six DCMs supporting frequency synthesis, phase shifting, and duty-cycle correction - each capable of generating up to two independent output clocks.
I/O banks support mixed-voltage operation (1.2 V to 3.3 V), with programmable slew rate and drive strength per bank. Configuration is performed via SPI serial mode using an external PROM or master microcontroller, with JTAG boundary-scan support for testing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - determines maximum combinational/sequential logic capacity for custom state machines or protocol engines |
| Block RAM | 576 Kbits - supports FIFOs, buffers, or small lookup tables without external memory |
| User I/O Pins | 232 - enables high-density peripheral interfacing in compact PCB layouts |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz internal clocking with standard place-and-route |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
| Package | 324-pin CSBGA (15×15 mm, 0.8 mm pitch) - surface-mount compatible with standard reflow profiles |
| DCMs | 6 × Digital Clock Managers - provide jitter-tolerant clock synthesis and skew management |
Pinout & Package
XC6SLX9-2CSG324I is housed in a 324-pin Chip Scale Ball Grid Array (CSBGA) with 15×15 mm body size and 0.8 mm ball pitch. The package supports thermal dissipation up to 1.5 W under industrial airflow conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND / VCCO | Power supply return / I/O bank voltage | Each I/O bank has dedicated VCCO pins enabling mixed-voltage I/O (1.2–3.3 V) without level shifters |
| CCLK / DONE | Configuration clock / configuration status | CCLK synchronizes bitstream loading; DONE signals successful configuration completion to system controller |
| TCK / TMS / TDI / TDO | JTAG boundary-scan interface | Enables IEEE 1149.1-compliant device programming, debugging, and interconnect testing |
| IO_Lx_y | Configurable user I/O | Programmable as input, output, or bidirectional with selectable pull-up/down and slew rate |
| DCM_CLKIN / DCM_CLKOUT | DCM reference and output clock | Accepts single-ended or differential clock inputs; outputs phase-aligned, multiplied, or divided clocks |
Key Features
| Feature | Design Value |
|---|---|
| Dual 18×18 Multipliers | Enable real-time arithmetic for motor control loops or sensor fusion without DSP cores |
| Suspend Mode Support | Reduces static power to <100 µA while retaining configuration state for rapid wake-up |
| ISE Design Suite Compatibility | Full synthesis, implementation, and simulation support through Xilinx ISE 14.7 toolchain |
| Multi-Bank I/O Voltage | Allows direct connection to 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals without external translators |
| Embedded Block RAM | Provides synchronous, error-free memory blocks with byte-write enable for buffering protocols |
Applications
| Industrial PLC I/O Module | Medical Sensor Interface Hub |
|---|---|
Use Scenario: Real-time acquisition and preprocessing of analog/digital sensor data from multiple field devices. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and timing coordinator between legacy RS-485 fieldbus and ARM-based host processor. Use Value: 232 user I/Os and six DCMs allow concurrent handling of 16+ isolated channels with deterministic latency under 2 µs. | Use Scenario: Aggregating ECG, SpO₂, and temperature streams from modular patient monitors into a unified USB 2.0 interface. IC Role / Device Role / Timing Role: XC6SLX9-2CSG324I serves as a low-latency bridge with embedded FIFOs and clock domain crossing logic. Use Value: 576 Kbits block RAM buffers burst data; industrial temp rating ensures reliability in clinical equipment enclosures. |
| Automated Test Equipment (ATE) | Avionics Data Concentrator |
Use Scenario: High-speed digital pattern generation and response capture for IC functional testing. IC Role / Device Role / Timing Role: Configurable logic implements parallel test vectors and real-time pass/fail analysis at 100+ MHz. Use Value: -2 speed grade guarantees setup/hold timing margins across full temperature range during thermal soak tests. | Use Scenario: Consolidating ARINC 429, discrete I/O, and CAN FD signals from cockpit subsystems into a central flight computer. IC Role / Device Role / Timing Role: XC6SLX9-2CSG324I performs signal conditioning, framing, and time-stamping with deterministic jitter <50 ps RMS. Use Value: Six DCMs independently manage ARINC 429 transmit/receive clocks and CAN FD bit timing with zero software overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2CSG324I | 14,579 logic cells, 900 Kbits block RAM, same package and speed grade | Higher gate count supports larger protocol stacks or dual-core soft processors | Select when design requires >9K logic cells or additional DSP slices |
| LFE5U-25F-6BG256C | 25K LUTs, 1.2 V core, 1.2/1.8/3.3 V I/O, 256-pin CABGA | Different architecture (ECP5), lower static power, no native DCMs - uses PLLs instead | Choose for ultra-low-power battery-operated systems where DCM phase-shift precision is not required |
Compared with XC6SLX9-2CSG324I, XC6SLX16-2CSG324I offers higher density within identical footprint and thermal profile, while LFE5U-25F-6BG256C provides lower static power and modern toolchain support but requires redesign for clock management and I/O constraints.
Availability
XC6SLX9-2CSG324I is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and avionics subsystems requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX9-2CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families.
The Spartan-6 family, including XC6SLX9-2CSG324I, was designed for cost-sensitive, high-volume applications demanding reliable performance, low power, and industrial temperature operation.
FAQ
What is the maximum operating frequency supported by XC6SLX9-2CSG324I?
The XC6SLX9-2CSG324I is rated at speed grade -2, guaranteeing internal clock frequencies up to 500 MHz under worst-case industrial temperature and voltage conditions. This rating applies to logic paths meeting timing constraints in Xilinx ISE 14.7; actual achievable frequency depends on design complexity and placement.
Does XC6SLX9-2CSG324I support JTAG boundary-scan testing?
Yes, XC6SLX9-2CSG324I fully supports IEEE 1149.1 JTAG boundary-scan via dedicated TCK, TMS, TDI, and TDO pins. This enables in-circuit programming, debug visibility, and interconnect testing without requiring additional test fixtures or probe access.
Can XC6SLX9-2CSG324I be configured via SPI serial mode?
Yes, XC6SLX9-2CSG324I supports master SPI serial configuration using an external SPI PROM or microcontroller. The FPGA initiates read operations on power-up, eliminating need for external configuration controllers in cost-sensitive designs.
What I/O standards are supported by XC6SLX9-2CSG324I?
XC6SLX9-2CSG324I supports LVCMOS, LVTTL, PCI, HSTL, SSTL, and I²C-compatible I/O standards across its 12 I/O banks. Each bank is independently configurable for voltage (1.2 V to 3.3 V), drive strength, and slew rate to match connected peripherals.
Is XC6SLX9-2CSG324I qualified for industrial temperature operation?
Yes, XC6SLX9-2CSG324I carries the 'I' suffix indicating industrial temperature qualification (-40°C to +100°C). It undergoes extended burn-in and characterization across this range, ensuring timing and functionality compliance without derating.
XC6SLX9-2CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 200
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX9-2CSG324I FAQ
1.How can I place an order for XC6SLX9-2CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-2CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-2CSG324I reliable?
The price and inventory of XC6SLX9-2CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-2CSG324I is usually 5 days.
3.What payment methods are accepted for XC6SLX9-2CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-2CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-2CSG324I?
XC6SLX9-2CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-2CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-2CSG324I?
For technical support, including XC6SLX9-2CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-2CSG324I requirements.
6.How does Aetrix verify that XC6SLX9-2CSG324I is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-2CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-2CSG324I meets industry standards.
7.What is the process for return or replacement of XC6SLX9-2CSG324I?
All XC6SLX9-2CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-2CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-2CSG324I part is unused and in its original packaging.
Return procedure for XC6SLX9-2CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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