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AMD XC6SLX9-2FT256C
- Part No.:
- XC6SLX9-2FT256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX9-2FT256C.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,485
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Product details
Overview
XC6SLX9-2FT256C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 9,152 logic cells, 576 Kbits of block RAM, and operates at -2 speed grade with 1.2 V core voltage in a 256-pin FTBGA package. It supports LVCMOS/LVTTL I/O standards and targets low-cost, low-power embedded control and interface bridging applications.
For engineers reviewing the XC6SLX9-2FT256C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (186 user I/Os), speed grade timing closure, and compatibility with Xilinx ISE Design Suite v14.7 for synthesis and place-and-route.
Technical Context
The XC6SLX9-2FT256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated DSP48A1 slices supporting 18×18 multipliers. It integrates dual-clock domain management and supports SelectIO™ technology for flexible I/O banking.
It includes on-chip clock management via DCM (Digital Clock Manager) modules offering frequency synthesis, phase shifting, and duty cycle correction - not PLL-based. Configuration is performed via Master Serial or JTAG mode using external SPI flash or PROM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - determines maximum combinational/sequential logic capacity for state machines or protocol engines |
| Block RAM | 576 Kbits - supports FIFOs, buffers, or small lookup tables without external memory |
| User I/O Pins | 186 - enables parallel bus interfacing or multi-peripheral connectivity in compact layouts |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz for internal logic paths under worst-case conditions |
| Core Voltage | 1.2 V ±3% - requires tight-regulation power supply; impacts dynamic power and thermal design |
| I/O Standards | LVCMOS, LVTTL, PCI, SSTL - allows direct interfacing with microcontrollers, memories, and legacy peripherals |
Pinout & Package
XC6SLX9-2FT256C is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch, 17 × 17 array, and standard JEDEC MO-251AC footprint. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated balls provide low-inductance return paths for core and I/O domains |
| VCCO_0 | I/O bank power | Supplies 1.2–3.3 V to Bank 0 I/Os; must be decoupled per Xilinx UG381 guidelines |
| VCCAUX | auxiliary voltage | 1.8 V supply for configuration circuitry, DCM, and JTAG interface |
| PROGRAM_B | Configuration reset | Active-low signal initiating reconfiguration from external source or flash |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization |
Key Features
| Feature | Design Value |
|---|---|
| DCM clock management | Enables precise clock synthesis and skew control without external PLL components |
| SelectIO™ technology | Supports mixed-voltage I/O banks enabling interoperability across 1.2 V, 1.8 V, 2.5 V, and 3.3 V subsystems |
| DSP48A1 slice | Provides hardwired 18×18 multiplier + accumulator for real-time filtering or motor control math |
| Multi-boot capability | Allows field-upgradable configurations via dual-image SPI flash storage |
Applications
| Industrial PLC I/O Module | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Real-time digital input/output conditioning and protocol translation between field sensors and CAN bus controllers. IC Role / Device Role / Timing Role: FPGA acts as deterministic logic fabric for cycle-accurate GPIO handling and SPI-to-CAN message framing. Use Value: Enables sub-10 µs I/O response latency and eliminates need for multiple ASICs or microcontroller firmware updates. | Use Scenario: Bridging between vehicle OBD-II port and USB/Bluetooth host in handheld diagnostic tools. IC Role / Device Role / Timing Role: XC6SLX9-2FT256C serves as protocol converter and level shifter between 12 V automotive bus and 3.3 V host interface. Use Value: Supports ISO 15765-4 (CAN-TP) and SAE J2411 (single-wire CAN) with programmable timing margins. |
| Medical Patient Monitor Front-End | Video Signal Converter |
Use Scenario: Aggregating analog sensor data (ECG, SpO₂) and managing isolated serial communication to main controller. IC Role / Device Role / Timing Role: FPGA handles time-critical ADC sampling synchronization and galvanically isolated UART bridging. Use Value: Meets IEC 60601-1 creepage requirements via internal logic isolation and supports 1 MS/s aggregate sampling rate. | Use Scenario: Converting HDMI 1.4a video streams to LVDS for industrial display panels. IC Role / Device Role / Timing Role: XC6SLX9-2FT256C implements TMDS decoding, color space conversion, and LVDS serialization with pixel-locked timing. Use Value: Achieves <1 line latency and supports 720p60 with embedded sync recovery and HDCP passthrough logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2FT256C | 14,579 logic cells, 900 Kbits block RAM, same package and pinout | Higher gate count supports larger state machines or additional peripheral IP cores | Choose when design requires >9K logic cells but must retain identical PCB layout and thermal profile |
| XC6SLX9-3TQG144I | Same logic resources, -3 speed grade, 144-pin TQFP package, higher max I/O toggle rate | Lower I/O count (102) and different thermal/mechanical mounting constraints | Prefer for cost-sensitive, lower-density designs where BGA assembly is unavailable or thermal budget is tighter |
Compared with XC6SLX9-2FT256C, the XC6SLX16-2FT256C offers headroom for future feature expansion without board redesign, while XC6SLX9-3TQG144I trades I/O count and package complexity for simplified assembly and improved timing margin at the expense of interconnect flexibility.
Availability
XC6SLX9-2FT256C is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and medical device manufacturing requiring stable component supply and long-term production continuity.
Supply support for XC6SLX9-2FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for heterogeneous compute acceleration.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small footprint, and seamless integration with microprocessors and standard peripherals.
FAQ
What is the maximum operating temperature for XC6SLX9-2FT256C?
The XC6SLX9-2FT256C is rated for commercial temperature range (0 °C to +85 °C ambient). Its thermal performance depends on PCB copper area, airflow, and power dissipation - typical static power at 25 °C is ~25 mW, rising to ~180 mW under full utilization at 85 °C. Derating curves are provided in Xilinx DS162.
Does XC6SLX9-2FT256C support JTAG boundary-scan testing?
Yes, XC6SLX9-2FT256C fully supports IEEE 1149.1 JTAG boundary-scan with TAP controller, instruction register, and boundary-scan register. It enables in-system verification of solder joints and interconnects during PCBA test, and is compatible with standard JTAG debuggers like Xilinx Platform Cable USB II.
Can XC6SLX9-2FT256C be configured via SPI flash memory?
Yes, XC6SLX9-2FT256C supports Master SPI configuration mode using industry-standard serial NOR flash devices (e.g., Micron N25Q, Winbond W25Q). Configuration bitstream is loaded automatically on power-up when MODE pins are set to 01, per UG380 Section 5.3.
What development tools are required for XC6SLX9-2FT256C?
Xilinx ISE Design Suite 14.7 is the officially supported toolchain for synthesis, simulation, place-and-route, and bitstream generation for XC6SLX9-2FT256C. Vivado does not support Spartan-6 devices. License-free WebPACK edition suffices for designs within resource limits.
Is XC6SLX9-2FT256C RoHS compliant and lead-free?
Yes, XC6SLX9-2FT256C is RoHS-compliant and lead-free per EU Directive 2011/65/EU. The FTBGA package uses matte tin finish on solder balls, and material declarations (IMDS/SDS) are available through AMD's Product Change Notification system.
XC6SLX9-2FT256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX9-2FT256C FAQ
1.How can I place an order for XC6SLX9-2FT256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-2FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-2FT256C reliable?
The price and inventory of XC6SLX9-2FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-2FT256C is usually 5 days.
3.What payment methods are accepted for XC6SLX9-2FT256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-2FT256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-2FT256C?
XC6SLX9-2FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-2FT256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-2FT256C?
For technical support, including XC6SLX9-2FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-2FT256C requirements.
6.How does Aetrix verify that XC6SLX9-2FT256C is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-2FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-2FT256C meets industry standards.
7.What is the process for return or replacement of XC6SLX9-2FT256C?
All XC6SLX9-2FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-2FT256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-2FT256C part is unused and in its original packaging.
Return procedure for XC6SLX9-2FT256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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