My Inquiry
My Account
AMD XC6SLX9-2FT256I
- Part No.:
- XC6SLX9-2FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX9-2FT256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,156
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX9-2FT256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 24 DSP48A1 slices, configured in a 256-pin FTBGA package with 176 user I/Os. It operates at -2 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) and targets low-cost, low-power embedded control and interface bridging applications.
For engineers reviewing the XC6SLX9-2FT256I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, available block RAM, DSP slice count, speed grade timing closure margin, and industrial-grade thermal reliability.
Technical Context
The XC6SLX9-2FT256I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated clock routing. It supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling (LVDS, TMDS) across its 176 user I/O pins.
It integrates dual 10-bit ADCs (XADC), PCIe Gen1 endpoint capability (via soft IP), and supports JTAG boundary-scan (IEEE 1149.1) and ICAP for partial reconfiguration. Configuration is performed via SPI serial flash or master/slave parallel mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 576 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external memory |
| DSP Slices | 24 × DSP48A1 - enables fixed-point multiply-accumulate operations up to 25×18-bit per slice |
| User I/O Pins | 176 - supports multi-protocol interface bridging with bank-wise voltage flexibility |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC-DC supply with <10 mV ripple |
Pinout & Package
Package: 256-ball Fine-Pitch Thin BGA (FTBGA), 17 mm × 17 mm, 1.0 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 10 µF per bank |
| H2 | GND | Ground reference for adjacent I/O and core logic - connects to PCB ground plane |
| K1 | VCCAUX | Analog auxiliary supply for configuration, JTAG, and XADC - requires clean 2.5 V |
| M1 | VCCINT | Core logic supply - 1.2 V regulated input powering CLBs and interconnect |
| P2 | PROGRAM_B | Active-low asynchronous reset - pulls low to reinitialize configuration logic |
| R1 | INIT_B | Open-drain status output - goes high when configuration memory is ready |
| T1 | CCLK | Configuration clock input - drives internal shift register during slave serial mode |
| U1 | DONE | Open-drain completion indicator - pulled high externally after successful config |
Key Features
| Feature | Design Value |
|---|---|
| Integrated XADC | Dual 10-bit 1 MSPS ADC with on-chip temperature/voltage sensors - enables real-time system health monitoring without external components |
| SelectIO Technology | Support for 18 I/O standards across 10 banks - allows mixed-voltage interfacing (1.2–3.3 V) on single device |
| PCIe Endpoint Capability | Gen1 x1 link support via hardened primitives and soft IP - reduces latency for host-attached peripherals |
| ICAP Interface | Internal Configuration Access Port - enables dynamic partial reconfiguration of logic regions during operation |
| JTAG Boundary Scan | IEEE 1149.1 compliance - supports production test, debug, and in-system programming |
Applications
| Industrial PLC I/O Module | Automotive Camera Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation in programmable logic controllers. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines, SPI/I²C masters, and GPIO expanders with deterministic timing. Use Value: 176 user I/Os and industrial temp rating enable direct integration into DIN-rail mounted control cabinets without cooling. | Use Scenario: Converting MIPI CSI-2 camera streams to parallel BT.656 or LVDS for ADAS vision processors. IC Role / Device Role / Timing Role: High-speed serializer/deserializer with pixel clock domain crossing and frame buffering. Use Value: 24 DSP48A1 slices accelerate pixel interpolation; SelectIO supports MIPI D-PHY level signaling via LVDS emulation. |
| Medical Sensor Hub | Test & Measurement Pattern Generator |
Use Scenario: Aggregating analog and digital sensor data (ECG, SpO₂, temperature) in portable diagnostic devices. IC Role / Device Role / Timing Role: XADC monitors internal die temperature and supply rails while FPGA logic manages sensor sampling sequencing. Use Value: Integrated dual ADC eliminates need for external signal conditioning ICs, reducing BOM count and board area. | Use Scenario: Generating precise, multi-channel digital stimulus waveforms for IC validation and ATE systems. IC Role / Device Role / Timing Role: Synchronous pattern generator with jitter-controlled outputs using dedicated clock networks. Use Value: -2 speed grade ensures sub-nanosecond output skew across 176 I/Os, critical for timing margin validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2FT256I | 14,579 logic cells, 900 Kbits BRAM, 32 DSP slices - higher resource density and memory bandwidth | Better suited for multi-channel video processing or larger protocol stacks (e.g., USB 2.0 + Ethernet) | Select when XC6SLX9-2FT256I logic utilization exceeds 85% or BRAM requirements exceed 400 Kbits |
| LFE5U-25F-6BG256C | 24,000 LUTs, 1.2 Mb embedded SRAM, 28 DSP blocks, 1.2 V core - ECP5 family, lower static power, no integrated ADC | Preferred for ultra-low-power battery-operated edge devices where XADC is not required | Choose when power budget is <50 mW active or when PCIe/XADC are unnecessary |
Compared with XC6SLX9-2FT256I, XC6SLX16-2FT256I offers headroom for future firmware expansion, while LFE5U-25F-6BG256C trades analog monitoring capability for lower quiescent current and faster configuration time - both require PCB layout changes due to different pinouts and power delivery requirements.
Availability
XC6SLX9-2FT256I is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics, and automotive ADAS subsystems requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX9-2FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family, including XC6SLX9-2FT256I, was designed for cost-sensitive, low-power applications requiring reliable I/O flexibility and moderate logic density - especially in industrial control and interface bridging.
FAQ
What is the maximum operating frequency supported by XC6SLX9-2FT256I?
The XC6SLX9-2FT256I is rated at speed grade -2, guaranteeing timing closure up to 500 MHz for internal logic paths under worst-case industrial temperature and voltage conditions. Actual achievable frequency depends on design complexity, routing congestion, and I/O standard selection - synthesis reports must be verified per implementation.
Does XC6SLX9-2FT256I include an integrated analog-to-digital converter?
Yes, XC6SLX9-2FT256I integrates a dual-channel 10-bit XADC with dedicated analog inputs, on-chip temperature and supply voltage sensors, and a 1 MSPS sampling rate. This enables real-time system monitoring without external ADC components.
What configuration methods are supported by XC6SLX9-2FT256I?
XC6SLX9-2FT256I supports multiple configuration modes: master/slave SPI serial flash, master/slave parallel NOR flash, JTAG boundary scan, and ICAP for partial reconfiguration. Configuration bitstream is loaded into SRAM-based fabric on power-up or reset.
Is XC6SLX9-2FT256I qualified for industrial temperature operation?
Yes, the "I" suffix in XC6SLX9-2FT256I denotes industrial temperature grade (-40°C to +100°C). The device undergoes extended temperature screening and is specified for timing and functionality across this full range without derating.
Can XC6SLX9-2FT256I implement PCIe Gen1 endpoints?
XC6SLX9-2FT256I supports PCIe Gen1 x1 endpoint functionality using soft IP cores and dedicated transceiver primitives. It does not include hardened PCIe PHY but achieves compliant link training and enumeration when paired with appropriate reference clock and layout guidelines.
XC6SLX9-2FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX9-2FT256I FAQ
1.How can I place an order for XC6SLX9-2FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-2FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-2FT256I reliable?
The price and inventory of XC6SLX9-2FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-2FT256I is usually 5 days.
3.What payment methods are accepted for XC6SLX9-2FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-2FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-2FT256I?
XC6SLX9-2FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-2FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-2FT256I?
For technical support, including XC6SLX9-2FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-2FT256I requirements.
6.How does Aetrix verify that XC6SLX9-2FT256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-2FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-2FT256I meets industry standards.
7.What is the process for return or replacement of XC6SLX9-2FT256I?
All XC6SLX9-2FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-2FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-2FT256I part is unused and in its original packaging.
Return procedure for XC6SLX9-2FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX9-2FT256I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
