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AMD XC6SLX9-2FTG256I
- Part No.:
- XC6SLX9-2FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX9-2FTG256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:150
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Product details
Overview
XC6SLX9-2FTG256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 24 DSP48A1 slices, operating at -2 speed grade with industrial temperature range (–40°C to +85°C). It integrates SelectIO™ technology supporting LVCMOS, LVTTL, SSTL, and HSTL I/O standards for embedded control and interface bridging in space-constrained industrial controllers.
For engineers reviewing the XC6SLX9-2FTG256I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, embedded memory depth, and industrial-grade thermal reliability.
Technical Context
The XC6SLX9-2FTG256I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated clock routing. It supports dual-register flip-flops per slice and up to 106 user I/Os with programmable slew rate and drive strength.
It includes integrated configuration logic supporting Master SPI, Slave Serial, and JTAG modes, and features internal oscillator (1–100 MHz) for initial boot sequencing. Configuration bitstream security is supported via AES-128 decryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 576 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external SRAM |
| DSP Slices | 24 × DSP48A1 - enables fixed-point multiply-accumulate operations at up to 250 MHz |
| User I/Os | 106 - supports mixed-voltage interfaces (1.2V–3.3V) with programmable termination and slew control |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock in critical paths under industrial conditions |
| Operating Temp | –40°C to +85°C - qualified for deployment in uncontrolled industrial enclosures and outdoor edge nodes |
| Package | FTG256 - 256-pin Fine-Pitch Ball Grid Array (0.5 mm pitch), 17×17 mm body, RoHS-compliant |
Pinout & Package
XC6SLX9-2FTG256I is housed in a 256-ball fine-pitch BGA (FTG256) with 16 I/O banks, power/ground ball distribution optimized for signal integrity and thermal dissipation in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 supply - sets output voltage level (1.2V/1.5V/1.8V/2.5V/3.3V) for pins in bank 0 |
| P2 | IO_L1P_0 | Differential pair positive input - supports LVDS, TMDS, or RSDS signaling when paired with N2 |
| N2 | IO_L1N_0 | Differential pair negative input - must be routed with matched length and spacing to P2 |
| T14 | CCLK | Configuration clock output - drives external PROM or flash during master SPI mode startup |
| R15 | DONE | Configuration status indicator - goes high after bitstream loading completes and device initialization finishes |
| U13 | INIT_B | Open-drain active-low initialization flag - signals configuration error or incomplete loading |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO Technology | Supports 18 I/O standards including LVCMOS33/LVCMOS25/LVCMOS18 and SSTL18_I - eliminates level-shifter ICs in mixed-voltage systems |
| Dedicated Clock Resources | Four DCMs (Digital Clock Managers) with phase shift, frequency synthesis, and jitter reduction - enables precise clock domain crossing and multi-rate timing |
| Embedded Security | AES-128 bitstream encryption with HMAC authentication - prevents unauthorized cloning or firmware extraction |
| Low-Power Architecture | 1.2V core voltage with dynamic power gating - reduces active power to ~150 mW typical in moderate utilization |
| Configurable I/O | Programmable drive strength (2–24 mA) and slew rate (slow/fast) per bank - minimizes EMI and signal reflections on long traces |
Applications
| Industrial PLC I/O Module | Medical Sensor Interface Hub |
|---|---|
Use Scenario: Real-time acquisition and preprocessing of analog sensor data from multiple channels in DIN-rail mounted controllers. IC Role / Device Role / Timing Role: FPGA fabric implements time-critical logic for ADC sampling synchronization, digital filtering, and protocol translation (Modbus RTU → Ethernet/IP). Use Value: XC6SLX9-2FTG256I delivers deterministic latency (< 200 ns) and supports 106 I/Os for direct connection to isolated analog front-ends and fieldbus transceivers. | Use Scenario: Aggregation and preprocessing of multi-modal physiological signals (ECG, SpO₂, temperature) in portable diagnostic devices. IC Role / Device Role / Timing Role: Configurable logic handles sample-rate conversion, noise suppression, and secure data packaging before transmission to host MCU. Use Value: XC6SLX9-2FTG256I's 576 Kbits block RAM buffers 8 seconds of raw waveform data; AES encryption protects HIPAA-sensitive payloads. |
| Automated Test Equipment (ATE) | Smart Energy Metering Gateway |
Use Scenario: High-speed digital pattern generation and response capture for semiconductor functional testing. IC Role / Device Role / Timing Role: FPGA implements parallel test vector engines, real-time pass/fail analysis, and JTAG boundary-scan controller. Use Value: XC6SLX9-2FTG256I's -2 speed grade ensures setup/hold timing compliance at 100 MHz test clock with sub-nanosecond jitter. | Use Scenario: Protocol bridging and secure firmware update handling between metrology ASICs and cellular/Wi-Fi communication modules. IC Role / Device Role / Timing Role: FPGA manages dual-interface arbitration (SPI to metrology chip, UART to modem), validates signed OTA updates, and monitors tamper-detection inputs. Use Value: XC6SLX9-2FTG256I's industrial temp rating and AES support meet ANSI C12.22 and DLMS/COSEM security requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC6SLX16-2FTG256I | 14,579 logic cells, 900 Kbits block RAM, same package and speed grade | Higher gate count supports larger state machines or additional protocol stacks (e.g., EtherCAT + CAN FD) | Choose when XC6SLX9-2FTG256I resource utilization exceeds 85% in synthesis reports |
| Lattice LCMXO3LF-2100C-5BG256C | MachXO3L FPGA with 2,100 LUTs, 108 I/Os, 1.2V core, but no embedded DSP slices or AES | Lower cost and power for glue logic and I/O expansion only - not suitable for compute-intensive filtering or crypto | Choose for simple level translation or GPIO expansion where DSP or security is unnecessary |
Compared with XC6SLX9-2FTG256I, XC6SLX16-2FTG256I offers headroom for feature growth without PCB redesign, while LCMXO3LF-2100C-5BG256C trades programmable logic depth and security for lower static power and unit cost in non-critical roles.
Availability
XC6SLX9-2FTG256I is available at Aetrix Electronics and suitable for industrial automation, medical edge devices, and smart grid infrastructure requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX9-2FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 family as a mature, long-lifecycle FPGA platform for cost-sensitive, high-reliability applications.
The Spartan-6 family was designed for embedded control, interface bridging, and logic replacement in industrial, automotive, and communications equipment where predictability and qualification stability outweigh cutting-edge performance.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX9-2FTG256I?
XC6SLX9-2FTG256I supports I/O standards from 1.2V to 3.3V across its 16 user-configurable I/O banks. Each bank's VCCO voltage is independently set, enabling simultaneous operation with LVCMOS18, SSTL18, and LVCMOS33 interfaces on the same device. This eliminates external level shifters in mixed-voltage systems. The XC6SLX9-2FTG256I datasheet specifies absolute maximum VCCO as 3.465V.
Does XC6SLX9-2FTG256I include built-in configuration memory?
No, XC6SLX9-2FTG256I does not include on-chip nonvolatile configuration memory. It requires an external serial PROM or flash memory (e.g., Micron MT25QL series) to store the bitstream. Configuration occurs at power-up via Master SPI, Slave Serial, or JTAG mode. The XC6SLX9-2FTG256I contains internal SRAM for volatile configuration storage only.
Can XC6SLX9-2FTG256I perform real-time cryptographic operations?
XC6SLX9-2FTG256I supports AES-128 bitstream encryption for configuration security, but lacks hardware-accelerated SHA or RSA engines. Real-time cryptographic operations must be implemented in fabric using LUT-based logic or soft IP cores. The XC6SLX9-2FTG256I's 24 DSP48A1 slices can accelerate finite-field arithmetic, though throughput is limited compared to dedicated crypto processors.
What thermal management guidance applies to XC6SLX9-2FTG256I in sealed enclosures?
For sealed industrial enclosures, XC6SLX9-2FTG256I requires a PCB with ≥2 oz copper planes, thermal vias under the FTG256 package, and minimum 400 mm² exposed copper pad connected to internal ground/power planes. Junction-to-board thermal resistance is 12.5°C/W. Ambient temperature must remain ≤+70°C to maintain junction < +105°C. The XC6SLX9-2FTG256I industrial rating assumes proper board-level thermal design per UG382.
Is XC6SLX9-2FTG256I compatible with Vivado Design Suite?
No, XC6SLX9-2FTG256I is supported exclusively by Xilinx ISE Design Suite 14.7, the final and only officially qualified toolchain. Vivado does not recognize Spartan-6 architecture or generate valid bitstreams for XC6SLX9-2FTG256I. Legacy ISE 14.7 remains available for download from AMD's support portal with full device libraries and timing analysis for XC6SLX9-2FTG256I.
XC6SLX9-2FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX9-2FTG256I FAQ
1.How can I place an order for XC6SLX9-2FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-2FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-2FTG256I reliable?
The price and inventory of XC6SLX9-2FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-2FTG256I is usually 5 days.
3.What payment methods are accepted for XC6SLX9-2FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-2FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-2FTG256I?
XC6SLX9-2FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-2FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-2FTG256I?
For technical support, including XC6SLX9-2FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-2FTG256I requirements.
6.How does Aetrix verify that XC6SLX9-2FTG256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-2FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-2FTG256I meets industry standards.
7.What is the process for return or replacement of XC6SLX9-2FTG256I?
All XC6SLX9-2FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-2FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-2FTG256I part is unused and in its original packaging.
Return procedure for XC6SLX9-2FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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