AMD XC6SLX9-3CPG196C
- Part No.:
- XC6SLX9-3CPG196C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 196-TFBGA, CSBGA
- Datasheet:
-
XC6SLX9-3CPG196C.pdf
- Description:
- IC FPGA 106 I/O 196CSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6SLX9-3CPG196C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 196-pin CSBGA package rated for commercial temperature range (0°C to 85°C). It supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards and is used in industrial control logic, embedded vision preprocessing, and low-power communication interface bridging.
For engineers reviewing the XC6SLX9-3CPG196C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, embedded memory capacity, and commercial-grade thermal rating.
Technical Context
The XC6SLX9-3CPG196C implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated carry logic. It integrates up to 24 DSP48A1 slices for arithmetic-intensive tasks and supports dual-register flip-flops per CLB for timing-critical paths.
Configuration is performed via Master Serial or Slave SelectMAP modes using external SPI flash or processor-controlled parallel interface. JTAG boundary-scan support enables IEEE 1149.1-compliant testing and in-system programming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 576 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external SRAM |
| DSP Slices | 24 × DSP48A1 - enables fixed-point multiply-accumulate operations at up to 250 MHz |
| I/O Standards | LVCMOS/LVTTL/SSTL/HSTL - supports interoperability with diverse peripheral voltage domains |
| Package | 196-pin CSBGA (14×14 mm, 0.8 mm pitch) - enables high-density PCB routing with thermal performance suitable for convection-cooled systems |
| Speed Grade | -3 - guarantees timing closure at highest specified operating frequency for this device family |
Pinout & Package
XC6SLX9-3CPG196C uses a 196-pin Chip Scale Ball Grid Array (CSBGA) package with 14×14 ball array and 0.8 mm pitch. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank power supply for Bank 0 - must be set to match connected peripheral voltage (e.g., 3.3 V or 1.8 V) |
| K1 | VCCAUX | 1.8 V auxiliary supply for configuration circuitry, clock management, and transceivers |
| M2 | GND | Ground reference for analog and digital sections - requires low-inductance connection to PCB ground plane |
| P4 | PROGRAM_B | Active-low asynchronous reset input - initiates reconfiguration when pulled low |
| R1 | TCK | JTAG test clock input - synchronizes boundary-scan and debug operations |
| T2 | INIT_B | Open-drain status output - signals configuration completion or failure |
Key Features
| Feature | Design Value |
|---|---|
| Multi-voltage I/O banks | Supports independent VCCO per bank - allows interfacing with mixed-voltage peripherals without level shifters |
| Dedicated clock management | Four DCMs per device - provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication |
| Embedded configuration memory | On-chip SEU mitigation and CRC-based bitstream verification - improves reliability in radiation-prone environments |
| Low static power | Typical 25 µA standby current - enables always-on monitoring functions in battery-backed systems |
| Configurable I/O drive strength | Programmable 2–24 mA per pin - optimizes signal integrity and EMI across trace lengths and loads |
Applications
| Industrial PLC I/O Module | Video Frame Buffer Interface |
|---|---|
Use Scenario: Real-time digital input/output conditioning and protocol translation in compact programmable logic controllers. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines and serial interface logic (e.g., RS-485, CAN controller core), synchronized by internal DCM-generated clocks. Use Value: Enables deterministic response under 100 µs latency with no external glue logic required. | Use Scenario: Buffering and format conversion between image sensor (MIPI CSI-2) and display controller (RGB or LVDS). IC Role / Device Role / Timing Role: XC6SLX9-3CPG196C acts as a bridge and frame buffer controller, managing dual-port BRAM for ping-pong video storage and pixel clock domain crossing. Use Value: Eliminates need for external DDR2/DDR3 memory in sub-HD embedded vision applications. |
| Smart Energy Meter Communication Hub | Automotive Diagnostic Interface Adapter |
Use Scenario: Aggregating data from multiple metering ICs and transmitting over PLC or RF mesh networks. IC Role / Device Role / Timing Role: XC6SLX9-3CPG196C implements AES-128 encryption, UART-to-SPI protocol conversion, and hardware CRC generation. Use Value: Meets IEC 62056-21 and DLMS/COSEM compliance requirements with deterministic crypto execution. | Use Scenario: Translating UDS (ISO 14229) commands between USB host and legacy vehicle ECUs via K-Line or CAN. IC Role / Device Role / Timing Role: FPGA implements ISO 9141-2 and ISO 11898 physical layer interfaces plus diagnostic session state machine. Use Value: Supports multi-protocol diagnostics without MCU firmware updates or external transceiver swaps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-3CPG196C | 14,579 logic cells, 900 Kbits BRAM, same package - higher density but higher static power | Required for larger state machines or additional protocol stacks (e.g., simultaneous CAN + LIN + Ethernet MAC) | Select when XC6SLX9-3CPG196C resource utilization exceeds 85% in Vivado implementation |
| LFE5U-25F-6BG256C | 25K LUTs, 1.2 V core, 256-pin CABGA - lower power, different toolchain (Lattice Diamond), no native DCM | Suitable for ultra-low-power portable instrumentation where clock synthesis flexibility is secondary to energy efficiency | Choose only if migrating from Xilinx toolflow is acceptable and DCM-based clock management is not required |
Compared with XC6SLX9-3CPG196C, the XC6SLX16-3CPG196C offers headroom for design growth without PCB change, while the LFE5U-25F-6BG256C trades Xilinx-specific IP and timing predictability for lower active power and alternative ecosystem support.
Availability
XC6SLX9-3CPG196C is available at Aetrix Electronics and suitable for industrial automation, embedded vision, and smart metering applications requiring stable component supply across extended production lifecycles.
Supply support for XC6SLX9-3CPG196C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family. The company specializes in adaptive computing platforms for embedded, data center, and edge applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable logic density, flexible I/O, and low-power operation - especially in industrial control, video processing, and communications infrastructure.
FAQ
What is the maximum operating frequency of the XC6SLX9-3CPG196C?
The XC6SLX9-3CPG196C speed grade -3 guarantees timing closure up to 667 Mbps for source-synchronous I/O interfaces and 250 MHz for internal logic paths. Actual achievable frequency depends on design complexity, placement, and routing - verified during static timing analysis in Vivado Design Suite. The XC6SLX9-3CPG196C DCMs support output frequencies up to 500 MHz with jitter below 200 ps RMS.
Does the XC6SLX9-3CPG196C support JTAG boundary-scan testing?
Yes, the XC6SLX9-3CPG196C fully complies with IEEE 1149.1 and supports boundary-scan testing of all I/O pins and internal logic. TCK, TMS, TDI, and TDO pins are dedicated for JTAG access, and the XC6SLX9-3CPG196C includes built-in BSCAN_SPARTAN6 primitive for integration into system-level test architectures.
Can the XC6SLX9-3CPG196C be configured via SPI flash memory?
Yes, the XC6SLX9-3CPG196C supports Master Serial configuration mode using standard SPI flash devices such as Micron N25Q or Spansion S25FL. Configuration occurs automatically on power-up when MODE pins are set to 001, and the XC6SLX9-3CPG196C drives the SPI clock and reads the bitstream sequentially from address 0x000000.
What I/O standards does the XC6SLX9-3CPG196C support?
The XC6SLX9-3CPG196C supports LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVTTL, SSTL18_I/II, SSTL2_I/II, HSTL_I/III, and differential standards including LVDS, BLVDS, and RSDS. Each of its eight I/O banks can be independently powered, allowing mixed-voltage operation across a single XC6SLX9-3CPG196C device.
Is the XC6SLX9-3CPG196C RoHS compliant and lead-free?
Yes, the XC6SLX9-3CPG196C is RoHS 2011/65/EU compliant and manufactured with lead-free (Pb-free) packaging. The CSBGA package uses matte tin finish on solder balls, and the device meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements for surface-mount assembly.
XC6SLX9-3CPG196C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 196-TFBGA, CSBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 106
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 196-CSPBGA (8x8)
XC6SLX9-3CPG196C FAQ
1.How can I place an order for XC6SLX9-3CPG196C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-3CPG196C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-3CPG196C reliable?
The price and inventory of XC6SLX9-3CPG196C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-3CPG196C is usually 5 days.
3.What payment methods are accepted for XC6SLX9-3CPG196C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-3CPG196C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-3CPG196C?
XC6SLX9-3CPG196C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-3CPG196C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-3CPG196C?
For technical support, including XC6SLX9-3CPG196C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-3CPG196C requirements.
6.How does Aetrix verify that XC6SLX9-3CPG196C is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-3CPG196C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-3CPG196C meets industry standards.
7.What is the process for return or replacement of XC6SLX9-3CPG196C?
All XC6SLX9-3CPG196C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-3CPG196C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-3CPG196C part is unused and in its original packaging.
Return procedure for XC6SLX9-3CPG196C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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