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AMD XC6SLX9-3CSG225C
- Part No.:
- XC6SLX9-3CSG225C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 225-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX9-3CSG225C.pdf
- Description:
- IC FPGA 160 I/O 225CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,337
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Product details
Overview
XC6SLX9-3CSG225C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 24 DSP48A1 slices, packaged in a 225-pin CSGA (Chip Scale Grid Array) with 1.2 V core voltage. It targets low-cost, low-power embedded control and interface bridging in industrial I/O modules and communication gateways.
For engineers reviewing the XC6SLX9-3CSG225C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (186 user I/Os), speed grade (-3), thermal performance (commercial temperature range 0°C to 85°C), and compatibility with Xilinx ISE Design Suite v14.7.
Technical Context
The XC6SLX9-3CSG225C implements a configurable logic fabric based on 6-input LUTs and flip-flops, supporting synchronous design with global clock networks and regional clock buffers. It integrates SelectIO technology for LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS and TMDS.
Configuration is supported via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled loading. The device includes internal startup circuitry with programmable configuration options such as bitstream encryption and fallback mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - total available LUT/FF pairs for combinational and sequential logic implementation |
| Block RAM | 576 Kbits - distributed across 24 x 18-Kbit blocks for data buffering and FIFOs |
| DSP Slices | 24 × DSP48A1 - support 18×18 multipliers, wide adders, and accumulator functions |
| User I/O Pins | 186 - configurable single-ended and differential I/Os with programmable drive strength and slew rate |
| Speed Grade | -3 - highest performance grade for this family, enabling 667 Mbps DDR3 operation |
| Core Voltage | 1.2 V ±3% - requires tight regulation; impacts dynamic power and timing closure |
| Operating Temp | 0°C to +85°C - commercial-grade thermal specification for non-automotive environments |
Pinout & Package
XC6SLX9-3CSG225C uses a 225-ball fine-pitch Chip Scale Grid Array (CSGA) package with 1.0 mm ball pitch, designed for compact PCB layouts and thermal efficiency in space-constrained applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O bank supply | Provides 1.2–3.3 V output buffer voltage for Bank 0; must match signal standard |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration logic, JTAG, and certain I/O circuitry |
| GND | Ground reference | Multiple dedicated balls for analog/digital ground separation and noise reduction |
| PROGRAM_B | Configuration control | Active-low input that initiates configuration reset and reloads bitstream from master SPI flash |
| CCLK | Configuration clock | Output during Master SPI configuration; drives external PROM clock input |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization completion |
Key Features
| Feature | Design Value |
|---|---|
| ISE Design Suite support | Fully supported in Xilinx ISE 14.7 with place-and-route, timing analysis, and bitstream generation |
| SelectIO technology | Enables mixed-voltage I/O banks with independent VCCO per bank for flexible interface bridging |
| Embedded Block RAM | 24 × 18-Kbit blocks allow dual-port RAM, ROM, and shift register implementations without external memory |
| DSP48A1 slices | Each slice delivers 18×18 signed multiplication plus 48-bit accumulation for real-time filtering or math acceleration |
| Configuration security | Supports bitstream encryption using AES-128 keys stored in on-chip eFUSE for IP protection |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital input/output conditioning and protocol translation between field sensors and EtherCAT master. IC Role / Device Role / Timing Role: FPGA acts as deterministic I/O controller with cycle-accurate GPIO timing and integrated PRS (Peripheral Register Space) mapping. Use Value: Enables 100+ channel I/O expansion with sub-microsecond response latency and no external glue logic. | Use Scenario: Converting parallel RGB video from image sensor to MIPI D-PHY output for display subsystems. IC Role / Device Role / Timing Role: Video timing controller and serializer with programmable pixel clock generation and lane alignment. Use Value: Eliminates need for discrete timing ICs and level shifters while supporting 720p@60fps with embedded sync insertion. |
| Communications Gateway | Test Equipment Front-End |
Use Scenario: Protocol conversion between RS-485 Modbus RTU and Ethernet TCP/IP in edge gateway devices. IC Role / Device Role / Timing Role: Dual-interface bridge with UART-to-TCP state machine and hardware checksum offload. Use Value: Reduces MCU firmware complexity and enables concurrent handling of 4+ serial ports with zero packet loss at 115.2 kbps. | Use Scenario: Signal conditioning and pattern generation for automated test fixtures validating mixed-signal ICs. IC Role / Device Role / Timing Role: High-precision digital stimulus generator with 10 ns resolution and synchronized trigger capture. Use Value: Supports 32-channel parallel test vectors with deterministic setup/hold timing and on-the-fly error injection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-3CSG324C | 14,579 logic cells, 324-ball CSGA, higher I/O count (200), larger block RAM (900 Kbits) | Suitable for designs requiring more logic resources or additional I/O banks | Select when XC6SLX9-3CSG225C resource utilization exceeds 85% in synthesis reports |
| LFE5U-25F-6BG256C | 25K LUTs, 2.5 V core, 256-ball BGA, supports transceiver-less PCIe Gen1 and DDR3 at 800 Mbps | Better suited for ultra-low-power portable instrumentation where static power < 25 mW is critical | Choose for battery-powered systems needing lower standby current than XC6SLX9-3CSG225C's 35 mW typical |
Compared with XC6SLX9-3CSG225C, XC6SLX16-3CSG324C offers scalable logic density without changing toolchain, while LFE5U-25F-6BG256C provides lower static power and different I/O voltage flexibility but requires Lattice Diamond toolflow and separate licensing.
Availability
XC6SLX9-3CSG225C is available at Aetrix Electronics and suitable for industrial automation, communications infrastructure, and test equipment requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX9-3CSG225C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family, including XC6SLX9-3CSG225C, was designed for cost-sensitive, high-volume applications demanding low power, small footprint, and seamless integration with microcontrollers and legacy interfaces.
FAQ
What is the maximum supported DDR3 data rate for XC6SLX9-3CSG225C?
The XC6SLX9-3CSG225C supports DDR3 SDRAM interfaces up to 667 Mbps (333 MHz clock) in the -3 speed grade. This capability is verified in Xilinx UG388 and requires proper PCB layout with matched trace lengths and termination. XC6SLX9-3CSG225C achieves this using its dedicated memory interface logic and phase-aligned clocking architecture.
Does XC6SLX9-3CSG225C support JTAG boundary scan testing?
Yes, XC6SLX9-3CSG225C fully supports IEEE 1149.1 JTAG boundary scan for board-level testing and in-system programming. All required TAP signals (TCK, TMS, TDI, TDO) are dedicated pins, and the device implements mandatory instructions including SAMPLE/PRELOAD, EXTEST, and BYPASS. XC6SLX9-3CSG225C also supports IDCODE and USERCODE registers for identification.
Can XC6SLX9-3CSG225C be configured using an external microcontroller?
Yes, XC6SLX9-3CSG225C supports Slave Serial and Slave SelectMAP configuration modes, enabling direct bitstream loading from an external microcontroller via GPIO or parallel bus. The microcontroller asserts INIT_B and PROGRAM_B, then clocks data into DIN using CCLK. XC6SLX9-3CSG225C confirms successful load via DONE pin assertion.
What is the recommended power sequencing for XC6SLX9-3CSG225C?
XC6SLX9-3CSG225C requires VCCAUX (1.8 V) to be stable before or simultaneously with VCCO (I/O supply), and VCCINT (1.2 V) must ramp within ±100 ms of VCCAUX. Violating this sequence may cause configuration failure or latch-up. The power-up order is documented in Xilinx UG381, and XC6SLX9-3CSG225C includes internal power-on reset circuitry tied to these rails.
Is bitstream encryption supported on XC6SLX9-3CSG225C?
Yes, XC6SLX9-3CSG225C supports AES-128 bitstream encryption using on-chip eFUSE key storage. Encryption is enabled during bitstream generation in ISE Design Suite, and the device decrypts automatically during configuration. XC6SLX9-3CSG225C requires external configuration memory (e.g., SPI flash) to store the encrypted bitstream, and key programming is one-time only.
XC6SLX9-3CSG225C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 225-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 160
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 225-CSPBGA (13x13)
XC6SLX9-3CSG225C FAQ
1.How can I place an order for XC6SLX9-3CSG225C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-3CSG225C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-3CSG225C reliable?
The price and inventory of XC6SLX9-3CSG225C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-3CSG225C is usually 5 days.
3.What payment methods are accepted for XC6SLX9-3CSG225C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-3CSG225C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-3CSG225C?
XC6SLX9-3CSG225C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-3CSG225C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-3CSG225C?
For technical support, including XC6SLX9-3CSG225C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-3CSG225C requirements.
6.How does Aetrix verify that XC6SLX9-3CSG225C is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-3CSG225C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-3CSG225C meets industry standards.
7.What is the process for return or replacement of XC6SLX9-3CSG225C?
All XC6SLX9-3CSG225C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-3CSG225C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-3CSG225C part is unused and in its original packaging.
Return procedure for XC6SLX9-3CSG225C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX9-3CSG225C Tags
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