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AMD XC6SLX9-3CSG225I
- Part No.:
- XC6SLX9-3CSG225I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 225-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX9-3CSG225I.pdf
- Description:
- IC FPGA 160 I/O 225CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,453
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Product details
Overview
XC6SLX9-3CSG225I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 18 I/O banks supporting LVCMOS/LVTTL/SSTL standards. It operates at -3 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) and targets low-cost embedded control and interface bridging applications.
For engineers reviewing the XC6SLX9-3CSG225I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, embedded DSP slice count (16), distributed RAM capacity (108 Kbits), and support for PCI Express Gen1 endpoint configuration.
Technical Context
The XC6SLX9-3CSG225I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48A1 slices, and dual-port block RAM. It supports SelectIO technology with programmable drive strength, slew rate, and on-chip termination across all I/O banks.
This device integrates a clock management tile (CMT) containing two DCMs and one PLL for internal clock synthesis and jitter reduction. Configuration is performed via SPIx4, Master Serial, or JTAG interfaces, with bitstream encryption supported in production devices.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - total available LUT-based logic resources for combinational and sequential logic implementation |
| Block RAM | 576 Kbits - distributed across 24 x 18-Kbit RAMB16BWER primitives for data buffering and FIFOs |
| DSP Slices | 16 - each provides 18×18-bit signed multiplication and accumulation for filtering or math acceleration |
| I/O Banks | 18 - independent voltage domains enabling mixed-voltage interface design (1.2–3.3 V) |
| Speed Grade | -3 - guarantees timing closure at 1.2 V core supply with industrial temperature operation (-40°C to +100°C) |
| Configuration Interface | Master Serial / SPIx4 / JTAG - supports in-system programming and secure bitstream loading |
| Embedded Clocking | 2× DCM + 1× PLL - enables clock frequency synthesis, phase shifting, and duty cycle correction |
Pinout & Package
XC6SLX9-3CSG225I is housed in a 225-pin CSGA (Chip Scale Grid Array) package with 168 user I/O pins, arranged in 18 I/O banks. The package has 1.0 mm pitch and is RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - sets output voltage level and input threshold for bank 0 signals |
| K1 | VCCAUX | Auxiliary 2.5 V supply for configuration circuitry, clock management, and transceivers |
| M2 | GND | Ground reference for core logic and I/O structures |
| P4 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| R1 | INIT_B | Open-drain status signal indicating configuration memory readiness and CRC error detection |
| T2 | CCLK | Configuration clock input - drives serial bitstream loading during Master Serial mode |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO Technology | Supports 18 I/O standards including LVCMOS, SSTL, HSTL, and differential signaling - enables direct interfacing with DDR2, USB PHY, and microcontrollers without level shifters |
| DSP48A1 Slice | 16 dedicated arithmetic units with pre-adder, multiplier, and accumulator - delivers 1.2 GMAC/s peak performance for real-time FIR filtering |
| Embedded Memory | 576 Kbits block RAM + 108 Kbits distributed RAM - sufficient for dual-port buffers, small lookup tables, and state machine storage |
| DCM/PLL Clock Management | 2× DCM + 1× PLL per device - allows generation of multiple phase-aligned clocks from a single crystal, reducing external clock components |
| Security Features | Bitstream encryption and HMAC authentication - prevents unauthorized cloning and ensures firmware integrity in deployed systems |
Applications
| Industrial PLC I/O Module | Automotive Camera Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation between fieldbus (CANopen, Modbus) and host controller. IC Role / Device Role / Timing Role: FPGA acts as a programmable logic interface bridge with deterministic latency under 200 ns. Use Value: XC6SLX9-3CSG225I provides 168 flexible I/O pins and integrated DCMs to synchronize multi-bus timing without external clock buffers. | Use Scenario: Converting MIPI CSI-2 camera sensor output to parallel BT.656 or custom LVDS interface for ADAS vision processors. IC Role / Device Role / Timing Role: FPGA performs high-speed deserialization, pixel reordering, and format conversion with sub-cycle timing control. Use Value: XC6SLX9-3CSG225I supports 1.0 Gbps differential I/O and includes 16 DSP slices for real-time image preprocessing before host transfer. |
| Medical Sensor Data Aggregator | Low-Cost Test Equipment Controller |
Use Scenario: Consolidating analog sensor inputs (ECG, SpO₂) via ADC interfaces and applying digital filtering before Ethernet transmission. IC Role / Device Role / Timing Role: FPGA implements oversampling, decimation, and FIR filtering using embedded DSP48A1 slices. Use Value: XC6SLX9-3CSG225I delivers 16 dedicated DSP units and 576 Kbits of block RAM to sustain 12-channel, 1 kHz sampling with real-time noise suppression. | Use Scenario: Controlling relay matrices, reading DMM outputs, and managing GPIB/USB instrument communication in benchtop test fixtures. IC Role / Device Role / Timing Role: FPGA serves as a deterministic state machine and protocol engine with precise timing control over stimulus/response cycles. Use Value: XC6SLX9-3CSG225I offers 9,152 logic cells and industrial-grade temperature tolerance to ensure reliable operation in uncontrolled lab environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-3CSG324I | 14,579 logic cells, 324-pin CSGA, higher I/O count (200), increased block RAM (900 Kbits) | Suitable for designs requiring larger logic footprint or more I/Os, e.g., multi-sensor fusion or dual-interface bridging | Select when XC6SLX9-3CSG225I resource utilization exceeds 85% in synthesis reports |
| LFE5U-25F-8MG285I | 25K LUTs, 285-pin CABGA, 1.2 V core, supports embedded SERDES (2.5 Gbps), no native PCI Express support | Better suited for ultra-low-power portable instrumentation or battery-operated edge nodes with high-speed serial links | Choose for new designs prioritizing lower static power (< 25 mW) and integrated transceivers over legacy PCI Express compatibility |
Compared with XC6SLX9-3CSG225I, the XC6SLX16-3CSG324I expands logic and memory capacity for scaling complexity, while the LFE5U-25F-8MG285I shifts toward power-constrained serial-link applications - neither is pin-compatible, and both require PCB redesign and toolchain migration.
Availability
XC6SLX9-3CSG225I is available at Aetrix Electronics and suitable for industrial automation, automotive ADAS subsystems, and medical data acquisition systems requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX9-3CSG225I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low power, flexible I/O, and proven reliability - especially in industrial control, video processing, and communications infrastructure.
FAQ
What is the maximum operating frequency of the XC6SLX9-3CSG225I?
The XC6SLX9-3CSG225I is rated for a -3 speed grade, meaning its internal logic can operate reliably up to 667 MHz for register-to-register paths under worst-case industrial conditions (1.2 V, +100°C). Actual system frequency depends on design complexity, routing, and I/O timing constraints - verified via static timing analysis in Vivado or ISE.
Does the XC6SLX9-3CSG225I support JTAG boundary scan testing?
Yes, the XC6SLX9-3CSG225I fully supports IEEE 1149.1 JTAG boundary scan through dedicated TCK, TMS, TDI, and TDO pins. This enables board-level interconnect testing, in-circuit programming, and debug access to internal configuration registers during development and production test.
Can the XC6SLX9-3CSG225I be configured using an SPI flash memory?
Yes, the XC6SLX9-3CSG225I supports Master SPI (SPIx4) configuration mode, allowing direct boot from standard quad-SPI flash devices such as Micron MT25QL or Winbond W25Q series. Configuration occurs automatically on power-up when MODE pins are set to 001.
What I/O standards are supported by the XC6SLX9-3CSG225I?
The XC6SLX9-3CSG225I supports 18 I/O standards including LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVTTL, SSTL18_I/II, SSTL2_I/II, HSTL_I/II, and differential standards like LVDS, BLVDS, and RSDS - all configurable per I/O bank via IOSTANDARD attribute in HDL or constraints files.
Is bitstream encryption available on the XC6SLX9-3CSG225I?
Yes, the XC6SLX9-3CSG225I supports AES-256 bitstream encryption using a 256-bit key stored in on-chip eFUSE. This feature requires Xilinx ISE 14.7 or later and is enabled during bitstream generation to prevent reverse engineering and unauthorized duplication of programmed logic.
XC6SLX9-3CSG225I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 225-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 160
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 225-CSPBGA (13x13)
XC6SLX9-3CSG225I FAQ
1.How can I place an order for XC6SLX9-3CSG225I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-3CSG225I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-3CSG225I reliable?
The price and inventory of XC6SLX9-3CSG225I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-3CSG225I is usually 5 days.
3.What payment methods are accepted for XC6SLX9-3CSG225I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-3CSG225I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-3CSG225I?
XC6SLX9-3CSG225I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-3CSG225I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-3CSG225I?
For technical support, including XC6SLX9-3CSG225I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-3CSG225I requirements.
6.How does Aetrix verify that XC6SLX9-3CSG225I is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-3CSG225I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-3CSG225I meets industry standards.
7.What is the process for return or replacement of XC6SLX9-3CSG225I?
All XC6SLX9-3CSG225I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-3CSG225I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-3CSG225I part is unused and in its original packaging.
Return procedure for XC6SLX9-3CSG225I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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