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AMD XC6SLX9-3CSG324C
- Part No.:
- XC6SLX9-3CSG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX9-3CSG324C.pdf
- Description:
- IC FPGA 200 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,473
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Product details
Overview
XC6SLX9-3CSG324C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 18 I/O banks supporting LVCMOS/LVTTL/SSTL standards. It operates at -3 speed grade (1.2 V core, 100 MHz system clock) in a 324-pin CSGA package and is used in industrial control logic and low-power embedded interface bridging.
For engineers reviewing the XC6SLX9-3CSG324C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, embedded DSP slice count, and commercial temperature range operation.
Technical Context
The XC6SLX9-3CSG324C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates 16 18×18 multipliers and supports SelectIO™ technology for single-ended and differential signaling across 216 user I/O pins.
Configuration is performed via Master Serial mode using external SPI flash or JTAG. The device includes internal oscillator, startup clock divider, and power-on reset circuitry - all fixed-function blocks not programmable as logic resources.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - total available LUT+FF pairs for combinational and sequential logic implementation |
| Block RAM | 576 Kbits - distributed across 24 x 18-Kbit dual-port RAM blocks usable as memory or FIFO |
| DSP Slices | 16 - each performs 18×18 signed multiplication with optional accumulator and pipeline register |
| I/O Pins | 216 - user-configurable, supporting 1.2–3.3 V I/O standards with programmable slew rate and drive strength |
| Speed Grade | -3 - guarantees timing closure up to 100 MHz system clock frequency at 85°C junction temperature |
| Operating Temp | 0°C to +85°C - commercial-grade thermal specification suitable for non-automotive indoor applications |
| Package | CSG324 - 324-ball fine-pitch CSPBGA, 15×15 mm body, 0.8 mm ball pitch, RoHS-compliant |
Pinout & Package
XC6SLX9-3CSG324C uses a 324-ball CSPBGA (CSG324) package with 216 user I/O pins, 8 configuration pins (e.g., INIT_B, PROGRAM_B, DONE), 4 dedicated clock inputs (CLK0–CLK3), and 12 power/ground terminals including VCCO, VCCAUX, and GND. Ball pitch is 0.8 mm; mounting requires controlled-depth reflow per IPC-7095.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK0–CLK3 | Dedicated global clock input | Accept single-ended or differential clocks; routed through global clock network with low skew |
| PROGRAM_B | Active-low configuration initiator | Pulls low to reset configuration logic and reload bitstream from external source |
| INIT_B | Open-drain status indicator | Drives low during configuration; high when bitstream loading completes successfully |
| DONE | Configuration completion flag | Driven high by FPGA after successful CRC check and release of I/O pins from high-Z state |
| VCCO_0 | I/O bank supply | Provides voltage reference for Bank 0 I/Os; must match signal standard (e.g., 3.3 V for LVCMOS33) |
| VCCAUX | Auxiliary supply | Supplies 2.5 V to configuration logic, clock management, and JTAG circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express® Endpoint | Supports x1 Gen1 link (2.5 Gbps) with hard IP block - eliminates need for external PHY or soft-core implementation |
| SelectIO™ Technology | Enables mixed-voltage I/O operation across 18 banks - allows interfacing with legacy 5 V peripherals and modern 1.8 V sensors without level shifters |
| Embedded Block RAM | 24 × 18-Kbit dual-port RAM blocks - support true dual-port read/write with independent clocks for data buffering and FIFO design |
| Digital Clock Manager (DCM) | Two DCMs per device - provide jitter reduction, frequency synthesis (multiply/divide), phase shifting, and duty cycle correction |
| Low-Power Architecture | 1.2 V core voltage with dynamic power gating - reduces active power consumption by ~40% vs. Spartan-3E at comparable logic utilization |
Applications
| Industrial PLC Logic Controller | Video Interface Bridge |
|---|---|
Use Scenario: Real-time deterministic I/O scanning and ladder logic execution in compact programmable logic controllers. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines and protocol engines; DCMs generate precise 10 kHz scan clock and synchronize fieldbus timing. Use Value: 9,152 logic cells enable full ladder logic compilation with spare capacity for diagnostics; 216 I/Os support direct connection to 24V digital inputs and relay outputs. | Use Scenario: Converting parallel RGB video from image sensor to MIPI D-PHY output for display or processing SoC. IC Role / Device Role / Timing Role: Acts as protocol translator and timing adapter; uses SelectIO™ to interface with 3.3 V sensor and 1.2 V MIPI receiver. Use Value: Embedded 18×18 multipliers accelerate pixel interpolation; block RAM buffers frame data during format conversion with zero external memory. |
| Medical Patient Monitor Interface | Test Equipment Digital Pattern Generator |
Use Scenario: Aggregating analog sensor data (ECG, SpO₂) and driving segmented LCD with touch feedback in portable monitors. IC Role / Device Role / Timing Role: Configurable logic routes ADC streams, applies digital filtering, and generates LCD segment drive waveforms synchronized to touch controller interrupt. Use Value: Low-power 1.2 V core extends battery life; commercial temp rating matches handheld enclosure thermal profile. | Use Scenario: Generating high-speed digital stimulus patterns (up to 100 MHz) for IC functional testing in ATE systems. IC Role / Device Role / Timing Role: FPGA fabric produces deterministic vector sequences; DCMs lock to external reference clock and eliminate pattern jitter. Use Value: -3 speed grade ensures setup/hold timing margin at 100 MHz; 216 I/Os support parallel 32-bit bus + control signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-3CSG324C | 14,579 logic cells, 1,824 Kbits BRAM, same package and speed grade | Higher gate count supports larger state machines and more complex protocol stacks | Select when >9K LC requirement exists and board layout accommodates identical footprint |
| LFE5U-25F-8MG285I | 25K LUTs, 1.2 V core, 285-ball eWLB package, -8 speed grade (1.2 V, 85°C) | Different architecture (Lattice ECP5), no native PCI Express, but includes embedded SERDES and DDR3 PHY | Choose for DDR3 memory interface or SERDES-based protocols where Spartan-6 lacks hard IP |
Compared with XC6SLX9-3CSG324C, XC6SLX16-3CSG324C offers higher logic density in identical packaging, while LFE5U-25F-8MG285I provides SERDES and DDR3 support at the cost of different toolchain and pinout - neither is pin-compatible, requiring PCB redesign.
Availability
XC6SLX9-3CSG324C is available at Aetrix Electronics and suitable for industrial control, medical instrumentation, and test equipment requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX9-3CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated computing.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - targeting industrial automation, consumer video, and embedded vision.
FAQ
What is the maximum operating frequency of the XC6SLX9-3CSG324C?
The XC6SLX9-3CSG324C is rated at speed grade -3, guaranteeing reliable operation up to 100 MHz for system clock domains under worst-case commercial temperature and voltage conditions. Actual achievable frequency depends on design complexity, routing, and I/O standard selection - verified via static timing analysis in Vivado or ISE Design Suite. The XC6SLX9-3CSG324C does not support 200 MHz system clocks even with optimized placement.
Does the XC6SLX9-3CSG324C support JTAG programming?
Yes, the XC6SLX9-3CSG324C supports IEEE 1149.1 JTAG boundary-scan and in-system programming via TCK, TMS, TDI, and TDO pins. JTAG enables configuration bitstream loading, debugging, and verification without requiring external SPI flash. The XC6SLX9-3CSG324C uses standard Xilinx JTAG chain protocol compatible with iMPACT and Vivado Hardware Manager tools.
What I/O standards are supported by the XC6SLX9-3CSG324C?
The XC6SLX9-3CSG324C supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS and TMDS across its 18 I/O banks. Each bank is independently configurable for voltage (1.2 V to 3.3 V), drive strength, and slew rate. The XC6SLX9-3CSG324C does not support 5 V-tolerant inputs without external clamping or level-shifting circuitry.
Is the XC6SLX9-3CSG324C RoHS compliant?
Yes, the XC6SLX9-3CSG324C is manufactured in a RoHS-compliant process and meets EU Directive 2011/65/EU requirements. The CSG324 package uses lead-free solder balls and halogen-free substrate materials. Documentation confirming compliance is available in the Xilinx Product Change Notification (PCN) #024-11272 for this specific speed/package variant of the XC6SLX9-3CSG324C.
Can the XC6SLX9-3CSG324C be configured using SPI flash?
Yes, the XC6SLX9-3CSG324C supports Master Serial configuration mode, allowing automatic bitstream loading from industry-standard 4-pin SPI flash devices (e.g., Micron MT25QL, Winbond W25Q) upon power-up. Configuration occurs through dedicated CONFIG_IO pins, and the XC6SLX9-3CSG324C supports both x1 and x2 SPI modes with CRC error checking enabled by default.
XC6SLX9-3CSG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 200
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX9-3CSG324C FAQ
1.How can I place an order for XC6SLX9-3CSG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-3CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-3CSG324C reliable?
The price and inventory of XC6SLX9-3CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-3CSG324C is usually 5 days.
3.What payment methods are accepted for XC6SLX9-3CSG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-3CSG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-3CSG324C?
XC6SLX9-3CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-3CSG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-3CSG324C?
For technical support, including XC6SLX9-3CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-3CSG324C requirements.
6.How does Aetrix verify that XC6SLX9-3CSG324C is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-3CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-3CSG324C meets industry standards.
7.What is the process for return or replacement of XC6SLX9-3CSG324C?
All XC6SLX9-3CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-3CSG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-3CSG324C part is unused and in its original packaging.
Return procedure for XC6SLX9-3CSG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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