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AMD XC6SLX9-3CSG324I
- Part No.:
- XC6SLX9-3CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX9-3CSG324I.pdf
- Description:
- IC FPGA 200 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,107
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Product details
Overview
XC6SLX9-3CSG324I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 18 I/O banks supporting LVCMOS, LVTTL, SSTL, and HSTL standards. It operates at -3 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) in a 324-pin CSGA package and is used in low-cost industrial control and embedded vision interfaces.
For engineers reviewing the XC6SLX9-3CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded memory capacity, and industrial-grade thermal reliability.
Technical Context
The XC6SLX9-3CSG324I implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated carry logic. It integrates 16 DSP48A1 slices for arithmetic-intensive tasks and supports dual-register flip-flops per CLB for high-speed synchronous design.
Configuration is performed via Master Serial SPI or JTAG, with support for fallback configuration and multi-boot using external flash. The device includes internal oscillator, power-on reset circuitry, and programmable I/O slew rate and drive strength per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - provides sufficient resources for medium-complexity control logic and protocol bridging |
| Block RAM | 576 Kbits - enables local data buffering for video line buffers or FIFOs up to 16K × 36-bit depth |
| DSP Slices | 16 × DSP48A1 - supports fixed-point multiply-accumulate operations at up to 250 MHz |
| I/O Banks | 18 - allows independent voltage assignment (1.2–3.3 V) per bank for mixed-voltage interface design |
| Speed Grade | -3 - guarantees timing closure at 1.2 V core supply with industrial temperature operation |
| Package | 324-pin CSGA (15 × 15 mm, 0.8 mm pitch) - compatible with standard reflow profiles and mid-density PCB routing |
Pinout & Package
The XC6SLX9-3CSG324I is housed in a 324-pin Chip Scale Grid Array (CSGA) package with 18 I/O banks, dedicated configuration pins (M0–M2, INIT_B, PROGRAM_B, CCLK, DIN), and dual-purpose configuration/user I/O (e.g., TCK/TMS/TDI/TDO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (SPI, JTAG, or Master SelectMAP) at power-up |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| CCLK | Configuration Clock Input | Drives serial configuration data clock; can be internally generated or externally supplied |
| DIN | Serial Configuration Data Input | Accepts configuration bitstream during Master Serial mode from SPI flash |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Support | Per-bank voltage selection (1.2 V to 3.3 V) enables direct interfacing with legacy and modern peripherals without level shifters |
| Embedded Block RAM | 576 Kbits organized as 18 × 32K-bit blocks - supports true dual-port access for simultaneous read/write in control state machines |
| DSP48A1 Slice | 16 dedicated arithmetic units with 18 × 25-bit multiplier, pre-adder, and accumulator - accelerates FIR filtering and motor control algorithms |
| Configurable I/O Standards | Supports LVCMOS, LVTTL, SSTL-2/3, HSTL-I/II, and differential standards (LVDS, TMDS) - simplifies integration into display and memory subsystems |
| Internal Oscillator | ~50 MHz RC oscillator - provides reliable clock for configuration, JTAG, and basic system initialization without external crystal |
Applications
| Industrial PLC I/O Module | Embedded Vision Interface |
|---|---|
Use Scenario: Real-time digital input/output conditioning and protocol translation in compact programmable logic controllers. IC Role / Device Role / Timing Role: FPGA fabric implements custom logic for signal debouncing, pulse-width modulation, and Modbus RTU framing. Use Value: 9,152 logic cells and 18 I/O banks allow concurrent handling of 48+ discrete I/O channels with mixed voltage levels. | Use Scenario: Bridging CMOS image sensor output (MIPI CSI-2 or parallel BT.656) to ARM-based application processors. IC Role / Device Role / Timing Role: XC6SLX9-3CSG324I acts as a pixel-data formatter, clock domain synchronizer, and video FIFO controller. Use Value: 576 Kbits of block RAM enables line buffering for 720p@60fps video streams with minimal external memory. |
| Motor Control Gateway | Communications Backplane Interface |
Use Scenario: Field-oriented control (FOC) preprocessing and CAN bus arbitration in servo drive modules. IC Role / Device Role / Timing Role: FPGA executes encoder interpolation, PWM generation, and current-sampling synchronization with sub-microsecond jitter. Use Value: DSP48A1 slices perform real-time Clarke/Park transforms at 20 kHz loop rates without CPU load. | Use Scenario: Protocol conversion between PCIe host interface and legacy parallel bus (e.g., VME or CompactPCI) in test equipment. IC Role / Device Role / Timing Role: XC6SLX9-3CSG324I serves as a bridge controller managing address decoding, burst transfers, and interrupt mapping. Use Value: Configurable I/O standards and 18 I/O banks enable direct connection to both 3.3 V PCIe signaling and 5 V VME bus lines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-3CSG324I | 14,579 logic cells, 900 Kbits block RAM, same package and speed grade | Higher gate count supports larger state machines and additional peripheral IP cores | Select when >9K LUTs required for integrated Ethernet MAC or dual-camera interface |
| LFE5U-25F-8MG285C | 25K LUTs, 1.2 V core, -8 speed grade, 285-pin CABGA, no native DDR support | Lower static power, instant-on capability, but lacks dedicated DDR PHY and mature toolchain for legacy designs | Prefer for new ultra-low-power designs where Vivado tooling is not mandated |
Compared with XC6SLX9-3CSG324I, XC6SLX16-3CSG324I offers scalable logic density within identical footprint and thermal envelope, while LFE5U-25F-8MG285C provides lower power and faster startup at the cost of DDR interface maturity and ecosystem alignment.
Availability
XC6SLX9-3CSG324I is available at Aetrix Electronics and suitable for industrial automation, embedded vision systems, and motor control applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX9-3CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families.
The Spartan-6 family, including XC6SLX9-3CSG324I, was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and industrial temperature reliability.
FAQ
What is the maximum operating frequency of the XC6SLX9-3CSG324I?
The XC6SLX9-3CSG324I is rated for a -3 speed grade, meaning its internal logic paths are guaranteed to operate reliably up to 512 MHz for register-to-register timing under industrial conditions. Actual achievable frequency depends on design complexity, placement, and routing; typical user logic achieves 150–250 MHz in well-optimized implementations. The XC6SLX9-3CSG324I datasheet specifies setup/hold timing for all I/O standards and internal paths.
Does the XC6SLX9-3CSG324I support DDR2 memory interfaces?
Yes, the XC6SLX9-3CSG324I supports DDR2 SDRAM interfaces through its DQS-capable I/O banks and built-in IDELAY/ODELAY primitives. It does not include a hard DDR2 PHY, so interface timing must be managed in logic using calibration techniques. Reference designs for 16-bit DDR2-400 operation at 200 MHz are documented in Xilinx UG382 and validated with Micron MT47H64M16HR-37E.
What configuration modes are supported by the XC6SLX9-3CSG324I?
The XC6SLX9-3CSG324I supports Master Serial (SPI flash), Slave SelectMAP (parallel PROM), JTAG boundary-scan, and system-level configuration via processor-controlled GPIO. Mode selection is set by M0–M2 pins at power-up. The XC6SLX9-3CSG324I also supports fallback configuration and multi-boot using external flash with dual-image storage.
Is the XC6SLX9-3CSG324I RoHS compliant and lead-free?
Yes, the XC6SLX9-3CSG324I is manufactured in a lead-free, RoHS-compliant process and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3). The CSGA package uses matte tin finish on solder balls, and full compliance documentation is available in AMD's Product Change Notification PCN-2019-001.
Can the XC6SLX9-3CSG324I be programmed in-system via JTAG?
Yes, the XC6SLX9-3CSG324I supports full in-system programming and debugging via IEEE 1149.1 JTAG interface using standard tools like AMD Vivado Hardware Manager. JTAG enables configuration, boundary-scan testing, and real-time debug probe insertion without requiring external configuration memory. The XC6SLX9-3CSG324I retains JTAG functionality even after configuration completes.
XC6SLX9-3CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 200
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX9-3CSG324I FAQ
1.How can I place an order for XC6SLX9-3CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-3CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-3CSG324I reliable?
The price and inventory of XC6SLX9-3CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-3CSG324I is usually 5 days.
3.What payment methods are accepted for XC6SLX9-3CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-3CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-3CSG324I?
XC6SLX9-3CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-3CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-3CSG324I?
For technical support, including XC6SLX9-3CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-3CSG324I requirements.
6.How does Aetrix verify that XC6SLX9-3CSG324I is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-3CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-3CSG324I meets industry standards.
7.What is the process for return or replacement of XC6SLX9-3CSG324I?
All XC6SLX9-3CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-3CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-3CSG324I part is unused and in its original packaging.
Return procedure for XC6SLX9-3CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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