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AMD XC6SLX9-3FT256I
- Part No.:
- XC6SLX9-3FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX9-3FT256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,871
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Product details
Overview
XC6SLX9-3FT256I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 9,152 logic cells, 576 Kbits of block RAM, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It integrates dual 18×18 multipliers, DSP48A1 slices, and supports LVCMOS/LVTTL I/O standards for embedded control and interface bridging in space-constrained industrial controllers.
For engineers reviewing the XC6SLX9-3FT256I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (186 user I/Os), configuration interface (SPI/Slave SelectMAP), power supply requirements (1.2 V core, 2.5/3.3 V I/O), and industrial-grade thermal performance.
Technical Context
The XC6SLX9-3FT256I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry chains for arithmetic. It supports JTAG boundary-scan (IEEE 1149.1) and internal configuration memory (ICAP) for partial reconfiguration.
Configuration is performed via Master SPI or Slave SelectMAP mode using external PROM or processor. The device includes digital clock managers (DCMs) with phase-matching, duty-cycle correction, and frequency synthesis capabilities up to 333 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - determines maximum combinational/sequential logic capacity for custom state machines or protocol engines |
| User I/O Pins | 186 - supports parallel bus interfaces, sensor arrays, or multi-peripheral connectivity without external glue logic |
| Block RAM | 576 Kbits - enables on-chip FIFOs, lookup tables, or small-frame buffering for real-time data flow |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz for critical paths under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for deployment in uncooled industrial enclosures or outdoor edge nodes |
| Core Voltage | 1.2 V ±3% - requires low-noise, tightly regulated DC-DC converter with <10 mV ripple |
| I/O Standards | LVCMOS, LVTTL, PCI, SSTL - allows direct interfacing with microcontrollers, ADCs, and memory without level shifters |
Pinout & Package
XC6SLX9-3FT256I is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 17×17 array configuration. Thermal pad on underside aids heat dissipation in high-duty-cycle operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 4.7 µF near package |
| P2 | CCLK | Configuration clock input - driven by PROM or master controller during bitstream loading |
| R1 | DONE | Open-drain status signal - pulled high when configuration completes successfully |
| T1 | INIT_B | Active-low initialization indicator - asserts low if CRC error or configuration failure occurs |
| Y2 | M0/M1/M2 | Mode select pins - set configuration mode (e.g., Master SPI = 001) |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two DCMs per device - provide jitter-tolerant clock synthesis, phase alignment, and dynamic frequency scaling for mixed-clock-domain systems |
| DSP48A1 Slices | 16 slices - enable hardware-accelerated multiply-accumulate operations for motor control PID loops or FIR filtering |
| Embedded Memory | 576 Kbits block RAM + distributed RAM - supports dual-port RAM configurations for simultaneous read/write in data acquisition pipelines |
| Configuration Security | Bitstream encryption support - prevents reverse engineering of programmable logic design in deployed equipment |
| I/O Isolation | Independent VCCO per I/O bank - allows mixed-voltage operation (e.g., 1.8 V sensors + 3.3 V MCU) without level translators |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) Interface |
|---|---|
Use Scenario: Modular expansion card for real-time digital I/O conditioning and protocol translation in DIN-rail mounted PLCs. IC Role / Device Role / Timing Role: FPGA fabric implements custom logic for opto-isolated input debouncing, pulse-width modulation output generation, and Modbus RTU framing. Use Value: Reduces BOM count by replacing discrete timers, shift registers, and UART peripherals while maintaining deterministic 100 µs I/O response latency. | Use Scenario: Signal routing and pattern generation unit in benchtop ATE platforms validating mixed-signal ICs. IC Role / Device Role / Timing Role: XC6SLX9-3FT256I acts as high-speed digital vector generator and response analyzer with precise cycle-accurate timing control. Use Value: Enables 100+ Mbps parallel test pattern streaming and real-time pass/fail decision logic at sub-ns resolution using internal DCMs. |
| Medical Imaging Sensor Hub | Smart Energy Meter Communication Gateway |
Use Scenario: Aggregation node for time-synchronized analog sensor data from ultrasound transducer arrays. IC Role / Device Role / Timing Role: Configurable logic synchronizes ADC sampling clocks, buffers raw pixel data, and formats packets for PCIe or GigE transmission. Use Value: Achieves 12-bit, 40 MSPS data capture with <±0.5 LSB integral nonlinearity using on-chip block RAM as ping-pong buffers. | Use Scenario: Dual-interface gateway in DIN-rail energy meters supporting DLMS/COSEM over PLC (PRIME) and RF (Wi-SUN). IC Role / Device Role / Timing Role: XC6SLX9-3FT256I hosts PRIME PHY layer processing and Wi-SUN MAC arbitration logic with shared memory access. Use Value: Eliminates need for separate communication SoCs by integrating two incompatible protocol stacks with deterministic interrupt latency <2 µs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC6SLX16-3FT256I | 14,579 logic cells, 900 Kbits block RAM - higher density and memory capacity | Better suited for designs requiring larger state machines or deeper packet buffers | Select when XC6SLX9-3FT256I resource utilization exceeds 85% in synthesis reports |
| AMD XC7S15-2CSGA225I | Artix-7 architecture, 12,800 logic cells, 640 Kbits RAM, lower static power | Includes built-in PCIe Gen1 endpoint and improved DSP efficiency for signal processing | Prefer for new designs targeting longer product lifecycle or requiring native PCIe integration |
Compared with XC6SLX9-3FT256I, XC6SLX16-3FT256I offers headroom for future feature expansion, while XC7S15-2CSGA225I provides architectural modernization and reduced power per logic cell - both require PCB redesign due to different packages and pinouts.
Availability
XC6SLX9-3FT256I is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and smart grid infrastructure requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX9-3FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 FPGA family for long-lifecycle industrial and aerospace applications.
The Spartan-6 family was designed for cost-sensitive, power-efficient embedded control and interface bridging - balancing logic density, I/O flexibility, and qualification for harsh environments.
FAQ
What is the configuration method supported by XC6SLX9-3FT256I?
XC6SLX9-3FT256I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Master SPI uses an external serial PROM; Slave SelectMAP allows a microcontroller to load the bitstream via parallel bus; JTAG is used for debugging and programming during development. All methods are documented in UG380 v1.11.
Does XC6SLX9-3FT256I support differential I/O standards like LVDS?
No, XC6SLX9-3FT256I does not support native LVDS or other differential I/O standards. It supports single-ended standards only: LVCMOS, LVTTL, PCI, and SSTL. For differential signaling, external serializers or companion PHY devices are required.
What is the maximum operating frequency of the DCM in XC6SLX9-3FT256I?
The Digital Clock Manager (DCM) in XC6SLX9-3FT256I supports input frequencies up to 250 MHz and generates output frequencies up to 333 MHz with phase-matching and duty-cycle correction. This specification is verified under industrial temperature and -3 speed grade conditions per DS162.
Is XC6SLX9-3FT256I RoHS compliant and lead-free?
Yes, XC6SLX9-3FT256I is RoHS compliant and lead-free. It meets EU Directive 2011/65/EU and uses matte tin finish on solder balls. The device is also qualified to JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) for surface-mount assembly.
Can XC6SLX9-3FT256I be reprogrammed in-system after soldering?
Yes, XC6SLX9-3FT256I supports in-system programming via JTAG or ICAP (Internal Configuration Access Port). Field updates can be performed using a host processor or dedicated configuration controller without removing the device from the PCB.
XC6SLX9-3FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX9-3FT256I FAQ
1.How can I place an order for XC6SLX9-3FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-3FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-3FT256I reliable?
The price and inventory of XC6SLX9-3FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-3FT256I is usually 5 days.
3.What payment methods are accepted for XC6SLX9-3FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-3FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-3FT256I?
XC6SLX9-3FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-3FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-3FT256I?
For technical support, including XC6SLX9-3FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-3FT256I requirements.
6.How does Aetrix verify that XC6SLX9-3FT256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-3FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-3FT256I meets industry standards.
7.What is the process for return or replacement of XC6SLX9-3FT256I?
All XC6SLX9-3FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-3FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-3FT256I part is unused and in its original packaging.
Return procedure for XC6SLX9-3FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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