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AMD XC6SLX9-3FTG256C
- Part No.:
- XC6SLX9-3FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX9-3FTG256C.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,489
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Product details
Overview
XC6SLX9-3FTG256C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 24 DSP48A1 slices, configured in a 256-pin FTBGA package with 186 user I/Os. It operates at -3 speed grade (1.2 V core, industrial temperature range) and targets low-cost embedded control and interface bridging applications.
For engineers reviewing the XC6SLX9-3FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, DSP slice availability, and FTBGA thermal performance for space-constrained industrial PCBs.
Technical Context
The XC6SLX9-3FTG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated clock routing. It supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards across banks with independent voltage supply per bank.
It integrates dual-register flip-flops per slice, shift register LUTs (SRL32E), and built-in digital clock managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction - all without external PLL components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - total configurable resources for combinational and sequential logic implementation |
| Block RAM | 576 Kbits - distributed across 24 x 18-Kbit RAMB16BWER blocks for data buffering and FIFOs |
| DSP Slices | 24 × DSP48A1 - support 18×18 signed multiplication and accumulate operations per slice |
| User I/O Pins | 186 - configurable as single-ended or differential signals with bank-wise voltage flexibility |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock with DCM feedback |
| Core Voltage | 1.2 V ±3% - fixed supply requirement for internal logic and CLB operation |
Pinout & Package
XC6SLX9-3FTG256C is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and exposed thermal pad for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage supply (1.8/2.5/3.3 V selectable) |
| K1 | VCCAUX | 1.8 V auxiliary supply for configuration, JTAG, and analog circuitry |
| T1 | VCCINT | 1.2 V core logic supply - must be tightly regulated |
| R2 | PROGRAM_B | Active-low asynchronous reset for configuration state machine |
| P3 | INIT_B | Open-drain status signal indicating configuration memory readiness |
| M2 | CCLK | Configuration clock input - drives internal bitstream loading sequence |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Register Flip-Flops | Each LUT6 can drive two independent registers - enables high-speed pipelining with minimal resource overhead |
| SRL32E Shift Registers | 32-bit shift register implemented in LUT - eliminates need for dedicated memory for small FIFOs or delay lines |
| Digital Clock Manager (DCM) | On-chip clock synthesis with ±100 ppm stability - replaces external clock ICs in cost-sensitive designs |
| SelectIO Technology | Per-bank I/O voltage independence - allows mixed-voltage interfacing (e.g., 3.3 V MCU to 1.8 V sensor) |
| MultiBoot Configuration | Supports up to 4 independent bitstreams - enables field-upgradable firmware and fail-safe fallback modes |
Applications
| Industrial PLC I/O Expansion | Automotive Camera Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O and analog input channels to legacy PLC backplanes via serial peripheral expansion. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and real-time I/O controller, managing SPI-to-parallel conversion and watchdog-timed GPIO updates. Use Value: Enables reuse of existing 24 V DC control infrastructure while adding modern diagnostics and timestamped event logging using on-chip block RAM. | Use Scenario: Bridging MIPI CSI-2 camera output to parallel CMOS image sensor interface on ADAS domain controllers. IC Role / Device Role / Timing Role: Timing-critical serializer/deserializer that aligns pixel clocks, handles lane deskew, and inserts frame sync markers. Use Value: Achieves sub-10 ns inter-lane skew correction using dedicated I/O delay elements and DCM-synchronized sampling clocks. |
| Medical Patient Monitor Data Aggregation | Test Equipment Digital Pattern Generator |
Use Scenario: Consolidating ECG, SpO₂, and NIBP waveform streams from multiple analog front-ends into a unified AXI-Stream interface for ARM-based processing. IC Role / Device Role / Timing Role: Real-time multiplexer and sample-rate converter with programmable decimation filters implemented in DSP48A1 slices. Use Value: Reduces host CPU load by offloading 12-bit × 4-channel interpolation and timestamp alignment before DMA transfer. | Use Scenario: Generating precise, multi-channel digital stimulus waveforms for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: High-speed pattern sequencer with deterministic 100 MHz vector update rate and jitter < 50 ps RMS. Use Value: Delivers repeatable edge placement using SRL32E-based delay chains and DCM-derived phase-aligned clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2FTG256C | Slower -2 speed grade; lower maximum clock frequency (400 MHz vs. 500 MHz) | Suitable for non-real-time control loops where timing margin is relaxed | Select when thermal budget limits or cost sensitivity outweighs performance headroom |
| XC6SLX16-3CSG324C | Larger device (14,579 logic cells), 324-pin CSBGA package, higher I/O count (204) | Required for designs needing >9K logic cells or additional transceivers not present in LX9 | Choose when scaling beyond XC6SLX9-3FTG256C resource limits while retaining Spartan-6 toolchain compatibility |
Compared with XC6SLX9-2FTG256C, the XC6SLX9-3FTG256C delivers tighter timing closure for high-speed I/O interfaces; compared with XC6SLX16-3CSG324C, it offers lower BOM cost and smaller PCB footprint at the expense of logic density and I/O scalability.
Availability
XC6SLX9-3FTG256C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX9-3FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family, including XC6SLX9-3FTG256C, was designed for cost-sensitive, high-volume applications demanding low static power, flexible I/O, and seamless integration with microcontrollers and ASICs.
FAQ
What is the maximum operating junction temperature for XC6SLX9-3FTG256C?
The XC6SLX9-3FTG256C has a maximum junction temperature of 100°C under industrial temperature grade (-40°C to +100°C ambient). This rating assumes proper PCB thermal design with the exposed thermal pad soldered to a solid copper plane. Thermal derating applies above 85°C ambient, and the device enters thermal shutdown if Tj exceeds 125°C. The XC6SLX9-3FTG256C datasheet specifies thermal resistance θJA as 29.5°C/W for standard 4-layer board layout.
Does XC6SLX9-3FTG256C support JTAG boundary scan testing?
Yes, XC6SLX9-3FTG256C fully supports IEEE 1149.1 JTAG boundary scan through dedicated TDI, TDO, TMS, and TCK pins. It implements mandatory instructions (SAMPLE/PRELOAD, EXTEST, BYPASS) and optional IDCODE. The XC6SLX9-3FTG256C also supports INTEST for internal logic testing during configuration mode, enabling structural verification prior to full bitstream load.
Can XC6SLX9-3FTG256C configure from SPI flash memory?
Yes, XC6SLX9-3FTG256C supports master SPI configuration mode using on-chip oscillator and dedicated M0–M2 pins to boot from industry-standard 4-wire SPI flash devices. The XC6SLX9-3FTG256C automatically detects flash type (x1/x2/x4) and supports dual-boot via MultiBoot with fallback address mapping, enabling robust field updates without external microcontroller intervention.
What I/O standards are supported on XC6SLX9-3FTG256C banks 0 and 1?
XC6SLX9-3FTG256C banks 0 and 1 support LVCMOS, LVTTL, PCI, and SSTL18 I/O standards with programmable drive strength (2–24 mA) and slew rate control. Bank 0 supports VCCO = 1.8/2.5/3.3 V; Bank 1 supports VCCO = 1.8/2.5 V only. The XC6SLX9-3FTG256C does not support differential standards like LVDS or RSDS in these banks - those require banks 2–4 with dedicated differential terminations.
Is XC6SLX9-3FTG256C compatible with Xilinx ISE Design Suite 14.7?
Yes, XC6SLX9-3FTG256C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, timing analysis, and bitstream generation. The XC6SLX9-3FTG256C device files are included in ISE 14.7 Service Pack 5 and later. No Vivado support is provided - this device is not migratable to the newer toolchain due to architecture-level differences in constraint handling and IP integration.
XC6SLX9-3FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX9-3FTG256C FAQ
1.How can I place an order for XC6SLX9-3FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-3FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-3FTG256C reliable?
The price and inventory of XC6SLX9-3FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-3FTG256C is usually 5 days.
3.What payment methods are accepted for XC6SLX9-3FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-3FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-3FTG256C?
XC6SLX9-3FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-3FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-3FTG256C?
For technical support, including XC6SLX9-3FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-3FTG256C requirements.
6.How does Aetrix verify that XC6SLX9-3FTG256C is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-3FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-3FTG256C meets industry standards.
7.What is the process for return or replacement of XC6SLX9-3FTG256C?
All XC6SLX9-3FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-3FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-3FTG256C part is unused and in its original packaging.
Return procedure for XC6SLX9-3FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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