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AMD XC6SLX9-3FTG256I
- Part No.:
- XC6SLX9-3FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX9-3FTG256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,009
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Product details
Overview
XC6SLX9-3FTG256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 18 I/O banks supporting LVCMOS/LVTTL/SSTL standards. It features a 3-speed grade (-3), operates at 1.2 V core voltage, and is packaged in a 256-pin Fine-Pitch Ball Grid Array (FTBGA). It is used in industrial control interfaces requiring deterministic timing and low-power reconfigurable logic.
For engineers reviewing the XC6SLX9-3FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank configuration, speed grade compatibility, DCI support, and thermal performance in convection-cooled enclosures.
Technical Context
The XC6SLX9-3FTG256I implements a hierarchical FPGA architecture with six-input LUTs, dedicated carry logic, and integrated DSP48A1 slices for arithmetic acceleration. It supports SelectIO technology with programmable drive strength, slew rate, and on-chip termination (DCI) across all I/O banks.
Configuration is performed via Master SPI or JTAG, with support for fallback and multi-boot through external serial flash. The device includes internal oscillator, power-on reset circuitry, and brown-out detection for robust system initialization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - total configurable logic resources for implementing state machines, glue logic, or protocol bridges |
| Block RAM | 576 Kbits - distributed across 24 x 18-Kbit blocks for FIFOs, buffers, or lookup tables |
| I/O Banks | 18 - independent voltage domains enabling mixed-voltage interface design (e.g., 3.3 V I/O with 1.2 V core) |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz for critical paths in worst-case industrial temperature conditions |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC-DC supply; impacts dynamic power and thermal dissipation |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without forced cooling |
Pinout & Package
Package: 256-ball FTBGA (Fine-Pitch Ball Grid Array), 17 mm × 17 mm, 1.0 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank 0 Supply | Configures voltage level for Bank 0 I/Os (e.g., 3.3 V or 2.5 V); must match connected peripheral interface |
| VCCAUX | Auxiliary Supply | Provides 2.5 V to configuration circuitry, JTAG, and certain I/O features; decoupling critical for reliability |
| GND | Ground Reference | Multiple dedicated balls per bank; required for signal integrity and EMI control in high-speed I/O layouts |
| PROGRAM_B | Active-Low Init | Asynchronous reset that clears configuration memory; pulled high externally to enable automatic startup |
| DONE | Configuration Status | Open-drain output indicating successful bitstream load; used for system readiness signaling |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO Technology | Supports 18 I/O standards including LVCMOS, SSTL, HSTL, and differential signaling (LVDS, TMDS) with programmable drive/slew/termination |
| DCI (Digitally Controlled Impedance) | On-die series/parallel termination eliminates external resistors for impedance-matched traces, reducing BOM count and layout area |
| DSP48A1 Slices | 16 dedicated arithmetic units enabling 18×18 multiply-accumulate operations per slice - suitable for FIR filters and motor control loops |
| Multi-Boot Configuration | Allows two independent bitstreams stored in external flash; enables field-upgradable firmware and fail-safe recovery without hardware change |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) Pattern Generator |
|---|---|
Use Scenario: Real-time digital I/O expansion with synchronized sampling and isolation. IC Role / Device Role / Timing Role: Configurable logic fabric handles parallel-to-serial conversion, timing calibration, and watchdog supervision. Use Value: Enables <1 µs input-to-output latency with deterministic jitter under 100 ps, meeting IEC 61131-3 cycle-time requirements. | Use Scenario: High-speed digital stimulus generation for IC functional validation. IC Role / Device Role / Timing Role: Generates precise multi-channel test vectors with sub-cycle phase alignment and pattern sequencing. Use Value: Delivers 200+ MHz vector rates using built-in DDR I/O and clock doubling, eliminating external pattern memory bottlenecks. |
| Medical Imaging Front-End Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of sensor data from ultrasound transducer arrays. IC Role / Device Role / Timing Role: Implements time-gated echo sampling, beamforming coefficient loading, and LVDS deserialization. Use Value: Supports 16-channel LVDS input at 1 Gbps per lane with embedded clock recovery, reducing interconnect complexity vs. ASIC solutions. | Use Scenario: Consolidation of ARINC 429, discrete I/O, and CAN FD signals into a unified avionics bus interface. IC Role / Device Role / Timing Role: Performs protocol translation, timestamping, and fault-isolated channel routing. Use Value: Meets DO-254 DAL C requirements via traceable RTL and dual-lockstep monitoring capability in user logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2FTG256I | Slower speed grade (-2) with reduced maximum clock frequency (400 MHz vs. 500 MHz) and lower static power consumption | Suitable for cost-sensitive designs where timing margin is relaxed and ambient temperature remains below +85°C | Select when full -3 timing headroom is unnecessary and BOM cost reduction is prioritized over worst-case performance |
| XC6SLX16-3CSG324C | Larger logic capacity (14,579 LUTs), 324-pin CSBGA package, higher I/O count (200 vs. 186), and additional DSP slices | Required for designs scaling beyond 9K LUTs or needing >186 user I/Os; larger footprint and thermal envelope | Choose when expanding functionality beyond XC6SLX9-3FTG256I limits while retaining Spartan-6 toolchain and IP compatibility |
Compared with XC6SLX9-2FTG256I, the XC6SLX9-3FTG256I delivers higher timing margin for industrial temperature operation; compared with XC6SLX16-3CSG324C, it offers smaller footprint and lower power at the expense of logic and I/O scalability.
Availability
XC6SLX9-3FTG256I is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics equipment, and avionics subsystems requiring stable component supply across long production lifecycles.
Supply support for XC6SLX9-3FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous compute acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring low-power reconfigurable logic, embedded processing, and flexible I/O interfacing - especially in industrial, automotive, and communications infrastructure.
FAQ
What is the maximum operating junction temperature for XC6SLX9-3FTG256I?
The XC6SLX9-3FTG256I has a maximum junction temperature of +125°C. This rating supports reliable operation in extended industrial environments when paired with appropriate PCB thermal vias and copper pour. Thermal derating begins above +100°C ambient, and the device's thermal resistance (θJA) is 29.5°C/W in standard 4-layer board conditions. Always verify thermal performance using Xilinx XPE tools with your specific layout and airflow profile for XC6SLX9-3FTG256I.
Does XC6SLX9-3FTG256I support JTAG boundary-scan testing?
Yes, XC6SLX9-3FTG256I fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. The TAP controller is compliant with Xilinx BSCAN primitives and integrates with iMPACT and Vivado Hardware Manager. All I/O pins, configuration pins, and internal logic states are accessible via standard JTAG instructions - essential for production test coverage and debug of XC6SLX9-3FTG256I-based assemblies.
Can XC6SLX9-3FTG256I be configured using SPI flash memory?
Yes, XC6SLX9-3FTG256I supports Master SPI configuration mode using industry-standard serial NOR flash devices (e.g., Micron, Winbond, Macronix). It boots directly from 4-wire SPI flash with auto-detection of density and page size. Configuration bitstream compression reduces flash footprint by ~30%, and dual-flash support enables failover and field updates - key capabilities for secure, maintainable XC6SLX9-3FTG256I deployments.
What I/O standards are supported by XC6SLX9-3FTG256I in Bank 16?
XC6SLX9-3FTG256I Bank 16 supports LVCMOS33, LVCMOS25, LVCMOS18, LVTTL, PCI, and HSTL_I. It does not support differential standards or SSTL in this bank. Voltage range is fixed at 3.3 V for Bank 16, and DCI is unavailable. These constraints require careful I/O planning when interfacing with memory or legacy peripherals - always validate against the XC6SLX9-3FTG256I SelectIO Resources User Guide.
Is XC6SLX9-3FTG256I compatible with Vivado Design Suite?
No, XC6SLX9-3FTG256I is not supported in Vivado Design Suite. It requires Xilinx ISE Design Suite 14.7 (final release) for synthesis, implementation, and bitstream generation. While newer tools like Vitis can co-develop software for MicroBlaze soft cores targeting XC6SLX9-3FTG256I, HDL flow remains locked to ISE. Migration paths exist but require architectural changes - confirm toolchain compatibility before initiating new XC6SLX9-3FTG256I projects.
XC6SLX9-3FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX9-3FTG256I FAQ
1.How can I place an order for XC6SLX9-3FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-3FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-3FTG256I reliable?
The price and inventory of XC6SLX9-3FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-3FTG256I is usually 5 days.
3.What payment methods are accepted for XC6SLX9-3FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-3FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-3FTG256I?
XC6SLX9-3FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-3FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-3FTG256I?
For technical support, including XC6SLX9-3FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-3FTG256I requirements.
6.How does Aetrix verify that XC6SLX9-3FTG256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-3FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-3FTG256I meets industry standards.
7.What is the process for return or replacement of XC6SLX9-3FTG256I?
All XC6SLX9-3FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-3FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-3FTG256I part is unused and in its original packaging.
Return procedure for XC6SLX9-3FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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