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AMD XC6SLX9-3TQG144I
- Part No.:
- XC6SLX9-3TQG144I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC6SLX9-3TQG144I.pdf
- Description:
- IC FPGA 102 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:917
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Product details
Overview
XC6SLX9-3TQG144I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 18 I/O banks supporting LVCMOS/LVTTL/SSTL standards. It operates at -3 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) and targets low-cost embedded control and interface bridging applications.
For engineers reviewing the XC6SLX9-3TQG144I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility, embedded DSP48A1 slices for arithmetic acceleration, and support for SPI/BPI configuration modes in space-constrained industrial designs.
Technical Context
The XC6SLX9-3TQG144I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry chains. It integrates six Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and frequency multiplication up to 333 MHz.
It supports SelectIO™ technology with programmable drive strength (2–24 mA), slew rate control, and on-chip termination (up to 150 Ω). Configuration is performed via Master Serial (SPI flash) or JTAG, with dual-boot capability enabled through external M[1:0] pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - provides gate count equivalent to ~100K ASIC gates for moderate-complexity control logic |
| Block RAM | 576 Kbits - supports dual-port FIFOs, lookup tables, or small buffer memory without external SRAM |
| DSP Slices | 16 × DSP48A1 - enables 18×18-bit signed multiplication or pipelined MAC operations per slice |
| I/O Banks | 18 - allows mixed-voltage operation across banks (1.2/1.5/1.8/2.5/3.3 V) |
| Max I/O Count | 102 - usable user I/O pins in TQG144 package with bank-specific voltage constraints |
| DCM Units | 6 - delivers jitter-tolerant clock management including duty cycle correction and phase alignment |
| Configuration Mode | Master Serial (SPI), JTAG, Slave SelectMAP - enables field-upgradable firmware via SPI flash |
Pinout & Package
TQG144 is a 144-pin Thin Quad Flatpack (TQFP) with 0.5 mm pitch, 20×20 mm body, and exposed thermal pad. Package meets JEDEC MO-220 standard and supports reflow soldering per IPC/JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be set to match connected peripheral voltage (e.g., 3.3 V for UART) |
| K1 | GND | Ground reference for adjacent I/O and internal logic - requires local decoupling near pin |
| M1 | VCCINT | 1.2 V core supply - routed separately from I/O rails with ≥10 µF bulk + 100 nF ceramic decoupling |
| P1 | PROGRAM_B | Active-low asynchronous reset - pulls device into configuration mode when asserted |
| R1 | CCLK | Configuration clock input - driven by SPI flash during Master Serial mode |
| T1 | DONE | Open-drain status output - goes high after successful configuration and release of INIT_B |
Key Features
| Feature | Design Value |
|---|---|
| Low-power 45 nm process | Reduces static current to ≤50 µA in suspend mode - extends battery life in portable instrumentation |
| SelectIO™ technology | Enables per-pin I/O standard assignment - simplifies interface to legacy parallel buses and modern sensors |
| Dual-boot configuration | Allows safe firmware updates using M[1:0] pin-controlled boot source selection - no risk of bricking |
| Embedded DCMs | Eliminates need for external clock synthesizers in motor control timing loops - saves board area and BOM cost |
| ISE Design Suite support | Provides full synthesis, place-and-route, and bitstream generation flow - compatible with legacy industrial toolchains |
Applications
| Industrial PLC I/O Module | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Real-time digital input sampling and relay output control in DIN-rail mounted controllers. IC Role / Device Role / Timing Role: FPGA fabric implements deterministic state machines and GPIO expansion with sub-microsecond response latency. Use Value: 102 I/O pins enable direct connection to 24 V DC sensors and 2 A relays without level-shifter ICs. | Use Scenario: Protocol translation between CAN FD vehicle networks and USB/UART host tools. IC Role / Device Role / Timing Role: XC6SLX9-3TQG144I acts as a bridge controller with dual-clock domain crossing for CAN and host interfaces. Use Value: Six DCMs allow independent 40 MHz CAN timing and 12 MHz USB clock domains with zero external oscillators. |
| Medical Sensor Hub | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of analog sensor data from ECG, SpO₂, and temperature modules. IC Role / Device Role / Timing Role: Configurable logic routes ADC streams to on-chip block RAM for buffering before ARM Cortex-M host readout. Use Value: 576 Kbits block RAM eliminates need for external FIFO, reducing PCB layer count in compact wearable form factor. | Use Scenario: Consolidating ARINC 429 and discrete discrete signal inputs in line-replaceable units (LRUs). IC Role / Device Role / Timing Role: XC6SLX9-3TQG144I implements ARINC 429 transceivers and discrete monitoring logic in single chip. Use Value: Industrial temperature rating (-40°C to +100°C) ensures reliable operation in uncooled avionics bays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-3CSG324I | 14,579 logic cells, 324-pin CSP package, higher I/O count (200), larger block RAM (900 Kbits) | Suitable for multi-protocol gateway designs requiring additional Ethernet MAC or PCIe endpoint logic | Select when design scales beyond XC6SLX9-3TQG144I capacity but retains Spartan-6 toolchain compatibility |
| LFE5U-25F-8MG285C | 25K LUTs, 1.2 V core, 285-pin CABGA, supports embedded SERDES and DDR3 PHY | Better suited for high-speed serial interface consolidation where PCI Express or USB 3.0 bridging is required | Choose for new designs needing higher bandwidth; requires migrating from ISE to Lattice Diamond toolset |
Compared with XC6SLX9-3TQG144I, the XC6SLX16-3CSG324I offers scalable logic density within the same family and toolflow, while the LFE5U-25F-8MG285C introduces SERDES and DDR PHY support at the cost of ecosystem migration - both serve distinct upgrade paths rather than drop-in replacements.
Availability
XC6SLX9-3TQG144I is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics, and avionics subsystems requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX9-3TQG144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software-defined hardware solutions.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring low power, flexible I/O, and long-term availability - especially in industrial control and embedded vision systems.
FAQ
What is the maximum operating frequency of the XC6SLX9-3TQG144I?
The XC6SLX9-3TQG144I is rated for a maximum system clock frequency of 333 MHz when using its internal Digital Clock Managers (DCMs). This applies to internally generated clocks; actual achievable frequency depends on design routing, logic depth, and I/O timing constraints. The -3 speed grade guarantees timing closure at this rate under industrial temperature conditions. XC6SLX9-3TQG144I supports multiple clock domains simultaneously via its six independent DCMs.
Does the XC6SLX9-3TQG144I support JTAG boundary-scan testing?
Yes, the XC6SLX9-3TQG144I fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. Pins TCK, TMS, TDI, and TDO are dedicated to this function and operate at 3.3 V. JTAG mode is active upon power-up before configuration and remains accessible post-configuration for debugging. XC6SLX9-3TQG144I also supports partial reconfiguration via JTAG when enabled in the bitstream.
Can the XC6SLX9-3TQG144I be configured using SPI flash memory?
Yes, the XC6SLX9-3TQG144I supports Master Serial configuration mode using standard SPI flash devices (e.g., Micron MT25QL, Winbond W25Q series). The CCLK pin drives the flash clock, and data is loaded on the D0 pin. Configuration bitstream size is approximately 2.1 MB for full utilization. XC6SLX9-3TQG144I automatically detects SPI flash presence and initiates loading upon PROGRAM_B deassertion.
What I/O standards are supported by the XC6SLX9-3TQG144I?
The XC6SLX9-3TQG144I supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS and TMDS across its 18 I/O banks. Each bank is independently powered (VCCO), enabling mixed-voltage operation - for example, Bank 0 at 3.3 V for legacy peripherals and Bank 14 at 1.8 V for DDR2 memory. XC6SLX9-3TQG144I does not support true PCI or PCI Express signaling natively.
Is the XC6SLX9-3TQG144I qualified for automotive applications?
No, the XC6SLX9-3TQG144I carries an industrial temperature rating (-40°C to +100°C) but is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure rate reporting, and PPAP documentation. While used in some non-safety-critical automotive diagnostic tools, XC6SLX9-3TQG144I is not approved for ADAS, powertrain, or infotainment systems requiring automotive qualification. For such use cases, AMD's Zynq-7000 or Versal families are recommended.
XC6SLX9-3TQG144I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 102
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC6SLX9-3TQG144I FAQ
1.How can I place an order for XC6SLX9-3TQG144I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-3TQG144I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-3TQG144I reliable?
The price and inventory of XC6SLX9-3TQG144I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-3TQG144I is usually 5 days.
3.What payment methods are accepted for XC6SLX9-3TQG144I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-3TQG144I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-3TQG144I?
XC6SLX9-3TQG144I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-3TQG144I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-3TQG144I?
For technical support, including XC6SLX9-3TQG144I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-3TQG144I requirements.
6.How does Aetrix verify that XC6SLX9-3TQG144I is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-3TQG144I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-3TQG144I meets industry standards.
7.What is the process for return or replacement of XC6SLX9-3TQG144I?
All XC6SLX9-3TQG144I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-3TQG144I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-3TQG144I part is unused and in its original packaging.
Return procedure for XC6SLX9-3TQG144I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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