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AMD XC6SLX9-L1CSG225C
- Part No.:
- XC6SLX9-L1CSG225C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 225-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX9-L1CSG225C.pdf
- Description:
- IC FPGA 160 I/O 225CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,506
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Product details
Overview
XC6SLX9-L1CSG225C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 9,152 logic cells, 576 Kbits of block RAM, and 225-ball CSBGA package rated for commercial temperature range (0°C to 85°C). It integrates dual 18 × 18 multipliers, six digital clock managers (DCMs), and supports LVDS, SSTL, and HSTL I/O standards.
For engineers reviewing the XC6SLX9-L1CSG225C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility (1.2 V to 3.3 V), DCM-based clock synthesis, and support for embedded memory interfaces in cost-sensitive industrial control and communications edge devices.
Technical Context
The XC6SLX9-L1CSG225C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It features six DCMs providing phase shifting, frequency synthesis, and duty cycle correction without external components.
I/O banks are independently configurable for voltage levels (1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) and support single-ended and differential signaling standards including LVDS, TMDS, and RSDS. Configuration is performed via SPI, SelectMAP, or JTAG interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - provides gate count equivalent to ~14,000 ASIC gates for combinational and sequential logic implementation |
| Block RAM | 576 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| Digital Clock Managers | 6 DCMs - deliver jitter-reduced clock outputs, internal feedback, and dynamic phase alignment |
| I/O Standards | LVDS, SSTL-2/3, HSTL-I/II, PCI, LVTTL - supports interface to DDR2 SDRAM, video serializers, and legacy peripherals |
| Max I/O Pins | 186 - usable user I/Os in CSBGA-225 package with bank-specific voltage assignment |
| Configuration Mode | Master SPI, Slave SPI, SelectMAP, JTAG - allows flexible boot sources and field reconfiguration |
Pinout & Package
XC6SLX9-L1CSG225C uses a 225-ball fine-pitch CSP (Chip Scale Ball Grid Array) package with 1.0 mm ball pitch, 15 × 15 array, and thermal pad exposed on underside for enhanced heat dissipation in compact PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Power | Supplies output driver voltage for Bank 0; sets I/O standard voltage level (1.2–3.3 V) |
| VCCAUX | Auxiliary Supply | Provides 2.5 V to configuration circuitry, DCMs, and internal PLL-like functions |
| GND | Ground Reference | Common return path for all I/O and core logic; multiple balls ensure low-inductance grounding |
| M0–M2 | Mode Select | Configure startup mode (SPI, SelectMAP, JTAG) at power-on reset |
| CCLK | Configuration Clock | Drives internal configuration logic during master SPI or SelectMAP programming |
| DONE | Configuration Status | Open-drain output signals successful configuration completion; used for system readiness handshake |
Key Features
| Feature | Design Value |
|---|---|
| Low-power 45 nm process | Reduces static and dynamic power consumption versus prior 65 nm FPGAs, enabling fanless operation in space-constrained systems |
| Dual 18 × 18 multipliers | Enables real-time arithmetic for motor control algorithms or basic DSP filtering without external coprocessors |
| Embedded Block RAM | Supports synchronous dual-port access for ping-pong buffering in video frame capture or protocol bridging applications |
| Multi-voltage I/O banks | Allows direct interfacing to mixed-voltage peripherals (e.g., 3.3 V sensors + 1.8 V memory) without level shifters |
| Integrated DCMs | Eliminates need for external clock synthesizers or jitter cleaners in timing-critical serial link receivers |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion with deterministic scan cycles in factory automation controllers. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines and parallel I/O register mapping; DCMs generate synchronized strobes for input sampling and output latching. Use Value: Enables <1 µs I/O response latency and seamless integration with Modbus RTU or EtherCAT slave stacks using on-chip logic resources. | Use Scenario: Converting parallel RGB/YUV video from image sensors to serialized LVDS or OpenLDI streams for display panels. IC Role / Device Role / Timing Role: Configurable I/O banks drive differential LVDS transmitters; block RAM buffers pixel lines to absorb timing skew between sensor and display clocks. Use Value: Supports up to 1080p60 video bridging with no external memory, reducing BOM count and board area in medical imaging or kiosk displays. |
| Communications Edge Router | Test Equipment Pattern Generator |
Use Scenario: Protocol offload and packet classification in low-throughput enterprise branch routers. IC Role / Device Role / Timing Role: Implements TCAM-like matching logic using distributed RAM and fast carry chains; DCMs align internal processing clocks with incoming Ethernet PHY timing. Use Value: Delivers 100 Kpps packet inspection throughput while maintaining under 5 µs latency per decision path. | Use Scenario: Generating high-fidelity digital stimulus waveforms for IC functional validation. IC Role / Device Role / Timing Role: Uses block RAM as waveform lookup table and CLBs as programmable sequencer; DCMs synthesize precise sample clocks up to 200 MHz. Use Value: Achieves sub-nanosecond timing resolution and glitch-free transitions across 16-bit parallel output channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2CSG225C | Higher speed grade (-2 vs -1); supports 333 MHz DCM output and 100 MHz system clock in worst-case conditions | Suitable for designs requiring tighter timing closure or higher-frequency I/O interfaces (e.g., DDR2 @ 200 MHz) | Select if timing margin is critical and design operates near maximum frequency limits of the -1 grade |
| XC6SLX16-L1CSG324C | Larger logic capacity (14,579 CLBs), more block RAM (900 Kbits), and additional I/O (240 pins) in larger 324-ball package | Better suited for complex protocol stacks or multi-interface consolidation where XC6SLX9-L1CSG225C resource limits are exceeded | Choose when scaling beyond 9K logic cells or needing >186 I/Os while retaining Spartan-6 toolchain compatibility |
Compared with XC6SLX9-L1CSG225C, the -2 speed grade offers improved timing margin for high-frequency operation, while the XC6SLX16-L1CSG324C delivers scalable logic and I/O headroom-both retain identical configuration flow, DCM architecture, and I/O electrical characteristics within their respective packages.
Availability
XC6SLX9-L1CSG225C is available at Aetrix Electronics and suitable for industrial control, video interface bridge, and communications edge router applications requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX9-L1CSG225C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Spartan-6 family, including XC6SLX9-L1CSG225C, was designed for cost-optimized, low-power logic integration in industrial, automotive, and communications edge applications with predictable timing and mature toolchain support.
FAQ
What is the maximum operating frequency of the XC6SLX9-L1CSG225C?
The XC6SLX9-L1CSG225C has a -1 speed grade, supporting a maximum system clock frequency of 80 MHz under worst-case commercial conditions. Its DCMs can generate output clocks up to 333 MHz, but actual achievable frequency depends on design routing, logic depth, and I/O constraints. The XC6SLX9-L1CSG225C datasheet specifies timing parameters for CLB paths, block RAM, and I/O registers under defined voltage and temperature conditions.
Does the XC6SLX9-L1CSG225C support DDR2 memory interfaces?
Yes, the XC6SLX9-L1CSG225C supports DDR2 SDRAM interfaces through its I/O banks configured for SSTL-18 standards and dedicated DCM-based clocking. It provides source-synchronous timing control and phase-aligned capture clocks. The XC6SLX9-L1CSG225C reference designs include verified DDR2 controller IP targeting 200 MHz data rates with appropriate PCB layout guidelines.
What configuration modes does the XC6SLX9-L1CSG225C support?
The XC6SLX9-L1CSG225C supports four primary configuration modes: Master SPI (internal oscillator drives serial flash), Slave SPI (external controller initiates load), SelectMAP (parallel host processor loads bitstream), and JTAG (boundary-scan programming and debugging). All modes are accessible via dedicated pins (M0–M2, CCLK, DIN/DOUT, TCK/TMS/TDI/TDO) and are mutually exclusive at power-up based on mode pin states.
Is the XC6SLX9-L1CSG225C RoHS compliant and lead-free?
Yes, the XC6SLX9-L1CSG225C is RoHS compliant and manufactured with lead-free solderable terminations. The "C" suffix in the part number denotes commercial temperature grade and RoHS-compliant packaging. The CSBGA-225 package uses matte tin surface finish and meets JEDEC J-STD-020 moisture sensitivity level 3 requirements.
Can the XC6SLX9-L1CSG225C be reprogrammed in-system?
Yes, the XC6SLX9-L1CSG225C supports in-system programming (ISP) via JTAG or SPI interfaces. Its configuration memory is SRAM-based and volatile, requiring bitstream reload at power-up, but the device accepts new configuration data dynamically during operation using partial reconfiguration or full reconfiguration methods supported by Xilinx ISE or Vivado tools. This capability is integral to the XC6SLX9-L1CSG225C architecture.
XC6SLX9-L1CSG225C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 225-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 160
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 225-CSPBGA (13x13)
XC6SLX9-L1CSG225C FAQ
1.How can I place an order for XC6SLX9-L1CSG225C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-L1CSG225C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-L1CSG225C reliable?
The price and inventory of XC6SLX9-L1CSG225C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-L1CSG225C is usually 5 days.
3.What payment methods are accepted for XC6SLX9-L1CSG225C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-L1CSG225C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-L1CSG225C?
XC6SLX9-L1CSG225C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-L1CSG225C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-L1CSG225C?
For technical support, including XC6SLX9-L1CSG225C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-L1CSG225C requirements.
6.How does Aetrix verify that XC6SLX9-L1CSG225C is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-L1CSG225C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-L1CSG225C meets industry standards.
7.What is the process for return or replacement of XC6SLX9-L1CSG225C?
All XC6SLX9-L1CSG225C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-L1CSG225C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-L1CSG225C part is unused and in its original packaging.
Return procedure for XC6SLX9-L1CSG225C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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