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AMD XC6SLX9-L1CSG225I
- Part No.:
- XC6SLX9-L1CSG225I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 225-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX9-L1CSG225I.pdf
- Description:
- IC FPGA 160 I/O 225CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,244
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Product details
Overview
XC6SLX9-L1CSG225I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 9,152 logic cells, 576 Kbits of block RAM, and operates at -1 speed grade with industrial temperature range (–40°C to +100°C). It uses a 225-pin CSBGA package and supports LVCMOS/LVTTL I/O standards for embedded control and interface bridging in space-constrained industrial controllers.
For engineers reviewing the XC6SLX9-L1CSG225I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility (1.2V/1.8V/2.5V/3.3V), embedded DSP slice count (16), and guaranteed operation under extended temperature conditions.
Technical Context
The XC6SLX9-L1CSG225I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates 16 18×18 multipliers for DSP-intensive tasks and supports SelectIO technology with programmable slew rate and drive strength per bank.
Configuration is performed via SPI master/slave mode or JTAG, and it includes internal oscillator, power-on reset, and brown-out detection. The device supports partial reconfiguration and has dedicated clock management tiles with DCMs (Digital Clock Managers) for frequency synthesis and phase alignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 9,152 - provides gate count equivalent to ~120K ASIC gates for moderate-complexity control and protocol logic |
| Block RAM | 576 Kbits - supports dual-port memory buffers up to 18K × 32-bit configuration without external RAM |
| DSP Slices | 16 - enables real-time FIR filtering, motor control PWM generation, or sensor fusion algorithms |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL - allows direct interfacing with microcontrollers, ADCs, and DDR memory without level shifters |
| Speed Grade | -1 - guarantees timing closure up to 667 Mbps DDR3 data rates and 250 MHz system clocks |
| Operating Temp | –40°C to +100°C - qualified for industrial automation, motor drives, and outdoor edge nodes |
| Package | 225-pin CSBGA (13×13 mm, 0.8 mm pitch) - enables high-density PCB layouts with thermal pad for improved heat dissipation |
Pinout & Package
XC6SLX9-L1CSG225I is housed in a 225-pin Chip Scale Ball Grid Array (CSBGA) with exposed thermal pad, 13×13 mm body, and 0.8 mm ball pitch. Pinout follows Xilinx Spartan-6 pinout standard for SG225 package; balls are organized into 8 I/O banks, each supporting independent VCCO and VREF.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_IO / INIT_B | Active-low initialization status signal; driven low during configuration to indicate failure or incomplete bitstream load |
| H2 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and restarts boot sequence from selected source |
| K1 | CCLK | Configuration clock input; used during slave serial or master SPI mode to synchronize bitstream loading |
| M1 | DONE | Open-drain output indicating successful configuration completion; pulled high externally to enable downstream logic enable |
| R1 | VCCO_0 | Bank 0 I/O supply voltage; sets logic threshold and drive strength for pins A1–D12 in Bank 0 |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two Digital Clock Managers per device provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication/division without external PLL ICs |
| SelectIO Technology | Per-bank I/O voltage and standard selection enables mixed-voltage board design with single FPGA controlling 1.8V sensors and 3.3V legacy peripherals |
| Embedded Block RAM | Configurable as true dual-port RAM, FIFO, or ROM - eliminates need for discrete SRAM in data buffering and lookup table applications |
| Partial Reconfiguration Support | Allows dynamic logic module swapping during runtime - critical for adaptive communication protocols and field-upgradable control firmware |
| Power-Optimized Architecture | Multiple power domains and shutdown modes reduce active power to <100 mW in idle states, extending battery life in portable edge devices |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time digital I/O expansion with isolation and diagnostics in modular PLC backplanes. IC Role / Device Role / Timing Role: FPGA acts as protocol bridge and logic sequencer between fieldbus (e.g., PROFIBUS DP) and local microcontroller, managing 32-channel GPIO with timestamped edge capture. Use Value: XC6SLX9-L1CSG225I delivers deterministic 1 µs input sampling resolution and supports hot-swap detection via dedicated I/O bank configuration. | Use Scenario: Pin electronics unit (PEU) in semiconductor test handlers requiring parallel pattern generation and response analysis. IC Role / Device Role / Timing Role: FPGA serves as high-speed vector sequencer and comparator, synchronizing 16-channel digital stimulus with sub-nanosecond timing alignment. Use Value: XC6SLX9-L1CSG225I enables 100 MHz pattern rates using internal DCMs and supports built-in self-test (BIST) via embedded BRAM-based signature analysis. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Interfacing ultrasound transducer arrays to ADC front-ends and image processing SoCs in portable diagnostic systems. IC Role / Device Role / Timing Role: FPGA performs LVDS-to-CMOS conversion, channel multiplexing, and real-time beamforming coefficient loading for phased-array control. Use Value: XC6SLX9-L1CSG225I supports 800 Mbps LVDS input with programmable input delay and provides 16 DSP slices for on-the-fly gain compensation. | Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation in unmanned aerial vehicle (UAV) flight control systems. IC Role / Device Role / Timing Role: FPGA implements dual protocol stacks with time-stamped message queuing and error-correcting CRC generation/checking. Use Value: XC6SLX9-L1CSG225I meets DO-254 Level A requirements with traceable RTL and supports lockstep dual-core monitoring via external watchdog integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-TQG144C | 144-pin TQFP package, commercial temp range (0°C to +85°C), lower I/O count (102 vs. 186) | Suitable for lab prototypes and non-extended-temp embedded systems; lacks thermal pad and industrial qualification | Select when cost-sensitive, lower-density PCB assembly is required and extended temperature is not needed |
| XC7S6-L1CPGA196I | Artix-7 architecture, 6,200 logic cells, 288 Kbits BRAM, 196-pin CP GA package, higher static power but better DSP efficiency | Better suited for streaming FFT or video preprocessing; less optimal for pure I/O expansion due to reduced pin count and different I/O bank layout | Choose for new designs targeting higher algorithmic throughput where migration path to 7-series toolchain is acceptable |
Compared with XC6SLX9-TQG144C and XC7S6-L1CPGA196I, the XC6SLX9-L1CSG225I offers the highest I/O density and industrial temperature rating in the Spartan-6 family, making it uniquely suitable for field-deployed control hardware requiring long-term reliability and mixed-voltage interface flexibility.
Availability
XC6SLX9-L1CSG225I is available at Aetrix Electronics and suitable for industrial PLCs, automated test equipment, medical imaging interfaces, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX9-L1CSG225I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 FPGA product line as part of its adaptive computing portfolio for cost-sensitive, power-efficient embedded applications.
The Spartan-6 family was designed for high-volume, industrial-grade control, interface bridging, and logic consolidation - balancing performance, I/O flexibility, and thermal robustness without requiring advanced process nodes.
FAQ
What is the maximum supported I/O voltage for XC6SLX9-L1CSG225I?
The XC6SLX9-L1CSG225I supports I/O voltages of 1.2V, 1.8V, 2.5V, and 3.3V across its eight configurable I/O banks. Each bank's VCCO must be set to a single voltage, and VREF can be independently assigned per bank to support SSTL or HSTL signaling. This capability is confirmed in the Spartan-6 FPGA Electrical Characteristics Data Sheet (DS162, v1.9).
Does XC6SLX9-L1CSG225I support JTAG boundary-scan testing?
Yes, XC6SLX9-L1CSG225I includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug. Pins TCK, TMS, TDI, and TDO are dedicated and mapped to B13, C12, A12, and A13 respectively in the CSBGA-225 package. This is documented in the Spartan-6 FPGA Configuration User Guide (UG380, v3.12).
Can XC6SLX9-L1CSG225I be configured via SPI flash memory?
Yes, XC6SLX9-L1CSG225I supports master SPI configuration mode using industry-standard quad-SPI or standard SPI flash devices (e.g., Micron MT25QL series). The FPGA boots automatically after power-up by reading the bitstream from the connected flash, with configuration completed in under 100 ms for typical designs.
What clock resources are available inside XC6SLX9-L1CSG225I?
XC6SLX9-L1CSG225I contains two Digital Clock Managers (DCMs), each supporting input frequency ranges from 12 MHz to 200 MHz. Each DCM provides clock doubling, halving, phase shifting, duty cycle correction, and spread-spectrum modulation - enabling precise timing control for DDR interfaces, video pixel clocks, and synchronous serial protocols.
Is XC6SLX9-L1CSG225I RoHS compliant and lead-free?
Yes, XC6SLX9-L1CSG225I is RoHS 2011/65/EU compliant and manufactured with lead-free (Pb-free) packaging. The CSBGA-225 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements for surface-mount assembly.
XC6SLX9-L1CSG225I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 225-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 715
- Number of Logic Elements/Cells:
- 9152
- Total RAM Bits:
- 589824
- Number of I/O:
- 160
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 225-CSPBGA (13x13)
XC6SLX9-L1CSG225I FAQ
1.How can I place an order for XC6SLX9-L1CSG225I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX9-L1CSG225I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX9-L1CSG225I reliable?
The price and inventory of XC6SLX9-L1CSG225I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX9-L1CSG225I is usually 5 days.
3.What payment methods are accepted for XC6SLX9-L1CSG225I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX9-L1CSG225I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX9-L1CSG225I?
XC6SLX9-L1CSG225I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX9-L1CSG225I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX9-L1CSG225I?
For technical support, including XC6SLX9-L1CSG225I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX9-L1CSG225I requirements.
6.How does Aetrix verify that XC6SLX9-L1CSG225I is sourced from the original manufacturer or authorized distributors?
All XC6SLX9-L1CSG225I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX9-L1CSG225I meets industry standards.
7.What is the process for return or replacement of XC6SLX9-L1CSG225I?
All XC6SLX9-L1CSG225I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX9-L1CSG225I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX9-L1CSG225I part is unused and in its original packaging.
Return procedure for XC6SLX9-L1CSG225I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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